Patents by Inventor Yusuke Taguchi
Yusuke Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12035461Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.Type: GrantFiled: March 8, 2023Date of Patent: July 9, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio Shiobara, Yusuke Taguchi, Ryunosuke Nomura
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Publication number: 20240175497Abstract: A valve device includes a cover and a valve. The cover is attached to be fixed to a mating part to which the cover is attached, and includes a cover top part and a leg part extending from an outer peripheral part of the cover top part toward a mating part side to be attached to the mating part at a distal end part in an extending direction, the leg part is one of a plurality of the leg parts that are intermittently disposed in a circumferential direction, and a release hole allowing a release of a fluid from an inside to an outside of the cover is disposed in each space between the leg parts that are adjacent to each other in the circumferential direction.Type: ApplicationFiled: November 22, 2023Publication date: May 30, 2024Inventors: Makoto KATO, Kiyohiro YOSHIHASHI, Junya UKAI, Tomotaka OSAKABE, Yusuke TAGUCHI, Junki SUGIMOTO, Shigeyuki INOUE
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Publication number: 20240140863Abstract: In a glass cloth made of glass filaments having a composition which is at least 50 wt % SiO2, the filaments have a diameter that is 0.5 ?m or more and less than 3.0 ?m. The glass cloth has a thickness of 15 ?m or less and a weight of from 0.3 to 10 g/m2.Type: ApplicationFiled: October 30, 2023Publication date: May 2, 2024Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Hajime ITOKAWA, Yusuke TAGUCHI, Ryunosuke NOMURA, Kazuaki URANAKA
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Patent number: 11974389Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.Type: GrantFiled: March 8, 2023Date of Patent: April 30, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio Shiobara, Yusuke Taguchi, Ryunosuke Nomura
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Patent number: 11920011Abstract: The present invention is a resin substrate including an organic resin and a quartz glass cloth, where the organic resin has a dielectric loss tangent of 0.0002 to 0.0020 measured at 10 GHz and a 40 GHz/10 GHz ratio is 0.4 to 0.9, the quartz glass cloth has a dielectric loss tangent of 0.0001 to 0.0015 measured at 10 GHz and a 40 GHz/10 GHz ratio is 1.2 to 2.0, and the resin substrate has a dielectric loss tangent of 0.0001 to 0.0020 at 10 GHz and a 40 GHz/10 GHz ratio is 0.8 to 1.2. This provides a resin substrate having a low dielectric loss tangent in a high-frequency region and dielectric characteristics with little frequency dependence.Type: GrantFiled: January 20, 2022Date of Patent: March 5, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio Shiobara, Yusuke Taguchi, Ryunosuke Nomura, Hajime Itokawa
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Patent number: 11802192Abstract: The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.Type: GrantFiled: June 14, 2021Date of Patent: October 31, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio Shiobara, Yusuke Taguchi, Hajime Itokawa
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Publication number: 20230290522Abstract: An information processing apparatus includes a memory and a processor, in which the memory stores address information representing an address of an institution that has received a prescription, and the processor is configured to, in a case where an abnormality is detected in biological information acquired from a patient, transmit identification information of the patient and information including the fact that the abnormality is detected in the biological information to the address represented by the address information.Type: ApplicationFiled: August 10, 2022Publication date: September 14, 2023Applicant: FUJIFILM Business Innovation Corp.Inventors: Ryo MATSUMOTO, Yusuke TAGUCHI, Satoshi MARUYAMA, Masaki WATANABE, Ayumi TSUJI
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Publication number: 20230280955Abstract: An image forming apparatus includes a processor configured to, in a case where a print instruction to form an image by plural image forming apparatuses is received from a terminal apparatus and a pre-confirmation image of a print result is requested and in a case where an image forming apparatus is not possible to execute a printing process according to setting content designated in the print instruction, generate a pre-confirmation image corresponding to an image, which is obtained in a case where the printing process is executed in a state in which the setting content designated in the received print instruction is changed to setting content that is executable in the image forming apparatus to transmit the generated pre-confirmation image to the terminal apparatus that has transmitted the print instruction, and change the setting content of the received print instruction to the setting content that is executable in the image forming apparatus to transmit the changed setting content to another image formingType: ApplicationFiled: August 18, 2022Publication date: September 7, 2023Applicant: FUJIFILM Business Innovation Corp.Inventors: Ayumi TSUJI, Satoshi MARUYAMA, Masaki WATANABE, Yusuke TAGUCHI, Ryo MATSUMOTO
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Publication number: 20230247759Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.Type: ApplicationFiled: March 8, 2023Publication date: August 3, 2023Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio SHIOBARA, Yusuke TAGUCHI, Ryunosuke NOMURA
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Patent number: 11678432Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.Type: GrantFiled: January 10, 2022Date of Patent: June 13, 2023Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio Shiobara, Yusuke Taguchi, Ryunosuke Nomura
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Publication number: 20230138855Abstract: A hard coat film includes a transparent resin film and a hard coat layer disposed on one surface thereof, the hard coat layer being composed of a cured product of a hard coat composition. The thickness of the hard coat layer 0.15 times or more the thickness of the transparent resin film. The hard coat composition has a negative cure shrinkage ratio. The absolute value of the amount of curl of the hard coat film cut into a 100 mm×100 mm square is 20 mm or less. The hard coat layer may contain a cured product of a polyorganosiloxane compound having an alicyclic epoxy group.Type: ApplicationFiled: February 19, 2021Publication date: May 4, 2023Applicant: KANEKA CORPORATIONInventors: Yusuke TAGUCHI, Toshifumi MATSUMIYA, Fumiyasu ISHIGURO, Rika MORI, Satoko KOMATSU, Hiroto KOMA, Masahiro MIYAMOTO
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Publication number: 20230122604Abstract: To reduce concern of separation due to a user's unintended application of a load. A joined body of a first structure member having a frame-like structure and a second structure member joined to an inside of the first structure member, wherein the first structure member has a protruding portion in which an anchor shape is formed, the second structure member has a hole portion that comes into contact with the protruding portion of the first structure member, and the protruding portion has a stress concentration portion on which stress concentrates when a load is applied to the second structure member.Type: ApplicationFiled: October 14, 2022Publication date: April 20, 2023Applicant: KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHOInventors: Yusuke TAGUCHI, Masataka MIZUNO
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Publication number: 20220356107Abstract: A method for producing a glass filament, the method including: irradiating a raw yarn containing 70 wt % or more of SiO2 and having a raw yarn diameter of 100 to 2,000 ?m with laser light having a wavelength of 0.7 to 100 ?m to heat the raw yarn; and stretching the raw yarn to obtain the glass filament having a hydroxyl group (Si—OH) content of 300 ppm or less and a diameter of 1 to 20 ?m.Type: ApplicationFiled: April 29, 2022Publication date: November 10, 2022Applicants: SHIN-ETSU CHEMICAL CO., LTD., SHINSHU UNIVERSITYInventors: Yusuke TAGUCHI, Hiroyuki FUKASAWA, Toshio SHIOBARA, Yuta TAKAHASHI, Toshifumi IKAGA, KyoungHou KIM, Yutaka OHKOSHI
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Publication number: 20220275158Abstract: The present invention is a resin substrate including an organic resin and a quartz glass cloth, where the organic resin has a dielectric loss tangent of 0.0002 to 0.0020 measured at 10 GHz and a 40 GHz/10 GHz ratio is 0.4 to 0.9, the quartz glass cloth has a dielectric loss tangent of 0.0001 to 0.0015 measured at 10 GHz and a 40 GHz/10 GHz ratio is 1.2 to 2.0, and the resin substrate has a dielectric loss tangent of 0.0001 to 0.0020 at 10 GHz and a 40 GHz/10 GHz ratio is 0.8 to 1.2. This provides a resin substrate having a low dielectric loss tangent in a high-frequency region and dielectric characteristics with little frequency dependence.Type: ApplicationFiled: January 20, 2022Publication date: September 1, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio SHIOBARA, Yusuke TAGUCHI, Ryunosuke NOMURA, Hajime ITOKAWA
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Publication number: 20220248526Abstract: A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.Type: ApplicationFiled: January 10, 2022Publication date: August 4, 2022Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio SHIOBARA, Yusuke TAGUCHI, Ryunosuke NOMURA
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Patent number: 11388301Abstract: An information processing apparatus includes a processor. The processor is configured to acquire biological information on a user while an operation related to a process is performed, and output information that suggests setting for the process in a case where the biological information indicates a peaceful psychological state.Type: GrantFiled: September 28, 2020Date of Patent: July 12, 2022Assignee: FUJIFILM Business Innovation Corp.Inventors: Shuhei Toda, Hiroyuki Mitsuhashi, Yusuke Taguchi, Yohei Makino, Akihiro Ishii
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Patent number: 11291062Abstract: An information processing apparatus includes a processor configured to measure a distance to a terminal apparatus around the information processing apparatus plural times during a first period before receipt of an operation of a user and during a second period after the receipt of the operation, and establish connection for wireless communication with the terminal apparatus in a case where the measured distances indicate that the terminal apparatus has approached the information processing apparatus during the first period and is within a close range from the information processing apparatus during the second period.Type: GrantFiled: September 25, 2020Date of Patent: March 29, 2022Assignee: FUJIFILM Business Innovation Corp.Inventors: Hiroyuki Mitsuhashi, Yohei Makino, Akihiro Ishii, Yusuke Taguchi, Shuhei Toda
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Patent number: 11245800Abstract: An information processing apparatus includes a processor. The processor is configured to acquire biological information on a user, and output information that supports a process when a psychological state of the user indicated by the biological information is brought to a state determined in advance while an operation related to the process is performed by the user.Type: GrantFiled: September 17, 2020Date of Patent: February 8, 2022Assignee: FUJIFILM Business Innovation Corp.Inventors: Yohei Makino, Hiroyuki Mitsuhashi, Yusuke Taguchi, Akihiro Ishii, Shuhei Toda
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Publication number: 20210403672Abstract: The present invention is a low dielectric resin substrate, which is a composite including an annealed quartz glass cloth and an organic resin, where the annealed quartz glass cloth has a dielectric loss tangent of less than 0.0010 at 10 GHz, and tensile strength of 1.0 N/25 mm or more per cloth weight (g/m2). This provides a resin substrate that includes a quartz glass cloth which has a low dielectric loss tangent and which is also excellent in tensile strength.Type: ApplicationFiled: June 14, 2021Publication date: December 30, 2021Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio SHIOBARA, Yusuke TAGUCHI, Hajime ITOKAWA
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Publication number: 20210395929Abstract: The present invention is an annealed quartz glass cloth that has an SiO2 content of 99.5 mass % or more, a dielectric loss tangent of less than 0.0010 at 10 GHz, and a tensile strength of 1.0 N/25 mm or more per cloth weight (g/m2). This provides an annealed quartz glass cloth that has a low dielectric loss tangent and that is also excellent in tensile strength; and a method for manufacturing an annealed quartz glass cloth by which strength recovers after a high-temperature heat treatment.Type: ApplicationFiled: June 4, 2021Publication date: December 23, 2021Applicant: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Toshio SHIOBARA, Yusuke TAGUCHI, Yuya KATSUSHIKA, Ryunosuke NOMURA