Patents by Inventor Yusuke SAKITA

Yusuke SAKITA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289442
    Abstract: A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: March 29, 2022
    Assignee: Tanaka Denshi Kogyo K.K.
    Inventors: Yuki Antoku, Shota Kawano, Yusuke Sakita
  • Publication number: 20200350273
    Abstract: A gold-coated silver bonding wire includes: a core material containing silver as a main component; and a coating layer provided on a surface of the core material and containing gold as a main component. The gold-coated silver bonding wire contains gold in a range of not less than 2 mass % nor more than 7 mass %, and at least one sulfur group element selected from the group consisting of sulfur, selenium, and tellurium in a range of not less than 1 mass ppm nor more than 80 mass ppm, with respect to a total content of the bonding wire.
    Type: Application
    Filed: May 8, 2020
    Publication date: November 5, 2020
    Inventors: Yuki ANTOKU, Shota KAWANO, Yusuke SAKITA
  • Patent number: 10195697
    Abstract: A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 ?m, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: February 5, 2019
    Assignee: TANAKA DENSHI KOGYO K.K.
    Inventors: Hiroyuki Amano, Somei Yarita, Yusuke Sakita, Yuki Antoku, Wei Chen
  • Publication number: 20170125135
    Abstract: A noble metal-coated copper wire for ball bonding, with a wire diameter between 10 ?m or more, and 25 ?m or less, includes a core material having a copper alloy having a copper purity of 98 mass % or higher, and a noble metal-coating layer formed on the core material. The noble metal-coating layer includes a palladium cavitating layer containing palladium; at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed in the palladium; and a diffusion layer formed of copper diffused into the palladium. The noble metal-coating layer may include a palladium cavitating layer containing palladium, at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed therein, and a nickel intermediate layer disposed between the core material and the noble metal-coating layer.
    Type: Application
    Filed: October 28, 2016
    Publication date: May 4, 2017
    Inventors: Hiroyuki AMANO, Somei YARITA, Yusuke SAKITA, Yuki ANTOKU, Wei CHEN
  • Publication number: 20170057020
    Abstract: A palladium coated copper wire for ball bonding includes a core formed of pure copper or copper alloy having a purity of 98% by mass or more, and a palladium draw coated layer coated on the core. The copper wire has a diameter of 10 to 25 ?m, and the palladium drawn layer contains sulfur, phosphorus, boron or carbon.
    Type: Application
    Filed: August 26, 2016
    Publication date: March 2, 2017
    Inventors: Hiroyuki AMANO, Somei YARITA, Yusuke SAKITA, Yuki ANTOKU, Wei CHEN