Abstract: In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

Abstract: A power supply device has a first power supply capable of storing and discharging electric power, a second power supply connected in series to the first power supply and capable of storing and discharging the electric power, an isolated DC-DC converter including a primary side terminal to which the first power supply is connected, and a secondary side terminal to which the second power supply is connected, and a power supply control unit that controls a voltage of the second power supply using the isolated DC-DC converter. A direct-current voltage outputted from the first power supply and the second power supply connected in series is inputted to a first inverter, converted into an alternating-current voltage by the first inverter, and then supplied to a vehicle drive motor.

Abstract: A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each other and have first terminals that are electrically connected to a first power system and a second terminal that is electrically connected to a second power system. The first electrode is electrically connected both to one of the first terminal and to an electrode of one of the semiconductor devices. The output electrode is electrically connected both to the second terminal and to an electrode of the other of the semiconductor device. The second electrode is electrically connected to the other of the first terminals. The second electrode is connected to the heat sink via a first insulating member. The output electrode is connected to the second electrode via a second insulating member.

Abstract: A switching circuit includes: a first switching element (Q1); a resistor (11) inserted between a control electrode (G) of the first switching element (Q1) and a control circuit (13) switching the first switching element (Q1); and a first capacitor (15) and a second switching element (14) connected in series between the control electrode (G) of the first switching element (Q1) and a low potential-side electrode (S) of the first switching element (Q1). A high potential-side electrode of the second switching element (14) is connected to the control electrode (G) of the first switching element (Q1). An electrode of the first capacitor (15) is connected to the low potential-side electrode (S) of the first switching element (Q1). A control electrode of the second switching element (14) is connected to an electrode of the resistor (11) connected to the control circuit (13).

Abstract: A method for manufacturing a semiconductor device is carried out by readying each of a semiconductor element, a substrate having Cu as a principal element at least on a surface, and a ZnAl solder chip having a smaller shape than that of the semiconductor element; disposing the semiconductor element and the substrate so that respective bonding surfaces face each other, and sandwiching the ZnAl eutectic solder chip between the substrate and the semiconductor element; increasing the temperature of the ZnAl solder chip sandwiched between the substrate and the semiconductor element while applying a load to the ZnAl solder chip such that the ZnAl solder chip melts to form a ZnAl solder layer; and reducing the temperature of the ZnAl solder layer while applying a load to the ZnAl solder layer.

Abstract: A semiconductor module has a pair of semiconductor devices, a heat sink, a first electrode, an output electrode and a second electrode. The semiconductor devices are connected in series with each other and have first terminals that are electrically connected to a first power system and a second terminal that is electrically connected to a second power system. The first electrode is electrically connected both to one of the first terminal and to an electrode of one of the semiconductor devices. The output electrode is electrically connected both to the second terminal and to an electrode of the other of the semiconductor device. The second electrode is electrically connected to the other of the first terminals. The second electrode is connected to the heat sink via a first insulating member. The output electrode is connected to the second electrode via a second insulating member.

Abstract: A switching circuit includes: a first switching element (Q1); a resistor (11) inserted between a control electrode (G) of the first switching element (Q1) and a control circuit (13) switching the first switching element (Q1); and a first capacitor (15) and a second switching element (14) connected in series between the control electrode (G) of the first switching element (Q1) and a low potential-side electrode (S) of the first switching element (Q1). A high potential-side electrode of the second switching element (14) is connected to the control electrode (G) of the first switching element (Q1). An electrode of the first capacitor (15) is connected to the low potential-side electrode (S) of the first switching element (Q1). A control electrode of the second switching element (14) is connected to an electrode of the resistor (11) connected to the control circuit (13).

Abstract: An electric drive unit includes an inverter, a stator that receives an AC current from the inverter and forms a magnetic field, a rotor rotated by the magnetic field formed by the stator, a shaft that protrudes into both sides in an axial direction of the rotor and moves in synchronization with the rotor, an inverter casing that stores the inverter in a galvanic isolation state, and a motor housing. The motor housing stores the stator and the rotor in a galvanic isolation state, rotatably supports one end of the shaft using a first bearing, and rotatably supports the other end of the shaft using a second bearing. The inverter and the inverter casing are arranged in an inner side from a pair of bearings including the first and second bearings.

Abstract: A motor is basically provided with a rotor and a stator. The stator includes a plurality of stacked magnetic entities, a dielectric material disposed between adjacent ones of the magnetic entities, a positive electrode part provided on at least one of the magnetic entities and a negative electrode part provided on at least one of the magnetic entities that does not have the positive electrode part. The positive electrode part is arranged for connecting to a positive side of an external circuit. The negative electrode part arranged for connecting to a negative side of the external circuit.

Abstract: A motor is basically provided with a rotor and a stator. The stator includes a plurality of stacked magnetic entities, a dielectric material disposed between adjacent ones of the magnetic entities, a positive electrode part provided on at least one of the magnetic entities and a negative electrode part provided on at least one of the magnetic entities that does not have the positive electrode part. The positive electrode part is arranged for connecting to a positive side of an external circuit. The negative electrode part arranged for connecting to a negative side of the external circuit.