Patents by Inventor Yusuke SHIMODA

Yusuke SHIMODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180243953
    Abstract: Provided is a resin-molding device 10 including: a first platen 11 and a second platen 12; a first molding die 161 to be attached to the first platen; a second molding die 162 to be attached to the second platen and arranged so as to face the first molding die; a die-clamping mechanism 133 for clamping the first and second molding dies together by decreasing the distance between the first and second platens, and for separating the first and molding dies from each other by increasing the distance between the first and second platens; and a flatness adjuster 14 including an adjustment member 141 for adjusting the parallelism between the die surface of the first molding die and that of the second molding die, or the flatness of a resin-molded product to be molded with the first and second molding dies.
    Type: Application
    Filed: February 2, 2018
    Publication date: August 30, 2018
    Applicant: TOWA CORPORATION
    Inventors: Yusuke SHIMODA, Noriyuki TAKAHASHI