Abstract: A sensor including: a semiconductor substrate (41) having a first surface (S1) and a second surface (S2) opposed to each other, and including an avalanche photodiode; an on-chip lens (71) provided on side of the first surface (S1) of the semiconductor substrate (41); a first reflective member (73) provided on the on-chip lens (71); and a wiring layer (42) provided on side of the second surface (S2) of the semiconductor substrate (41), and including a second reflective member (104).

Abstract: A sensor device according to the present technology includes a pixel that includes: a photoelectric conversion element that performs photoelectric conversion; a first charge holding unit and a second charge holding unit that hold charges accumulated in the photoelectric conversion element; a first transfer transistor that transfers the charges to the first charge holding unit; and a second transfer transistor that transfers the charges to the second charge holding unit.

Abstract: The present technology relates to a solid-state imaging device, a distance measurement device, and a manufacturing method that make it possible to improve condensing efficiency. Provided is a solid-state imaging device including: a pixel unit in which a plurality of pixels each having a light detection unit are arranged; a micro lens formed on a light incident surface side of the light detection unit for each of the pixels; and a light-shielding unit that is formed around the micro lens and shields light, wherein the micro lens is formed inside an opening part provided in the light-shielding part. The present technology is applicable to, for example, CMOS image sensors.

Abstract: A friction plate (11) includes a plate (1A) with a disc shape and a friction material (F1, F2) that is fixed to aside face (1a) of the plate (1A). The friction material (F1, F2) is disposed so that one or both of an inner peripheral side and an outer peripheral side is nonuniform in an inner and outer peripheral direction with respect to a circumferential direction around a center (CT1) of the plate (1A). Thus, there is an increase in the amount of lubrication oil that is fed to a surface of friction material segments (F1, F2) and there is an increase in a separation force in an axial direction between a friction plate (11) and a separator plate or an end plate.