Patents by Inventor Yusuke YADANI

Yusuke YADANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20240105472
    Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yusuke YADANI
  • Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
    Patent number: 11929265
    Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: March 12, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventor: Yusuke Yadani
  • SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20230197473
    Abstract: A semiconductor manufacturing apparatus includes a tool performing joining by ultrasonic vibration while applying a load to a metal terminal. The tool includes a plurality of protrusions arranged along the X-axis direction and the Y-axis direction on a pressing surface in a rectangular shape at a tip end portion facing the metal terminal. The intervals between the plurality of protrusions are equal in the X direction of the pressing surface, and are larger on the inner peripheral side than on the outer peripheral side in the Y-axis direction of the pressing surface.
    Type: Application
    Filed: October 18, 2022
    Publication date: June 22, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventor: Yusuke YADANI