Abstract: An optical scanning device, which is a MEMS element, includes a first insulating layer, a first semiconductor layer, a second insulating layer, and a second semiconductor layer that are laminated in this order, a first doped region formed at an interface between the first insulating layer and the first semiconductor layer, a second doped region formed at an interface between the first semiconductor layer and the second insulating layer, and a first wiring portion and a second wiring portion disposed on the first insulating layer apart from each other. The first doped region and the second doped region are electrically connected in parallel between the first wiring portion and the second wiring portion.

Abstract: An optical scanning device includes a first structure and a second structure. The first structure includes a support, a driver, a first columnar body, a driving section, and a pair of beams. The support includes a support body and a flat section. The pair of beams connects the driver and the flat section. The driving section includes a coil, a pair of electrode pads, and a magnet. The second structure is provided with a reflector.

Abstract: This bonded body (10) comprising a mosaic diamond wafer and a semiconductor of a different type is a bonded body in which a mosaic diamond wafer (1) having a coalescence boundary (B1) between a plurality of single-crystal diamond substrates (1A and 1B) and a semiconductor of a different type (2) are bonded together, in which a maximum level difference on a bonding surface (1aa) of the mosaic diamond wafer (1) with the semiconductor of a different type (2) is 10 nm or less.

Abstract: An optical scanning device includes a reflector as a MEMS mirror having a reflection surface of a metal film, a support body, a drive beam, and a drive unit. The support body is disposed to be spaced from the reflector so as to surround the reflector. The drive beam connects the reflector and the support body. A first protection film is formed all over opposite side surfaces including side wall surfaces of a second semiconductor layer, as well as an upper surface and a lower surface, in the drive beam. As the first protection film, a silicon oxide film, a silicon nitride film, an alumina film, or a titania film is formed by an atomic layer deposition method.

Abstract: An optical scanning device includes a first structure and a second structure. The first structure includes a support, a driver, a first columnar body, a driving section, and a pair of beams. The support includes a support body and a flat section. The pair of beams connects the driver and the flat section. The driving section includes a coil, a pair of electrode pads, and a magnet. The second structure is provided with a reflector.

Abstract: A manufacturing method for a solar cell includes a step of forming a p-type diffusion layer on one principal surface side of an n-type silicon substrate and forming an n-type silicon substrate having a pn junction, a step of forming a laminated film of a silicon oxide film and a silicon nitride film as a passivation film on a surface on a side of a light receiving surface that is an n type, a step of forming an open region in the passivation film, a step of diffusing n-type impurities with respect to the open region of the passivation film by using the passivation film as a mask to form a high-concentration diffusion region, and a step of forming a metal electrode selectively in the high-concentration diffusion region that is exposed in the open region of the passivation film.