Abstract: A semiconductor device includes a first insulated circuit board that is rectangular with first to fourth sides, including a first input wiring board and a first output wiring board each extending in a first direction parallel to the first side and being adjacent to each other. The first output wiring board includes a first output region electrically connected to a first output terminal and a first connection wiring region electrically connected to the output electrodes of the plurality of first semiconductor chips and being closer to the second side than is the first output region. The first connection wiring region has a first slit extending in the first direction from an end of the first connection wiring region at a side thereof where the first output region is located.

Abstract: A semiconductor device includes a semiconductor element, a laminated substrate including an insulating board and a circuit board disposed on the insulating board, the semiconductor element being mounted on the circuit board, a surrounding case having an opening, and being disposed on the outer peripheral portion of the insulating board to surround the circuit board, a relay substrate having a through hole and being disposed on the surrounding case to cover the opening, and an external connection terminal including a first end portion bonded to the circuit board, a second end portion, opposite to the first end portion, inserted into the through hole of the relay substrate from the rear surface of the relay substrate so as to be in contact with the front surface of the relay substrate, and an elastically deformable elastic portion between the first end portion and the second end portion.

Abstract: A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.

Abstract: A semiconductor device includes a semiconductor element, a laminated substrate including an insulating board and a circuit board disposed on the insulating board, the semiconductor element being mounted on the circuit board, a surrounding case having an opening, and being disposed on the outer peripheral portion of the insulating board to surround the circuit board, a relay substrate having a through hole and being disposed on the surrounding case to cover the opening, and an external connection terminal including a first end portion bonded to the circuit board, a second end portion, opposite to the first end portion, inserted into the through hole of the relay substrate from the rear surface of the relay substrate so as to be in contact with the front surface of the relay substrate, and an elastically deformable elastic portion between the first end portion and the second end portion.

Abstract: A semiconductor device includes a semiconductor module which has an external terminal protruding from one surface thereof; a printed circuit board which is electrically and mechanically connected to the external terminal of the semiconductor module; a heatsink which abuts against the other surface of the semiconductor module opposite to the one surface; and a joint member which serves as an elastic support column having a first head portion and a second head portion. The first head portion is shaped like a truncated cone and disposed at one end of the elastic support column, and the second head portion is disposed at the other end of the elastic support column. The semiconductor module, the printed circuit board and the heat sink are integrated by the first head portions and the second head portions.