Abstract: An additive manufacturing condition search device includes a defect database that accumulates a material, shape information, an additive manufacturing condition, monitoring information during modeling, and defect information in association with each other, a first machine learning unit that outputs an additive manufacturing condition corresponding to material information and device information, and outputs a new additive manufacturing condition from a combination of a plurality of the additive manufacturing conditions and the defect information, a specification unit that causes an additive manufacturing apparatus to perform modeling by the additive manufacturing condition, acquires the monitoring information during modeling, and acquires the shape information and the defect information by inspection of a modeled object, a second machine learning unit in which a model trained by using the defect database as train data estimates defect information of the modeled object from the monitoring information and stores

Abstract: A method that includes performing additive manufacturing using metal powder under a predetermined condition to manufacture an additively manufactured test object including a reference part, a deformation part and a coupling part integrating the reference part and the deformation part arranged in a surface direction of an upper surface of a baseplate on the upper surface of the baseplate such that the reference part, the deformation part, and the coupling part are joined to the upper surface of the baseplate; a separation step of separating the additively manufactured test object from the upper surface of the baseplate; and measuring the deformation amount of the deformation part based on the reference part of the additively manufactured test object separated from the upper surface of the baseplate.

Abstract: A motor may include a motor body having a rotor having a shaft, a stator, a first bearing, a second bearing, and a housing having an accommodating space; a connector disposed to the motor body; and a wiring member electrically connected to the motor body. The connector may have an exposed surface. The wiring member may include external connection terminals. The connector may include a through hole which extends from the exposed surface toward the accommodating space. A portion of the through hole may be positioned inside of the plurality of external connection terminals. The motor body may include a main body, a groove portion, a first sealing member between the main body and the housing, and a second sealing member in the groove portion. The through hole may be positioned between the first sealing member and second sealing member in the axial direction.

Abstract: Provided are a motor angle detector for detecting a motor angle, a current detector for detecting a motor current value to drive a motor, a vehicle inclination angle detector for detecting a vehicle inclination angle, a motor control circuit for outputting a control signal to control the driving of the motor, and a storage apparatus. The storage apparatus stores data obtained by associating the motor current value, a setting value in the motor control circuit for outputting the control signal, the vehicle inclination angle, and the motor angle at a first time with each other, and the motor control circuit controls the driving of the motor on the basis of information of the motor current value and the vehicle inclination angle at a second time and the data at the first time.

Abstract: Provided are a motor angle detector for detecting a motor angle, a current detector for detecting a motor current value to drive a motor, a vehicle inclination angle detector for detecting a vehicle inclination angle, a motor control circuit for outputting a control signal to control the driving of the motor, and a storage apparatus. The storage apparatus stores data obtained by associating the motor current value, a setting value in the motor control circuit for outputting the control signal, the vehicle inclination angle, and the motor angle at a first time with each other, and the motor control circuit controls the driving of the motor on the basis of information of the motor current value and the vehicle inclination angle at a second time and the data at the first time.

Abstract: A motor may include a motor body having a rotor having a shaft, a stator, a first bearing, a second bearing, and a housing having an accommodating space; a connector disposed to the motor body; and a wiring member electrically connected to the motor body. The connector may have an exposed surface. The wiring member may include external connection terminals. The connector may include a through hole which extends from the exposed surface toward the accommodating space. A portion of the through hole may be positioned inside of the plurality of external connection terminals. The motor body may include a main body, a groove portion, a first sealing member between the main body and the housing, and a second sealing member in the groove portion. The through hole may be positioned between the first sealing member and second sealing member in the axial direction.

Abstract: A motor may include a motor body portion; a connector portion disposed to the motor body portion; and a wiring member electrically connected to the motor body portion. The connector portion has a surface exposed to an outside of the motor body portion. The wiring member includes a plurality of external connection terminals which are connected to the external power supply to protrude from the exposed surface of the connector part. The connector portion is provided with a through hole which extends from the exposed surface toward the accommodating space and connects the outside of the motor body portion and the accommodating space. When viewed in the normal direction of the exposed surface, at least a portion of the through hole is positioned inside an edge of an external connection terminal group which consists of the plurality of external connection terminals.

Abstract: A semiconductor device according to one embodiment selects one of the first and second resolver/digital converters and interrupts a supply of a power supply voltage to the other one of the first and second resolver/digital converters, and when an error is detected in the selected one of the first and second resolver/digital converters, the semiconductor device starts the supply of the voltage to the other one of the first and second resolver/digital converters, and switches the one of the first and second resolver/digital converters to the other one of the first and second resolver/digital converters.

Abstract: A semiconductor device according to one embodiment selects one of the first and second resolver/digital converters and interrupts a supply of a power supply voltage to the other one of the first and second resolver/digital converters, and when an error is detected in the selected one of the first and second resolver/digital converters, the semiconductor device starts the supply of the voltage to the other one of the first and second resolver/digital converters, and switches the one of the first and second resolver/digital converters to the other one of the first and second resolver/digital converters.

Abstract: To provide a stress relaxation structure that can achieve both high thermal conductivity and high thermal stress relaxation ability and has excellent vibration durability, and a thermoelectric conversion module having such a stress relaxation structure. The stress relaxation structure includes a rolled-up body having a first thermal conductor and a second thermal conductor that are alternately rolled up. The first thermal conductor is metal foil, and the second thermal conductor is porous metal foil.

Abstract: Provided are: a sintering binder including nanoparticles, a method for producing the sintering binder, and a method for bonding using the sintering binder. The sintering binder mainly includes cuprous oxide nanoparticles, combines particle stability with bondability, and less undergoes ion migration. A composite particle including metallic copper with the remainder being cuprous oxide and inevitable impurities is used for bonding typically of metals. The composite particle structurally includes metallic copper dispersed inside the particle and has an average particle size of 1000 nm or less.

Abstract: A motor may include a motor body portion; a connector portion disposed to the motor body portion; and a wiring member electrically connected to the motor body portion. The connector portion has a surface exposed to an outside of the motor body portion. The wiring member includes a plurality of external connection terminals which are connected to the external power supply to protrude from the exposed surface of the connector part. The connector portion is provided with a through hole which extends from the exposed surface toward the accommodating space and connects the outside of the motor body portion and the accommodating space. When viewed in the normal direction of the exposed surface, at least a portion of the through hole is positioned inside an edge of an external connection terminal group which consists of the plurality of external connection terminals.

Abstract: In a drive system using a single synchronous motor which is not paired with a synchronous generator, even if a failure occurs in an analog angle data converter for detecting the rotation angle of the synchronous motor, the driving of the synchronous motor can be continued in a temporal emergency manner. In addition to an analog angle data converter for converting an analog sense signal which is output from a rotation angle sensor of a synchronous motor to digital angle data, a digital angle data converter for converting digital data generated by an analog-to-digital converter to digital angle data is provided.

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 ?m, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract: It is an object of this invention to provide a bonding material capable of realizing bonding by metallic bonding at a bonding interface at a lower temperature compared to a bonding material using a metal particle having an average particle diameter of not more than 100 nm and a bonding method. There is provided a bonding material including a metal particle precursor being at least one selected from the group consisting of a particle of a metal oxide, a particle of a metal carbonate, and a particle of a metal carboxylate and having an average particle diameter of 1 nm to 50 ?m and a reducing agent composed of an organic substance, wherein the content of the metal particle precursor is more than 50 parts by mass and not more than 99 parts by mass per 100 parts by mass of the bonding material.

Abstract: An aluminum salt is dissolved into water as a solvent to prepare an aqueous solution of the aluminum salt. Urea is added to the aqueous solution of the aluminum salt to be dissolved into the solution. The solution is heated to produce a precipitation of aluminum hydroxide. A deflocculant is added to deflocculate the precipitation. Thus, a sol is produced which contains colloidal particles of aluminum hydroxide and crystalline particles of aluminum oxide. An even and dense alumina thin film can be produced by using the sol on a surface of a substrate made of a metal having a low melting point, such as copper or aluminum.

Abstract: A semiconductor device wherein a semiconductor element made of Si or Si group material mounted on a substrate, the semiconductor element is mounted on the substrate and the semiconductor element is bonded to a silver bonding material via a oxide film formed on the semiconductor element. The bonding material comprising silver oxide particles having an average particle size of 1 nm to 50 nm and an organic reducing agent is used for bonding in air, which gives a high bonding strength to the oxide on the semiconductor element.

Abstract: The present invention is directed to enhancing the bonding reliability of a bonding portion between an Al electrode of a semiconductor device and a bonding material having metal particles as a main bonding agent. In the semiconductor device, a semiconductor element and an Al electrode are connected to each other with a bonding layer made of Ag or Cu interposed therebetween, and the bonding layer and the Al electrode are bonded to each other with an amorphous layer interposed therebetween. It is possible to obtain excellent bonding strength to the Al electrode by performing a bonding process in atmospheric air by using a bonding material including a metal oxide particle with an average diameter of 1 nm to 50 ?m, an acetic acid- or formic acid-based compound, and a reducing agent made of an organic material.

Abstract: There is provided a conductive sintered layer forming composition and a conductive sintered layer forming method that can lower heating temperature and shorten heating time for a process of accelerating sintering or bonding by sintering of metal nano-particles coated with an organic substance. The conductive sintered layer forming composition may be obtained by utilizing a phenomenon that particles may be sintered at low temperature by mixing silver oxide with metal particles coated with the organic substance and having a grain size of 1 nm to 5 ?m as compared to sintering each simple substance. The conductive sintered layer forming composition of the invention is characterized in that it contains the metal particles whose surface is coated with the organic substance and whose grain size is 1 nm to 5 ?m and the silver oxide particles.

Abstract: When silver oxide is reduced to silver, a large number of cores of metallic silver are formed inside the silver oxide. Then, the silver oxide is reduced in a manner of being hollowed out while its original outer configuration is being maintained. As a result, the curvature of the silver generated becomes larger. The utilization of this microscopic-particle implementation mechanism allows accomplishment of the bonding even if the silver oxide is supplied not in a particle-like configuration, but in a closely-packed layer-like configuration. In the present invention, there is provided an electronic member including an electrode for inputting/outputting an electrical signal, or a connection terminal for establishing a connection with the electrical signal, wherein the uppermost surface of the electrode or the connection terminal is a silver-oxide layer.