Patents by Inventor Yusuke Uemichi

Yusuke Uemichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190207284
    Abstract: A transmission line includes a post-wall waveguide which includes a dielectric substrate on which a pair of post-walls is formed and a first conductor layer and a second conductor layer opposed to each other with the dielectric substrate interposed therebetween and in which a region surrounded by the pair of post-walls, the first conductor layer, and the second conductor layer is a waveguide region, a waveguide tube having a hollow rectangular shape, being connected with the first conductor layer so as to cover an opening portion formed in a side wall, and in which an inside communicates with the waveguide region through an opening formed in the first conductor layer, and a wire member which is arranged such that through the opening, a first end is located inside the dielectric substrate and a second end is located in the waveguide tube.
    Type: Application
    Filed: August 8, 2017
    Publication date: July 4, 2019
    Applicant: Fujikura Ltd.
    Inventors: Yusuke Uemichi, Ning Guan
  • Publication number: 20190181528
    Abstract: A transmission line includes a post-wall waveguide which includes a dielectric substrate on which a pair of post-walls is formed and a first conductor layer and a second conductor layer opposed to each other with the dielectric substrate interposed therebetween, and in which a region surrounded by the pair of post-walls, the first conductor layer, and the second conductor layer is a waveguide region, a waveguide tube having a hollow rectangular shape, being connected with the first conductor layer to cover an opening portion formed in a side wall, and in which an inside communicates with the waveguide region through an opening formed in the first conductor layer, a blind via formed in the dielectric substrate such that one end is disposed inside the opening, and a pole member including a post member connected to the one end of the blind via and a support member supporting the post member.
    Type: Application
    Filed: August 18, 2017
    Publication date: June 13, 2019
    Applicant: Fujikura Ltd.
    Inventor: Yusuke Uemichi
  • Patent number: 10170815
    Abstract: A filter includes: a first resonator and a second resonator; a first strip-shaped conductor which is provided on a dielectric layer provided on a surface of a first wide wall of the first resonator; a first conductor pin which is electrically connected to a first end of the first strip-shaped conductor; a second strip-shaped conductor which is provided on a dielectric layer provided on a surface of a first wide wall of the second resonator; and a second conductor pin which is electrically connected to a first end of the second strip-shaped conductor.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: January 1, 2019
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 10135108
    Abstract: In a directional coupler, a rectangular waveguide includes a second narrow wall and has a width varying part resulting from the second narrow wall protruding toward a first narrow wall, the width varying part including at least a portion of an opening, the protruding part protruding by a protrusion amount larger at the center of the width varying part than at both ends thereof.
    Type: Grant
    Filed: June 22, 2016
    Date of Patent: November 20, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 10090598
    Abstract: An antenna module of the present invention is an antenna module 1 including a waveguide slot antenna (1A), a microstripline (1B), and an RFIC (16), the RFIC (16) being disposed to overlap a waveguide (123, 126) of the waveguide slot antenna (1A) as viewed in a stacking direction of layers. This provides an antenna module which can be mounted in a smaller area than a conventional antenna module.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: October 2, 2018
    Assignee: Fujikura Ltd.
    Inventor: Yusuke Uemichi
  • Patent number: 10020591
    Abstract: A slotted waveguide array antenna having a smaller reflection coefficient and a larger gain than conventional one is realized. In a slotted waveguide array antenna (1A), control walls (12c1-12c6) orthogonal to an upper wall (11) and side walls of the waveguide are provided inside the waveguide, and slots (11d1-11d6) each extend over an interface between regions formed by partition with corresponding one of the control walls but do not overlap the corresponding one of the plurality of control walls when viewed from above.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: July 10, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 10003115
    Abstract: A terminator has an upper dielectric layer provided on an upper broad wall of a post-wall waveguide, and a microstrip line (MSL) provided on the upper dielectric layer. A blind via has one end thereof connected with one end of the MSL and is inserted inside the post-wall waveguide. A chip resistor has one end thereof connected with the other end of the MSL and has the other end thereof connected with the upper broad wall.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: June 19, 2018
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 9831897
    Abstract: A directional coupler includes rectangular waveguides each including: a pair of protruding sections which are provided on a first narrow wall or a second narrow wall, which are provided symmetrically with respect to an opening, and which protrude from one of the first and second narrow walls toward the other; and other protruding section which protrudes from the second narrow wall toward the opening.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: November 28, 2017
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 9812755
    Abstract: A mode converter includes a substrate including a first main surface and a second main surface, a first ground conductor layer formed on the first main surface, a second ground conductor layer formed on the second main surface, a plane circuit that is formed on the first main surface and propagates a high frequency, a pin that is connected to the plane circuit, is formed inside a through-hole which penetrate from the first main surface to the second main surface, and communicates with the first main face and the second main surface, and an anti-pad that is formed between an end portion of the pin exposed in the second main surface and the second ground conductor layer.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: November 7, 2017
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Patent number: 9814131
    Abstract: An interconnection substrate includes: a substrate having a first surface and a second surface opposite the first surface; and a transmission line including two parallel through-hole interconnections that are exposed to the first and second surfaces and are formed inside the substrate. Also, at least one of the two through-hole interconnections includes a narrow portion having a smaller diameter than a diameter of the through-hole interconnection in the first surface and a diameter of the through-hole interconnection in the second surface.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: November 7, 2017
    Assignee: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Publication number: 20170250452
    Abstract: A filter includes: a first resonator and a second resonator; a first strip-shaped conductor which is provided on a dielectric layer provided on a surface of a first wide wall of the first resonator; a first conductor pin which is electrically connected to a first end of the first strip-shaped conductor; a second strip-shaped conductor which is provided on a dielectric layer provided on a surface of a first wide wall of the second resonator; and a second conductor pin which is electrically connected to a first end of the second strip-shaped conductor.
    Type: Application
    Filed: February 15, 2017
    Publication date: August 31, 2017
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Publication number: 20170179560
    Abstract: A terminator has an upper dielectric layer provided on an upper broad wall of a post-wall waveguide, and a microstrip line (MSL) provided on the upper dielectric layer. A blind via has one end thereof connected with one end of the MSL and is inserted inside the post-wall waveguide. A chip resistor has one end thereof connected with the other end of the MSL and has the other end thereof connected with the upper broad wall.
    Type: Application
    Filed: December 9, 2016
    Publication date: June 22, 2017
    Applicant: Fujikura Ltd.
    Inventor: Yusuke Uemichi
  • Publication number: 20160380331
    Abstract: In a directional coupler, a rectangular waveguide includes a second narrow wall and has a width varying part resulting from the second narrow wall protruding toward a first narrow wall, the width varying part including at least a portion of an opening, the protruding part protruding by a protrusion amount larger at the center of the width varying part than at both ends thereof.
    Type: Application
    Filed: June 22, 2016
    Publication date: December 29, 2016
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Publication number: 20160380330
    Abstract: A directional coupler includes rectangular waveguides each including: a pair of protruding sections which are provided on a first narrow wall or a second narrow wall, which are provided symmetrically with respect to an opening, and which protrude from one of the first and second narrow walls toward the other; and other protruding section which protrudes from the second narrow wall toward the opening.
    Type: Application
    Filed: June 21, 2016
    Publication date: December 29, 2016
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Publication number: 20160126636
    Abstract: An antenna module of the present invention is an antenna module 1 including a waveguide slot antenna (1A), a microstripline (1B), and an RFIC (16), the RFIC (16) being disposed to overlap a waveguide (123, 126) of the waveguide slot antenna (1A) as viewed in a stacking direction of layers. This provides an antenna module which can be mounted in a smaller area than a conventional antenna module.
    Type: Application
    Filed: March 3, 2015
    Publication date: May 5, 2016
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke Uemichi
  • Publication number: 20160126637
    Abstract: A slotted waveguide array antenna having a smaller reflection coefficient and a larger gain than conventional one is realized. In a slotted waveguide array antenna (1A), control walls (12c1-12c6) orthogonal to an upper wall (11) and side walls of the waveguide are provided inside the waveguide, and slots (11d1-11d6) each extend over an interface between regions formed by partition with corresponding one of the control walls but do not overlap the corresponding one of the plurality of control walls when viewed from above.
    Type: Application
    Filed: February 25, 2015
    Publication date: May 5, 2016
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke UEMICHI
  • Publication number: 20150349398
    Abstract: A method for manufacturing a mode converter including a substrate that is a single member and includes a first main surface, a second main surface opposite to the first main surface, and a micro hole which is formed in the first main surface, grounding conductor layers that are formed on the first main surface and the second main surface, a plane circuit that is formed on the first main surface, and a pin that is formed so as to cover an inner surface of the micro hole and is electrically connected to the plane circuit, the method includes: irradiating the substrate with laser light to form a first modified portion to a desired depth from one main surface of the substrate; removing the first modified portion to form the micro hole; and filling the micro hole with a conductive material to form the pin.
    Type: Application
    Filed: August 13, 2015
    Publication date: December 3, 2015
    Applicant: FUJIKURA, LTD.
    Inventor: Yusuke UEMICHI
  • Publication number: 20150295295
    Abstract: A mode converter includes a substrate including a first main surface aid a second main surface, a first ground conductor layer formed on the first main surface, a second ground conductor layer formed on the second main surface, a plane circuit that is formed on the first main surface and propagates a high frequency, a pin that is connected to the plane-circuit, is formed inside a through-hole which penetrate from the first main surface to the second main surface, and communicates with the first main face and the second main surface, and an anti-pad that is formed between an end portion of the pin exposed in the second main surface and the second ground conductor layer.
    Type: Application
    Filed: June 25, 2015
    Publication date: October 15, 2015
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke UEMICHI
  • Publication number: 20150107888
    Abstract: An interconnection substrate includes: a substrate having a first surface and a second surface opposite the first surface; and a transmission line including two parallel through-hole interconnections that are exposed to the first and second surfaces and are formed inside the substrate. Also, at least one of the two through-hole interconnections includes a narrow portion having a smaller diameter than a diameter of the through-hole interconnection in the first surface and a diameter of the through-hole interconnection in the second surface.
    Type: Application
    Filed: December 29, 2014
    Publication date: April 23, 2015
    Applicant: FUJIKURA LTD.
    Inventor: Yusuke UEMICHI
  • Patent number: 8154360
    Abstract: Provided is a resin multilayer device having a balun, wherein the resin multilayer device comprises: a substrate; a first resin layer formed on the substrate; two balanced signal transmission lines that are electrically independently disposed on the first resin layer; a second resin layer formed on the two balanced signal transmission lines and the first resin layer; an unbalanced signal transmission line disposed on the second resin layer and facing the two balanced signal transmission lines; and a third resin layer formed on the unbalanced signal transmission line and the second resin layer.
    Type: Grant
    Filed: May 6, 2011
    Date of Patent: April 10, 2012
    Assignee: Fujikura Ltd.
    Inventors: Yusuke Uemichi, Takuya Aizawa, Osamu Nakao