Patents by Inventor Yusuke Tamari
Yusuke Tamari has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11566339Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.Type: GrantFiled: February 4, 2021Date of Patent: January 31, 2023Assignee: EBARA CORPORATIONInventors: Yusuke Tamari, Akira Owatari, Mizuki Nagai, Shingo Yasuda
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Publication number: 20210164125Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.Type: ApplicationFiled: February 4, 2021Publication date: June 3, 2021Inventors: Yusuke Tamari, Akira Owatari, Mizuki Nagai, Shingo Yasuda
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Patent number: 10941504Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.Type: GrantFiled: April 9, 2019Date of Patent: March 9, 2021Assignee: EBARA CORPORATIONInventors: Yusuke Tamari, Akira Owatari, Mizuki Nagai, Shingo Yasuda
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Publication number: 20190233967Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.Type: ApplicationFiled: April 9, 2019Publication date: August 1, 2019Inventors: Yusuke TAMARI, Akira OWATARI, Mizuki NAGAI, Shingo YASUDA
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Patent number: 10294580Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.Type: GrantFiled: January 14, 2015Date of Patent: May 21, 2019Assignee: EBARA CORPORATIONInventors: Yusuke Tamari, Akira Owatari, Mizuki Nagai, Shingo Yasuda
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Patent number: 10214830Abstract: A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.Type: GrantFiled: October 14, 2015Date of Patent: February 26, 2019Assignee: EBARA CORPORATIONInventors: Mitsutoshi Yahagi, Masaaki Kimura, Yusuke Tamari
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Patent number: 9708724Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.Type: GrantFiled: February 23, 2015Date of Patent: July 18, 2017Assignee: Ebara CorporationInventors: Junichiro Tsujino, Tsutomu Nakada, Yusuke Tamari, Mitsutoshi Yahagi, Akira Owatari
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Patent number: 9471262Abstract: Example embodiments are directed to systems, methods, and computer-readable media for providing a cloud print service, wherein when a user of a terminal device chooses a pay-to-print option, a print service provider is configured to send an uploaded print job to a print apparatus via a public network after receiving monetary payment from the user, and when the user chooses a free-print-with-advertisement option, the print service provider is configured to select a user-targeted advertisement, modify the uploaded print job with the selected user-targeted advertisement, and send the modified print job to the print apparatus via the public network.Type: GrantFiled: February 29, 2012Date of Patent: October 18, 2016Assignee: Ricoh Company Ltd.Inventor: Yusuke Tamari
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Patent number: 9376758Abstract: An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.Type: GrantFiled: December 5, 2011Date of Patent: June 28, 2016Assignee: EBARA CORPORATIONInventors: Shingo Yasuda, Fumio Kuriyama, Masashi Shimoyama, Mizuki Nagai, Yusuke Tamari
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Publication number: 20160108539Abstract: A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.Type: ApplicationFiled: October 14, 2015Publication date: April 21, 2016Inventors: Mitsutoshi YAHAGI, Masaaki KIMURA, Yusuke TAMARI
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Publication number: 20150275390Abstract: An anode unit capable of forming a metal film having a uniform thickness on a substrate is disclosed. The anode unit includes an anode, a first feeding portion connected to a central portion of the anode, a second feeding portion located on a central axis of the anode and located away from the anode, and arms extending radially from the second feeding portion. The arms are connected to a periphery of the anode.Type: ApplicationFiled: February 23, 2015Publication date: October 1, 2015Inventors: Junichiro TSUJINO, Tsutomu NAKADA, Yusuke TAMARI, Mitsutoshi YAHAGI, Akira OWATARI
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Publication number: 20150203983Abstract: A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.Type: ApplicationFiled: January 14, 2015Publication date: July 23, 2015Inventors: Yusuke TAMARI, Akira OWATARI, Mizuki NAGAI, Shingo YASUDA
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Patent number: 9024974Abstract: Information technology tools can be provided to manage access by a plurality of attendees through a network to a presentation. Each of the attendees is registered with an associated content access status, and presentation data for the presentation is provided to a registered attendee based on the particular content access status of the registered attendee.Type: GrantFiled: June 13, 2012Date of Patent: May 5, 2015Assignee: Ricoh Company, Ltd.Inventor: Yusuke Tamari
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Publication number: 20130339525Abstract: Information technology tools can be provided to manage access by a plurality of attendees through a network to a presentation. Each of the attendees is registered with an associated content access status, and presentation data for the presentation is provided to a registered attendee based on the particular content access status of the registered attendee.Type: ApplicationFiled: June 13, 2012Publication date: December 19, 2013Applicant: RICOH COMPANY, LTD.Inventor: Yusuke TAMARI
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Publication number: 20130226695Abstract: Example embodiments are directed to systems, methods, and computer-readable media for providing a cloud print service, wherein when a user of a terminal device chooses a pay-to-print option, a print service provider is configured to send an uploaded print job to a print apparatus via a public network after receiving monetary payment from the user, and when the user chooses a free-print-with-advertisement option, the print service provider is configured to select a user-targeted advertisement, modify the uploaded print job with the selected user-targeted advertisement, and send the modified print job to the print apparatus via the public network.Type: ApplicationFiled: February 29, 2012Publication date: August 29, 2013Applicant: RICOH COMPANY, LTD.Inventor: Yusuke Tamari
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Publication number: 20120255864Abstract: An electroplating method is capable of reliably embedding via holes with a plated metal such as copper or the like when a substrate with a seed layer of a metal having a greater ionization tendency than hydrogen is electroplated using an acidic plating solution such as a copper sulfate plating solution. The electroplating method including preparing a substrate having via holes covered with a first metal, which has a greater ionization tendency than hydrogen, in a surface thereof, pretreating the substrate by immersing the substrate in a pretreatment solution in which a second metal that is more noble than the first metal or a salt thereof is dissolved, and then electroplating the surface of the substrate to embed the second metal or a third metal in the via holes.Type: ApplicationFiled: April 5, 2012Publication date: October 11, 2012Applicant: EBARA CORPORATIONInventors: Mizuki Nagai, Yusuke Tamari, Shingo Yasuda
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Patent number: 8261363Abstract: An improved approach for managing and sending electronic data which allows one to access electronic data corresponding to a hardcopy document is provided. For example, when the hardcopy bearing a visible image is output, an identification image corresponding to identification data identifying the document is added to the visible image. The identification data can be recognized from the identification image, and used to retrieve various information in a database corresponding to the document.Type: GrantFiled: April 29, 2008Date of Patent: September 4, 2012Assignees: Ricoh Company, Ltd., Ricoh Americas CorporationInventors: Hiroaki Ishizuka, Yuichi Takamiya, Yusuke Tamari
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Publication number: 20120152749Abstract: An electroplating method can securely and efficiently fill a plated metal into deep high-aspect ratio vias in a bottom-up manner without producing defects in the plated metal. The electroplating method includes: immersing a substrate, having vias formed in a surface, and an anode in a plating solution in a plating tank, the anode being disposed opposite the surface of the substrate; and intermittently passing a plating current at a constant current value between the substrate and the anode in such a manner that the supply and the stop of the plating current are repeated, and that the proportion of a current supply time during which the plating current is supplied increases with the progress of plating, thereby filling a plated metal into the vias.Type: ApplicationFiled: December 5, 2011Publication date: June 21, 2012Inventors: Shingo YASUDA, Fumio Kuriyama, Masashi Shimoyama, Mizuki Nagai, Yusuke Tamari
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Publication number: 20120145552Abstract: An electroplating method includes: preparing a substrate having via holes formed in a surface; immersing the substrate in a pretreatment solution to carry out pretreatment of the substrate; immersing the substrate in a plating solution without applying a voltage between the substrate and an anode, thereby replacing the pretreatment solution in the via holes with the plating solution; carrying out first-step electroplating of the substrate while controlling the voltage, applied between the substrate and the anode, to be equal to or higher than a voltage which is necessary for an electric current, appropriate to fill a plated metal into the via holes, to flow stably between the substrate and the anode; and carrying outsecond-step electroplating of the substrate while controlling the electric current, flowing between the substrate and the anode, at an electric current appropriate to fill the plated metal into the via holes.Type: ApplicationFiled: December 7, 2011Publication date: June 14, 2012Inventors: Mizuki NAGAI, Yusuke Tamari, Shingo Yasuda
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Publication number: 20090271872Abstract: An improved approach for managing and sending electronic data which allows one to access electronic data corresponding to a hardcopy document is provided. For example, when the hardcopy bearing a visible image is output, an identification image corresponding to identification data identifying the document is added to the visible image. The identification data can be recognized from the identification image, and used to retrieve various information in a database corresponding to the document.Type: ApplicationFiled: April 29, 2008Publication date: October 29, 2009Applicants: Ricoh Company, Ltd.Inventors: Hiroaki ISHIZUKA, Yuichi Takamiya, Yusuke Tamari