Abstract: A method of forming a silicon nitride film according to an aspect of the present disclosure forms a silicon nitride film in a recess formed in a surface of a substrate. The method includes a process of forming an adsorption-inhibiting region by exposing the substrate to plasma generated from an adsorption-inhibiting gas that contains a halogen gas and a non-halogen gas, a process of adsorbing a silicon-containing gas in a region other than the adsorption-inhibiting region, and a process of forming a silicon nitride film by exposing the substrate, on which the silicon-containing gas has been adsorbed, to plasma generated from a nitrogen-containing gas.

Abstract: Provided is a substrate holding device comprising: a holder that holds a substrate irradiated with an ion beam; and a driving device that rotates the holder around a predetermined axis to change an inclination of the held substrate with respect to the ion beam, wherein the driving device comprises: a power source that outputs power to rotate the holder; a reduction gear provided in the middle of a power transmission path from the power source to the holder; a first shaft member that rotates together with the holder by a power outputted from the reduction gear; a first detector that detects a rotational motion of the first shaft member; and a power control device that controls the power source based on a detection value of the first detector.

Abstract: A multilayer printed wiring board which comprises B layer laminated on one or both faces of A layer, wherein A layer is a layer constituted with one or more layers which comprise a resin composition comprising at least one resin selected from epoxy resins, phenolic resins, unsaturated polyester resins and polyimide resins of a bismaleimide type and B layer is a layer constituted with one or more layers which comprise a resin composition comprising 40% by weight or more of a styrenic resin having a syndiotactic configuration.

Abstract: Provided by the present invention is a mold release film for sealing a semiconductor element, which does not deform or cause deformation of the terminals of the semiconductor and which has good releasability during the semiconductor element sealing process, and a sealing method for a semiconductor element using the mold release film, which can improve efficiency of manufacturing a semiconductor.

Abstract: A plated molded article which comprises a molded article formed with a resin composition comprising specific relative amounts of (A) a styrenic polymer having a syndiotactic configuration and (B) at least one selected from the group consisting of (a) rubbery elastomers soluble in an oxidizing agent, (b) thermoplastic resins soluble in an oxidizing agent, and (c) inorganic compounds soluble in an oxidizing agent, and has been plated; and a process for producing the plated molded article. A plated molded article containing a styrenic polymer having a syndiotactic configuration which suppresses skipped plating and has a high adhesive strength of the plating film can efficiently be obtained with stability in an industrial process.

Abstract: A plated molded article which comprises a molded article formed with a resin composition comprising specific relative amounts of (A) a styrenic polymer having a syndiotactic configuration and (B) at least one selected from the group consisting of (a) rubbery elastomers soluble in an oxidizing agent, (b) thermoplastic resins soluble in an oxidizing agent, and (c) inorganic compounds soluble in an oxidizing agent, and has been plated; and a process for producing the plated molded article. A plated molded article containing a styrenic polymer having a syndiotactic configuration which suppresses skipped plating and has a high adhesive strength of the plating film can efficiently be obtained with stability in an industrial process.