Abstract: The present disclosure relates to a cleaning agent composition for a substrate for a semiconductor device and a method for cleaning a substrate for a semiconductor device using the same. The cleaning agent composition contains a silicon-based compound represented by Formula 1 and an aprotic organic solvent with a dielectric constant of 10 or less, which can form a surface protective film capable of preventing collapse of the pattern even in a wet cleaning process of fine patterns with high aspect ratios, thereby providing a method for manufacturing a semiconductor device with an improved semiconductor manufacturing yield.

Abstract: In a semiconductor device, a first gate structure having a first end portion is formed on a substrate. A second gate structure is formed on the substrate, and has a second end portion opposite to the first end portion of the first gate structure in a diagonal direction. A cross-coupling pattern is formed between the first and second gate structure, and electrically connects the first and second gate structures to each other. A first contact plug directly contacts an upper portion of the first end portion of the first gate structure and a first upper sidewall of the cross-coupling pattern. A second contact plug directly contacts an upper portion of the second end portion of the second gate structure and a second upper sidewall of the cross-coupling pattern. In the semiconductor device, a parasitic capacitance due to the cross-coupling structure may decrease.

Abstract: In a semiconductor device, a first gate structure having a first end portion is formed on a substrate. A second gate structure is formed on the substrate, and has a second end portion opposite to the first end portion of the first gate structure in a diagonal direction. A cross-coupling pattern is formed between the first and second gate structure, and electrically connects the first and second gate structures to each other. A first contact plug directly contacts an upper portion of the first end portion of the first gate structure and a first upper sidewall of the cross-coupling pattern. A second contact plug directly contacts an upper portion of the second end portion of the second gate structure and a second upper sidewall of the cross-coupling pattern. In the semiconductor device, a parasitic capacitance due to the cross-coupling structure may decrease.

Abstract: A process is provided for producing a coating composition containing microcapsules having a hydrophilic core material for use in the manufacture of pressure-sensitive carbonless transfer papers comprising the following steps of preparing a hydrophobic emulsion component by dispersing an emulsifier in a radiation curable hydrophobic liquid, preparing a hydrophilic emulsion component by dispersing a first wall-forming material in a hydrophilic liquid containing at least one chromogenic material being soluble in the hydrophilic liquid, the first wall-forming material being reactive with a second wall-forming material to form a polymeric capsule wall, the polymeric capsule wall being substantially insoluble in the hydrophilic and the hydrophobic liquids and mixing the hydrophobic emulsion component with the hydrophilic emulsion component to form an emulsion containing droplets of the hydrophilic emulsion component dispersed in the hydrophobic emulsion component.

Abstract: A pressure-sensitive adhesive comprises the reaction product of (A) at least one alkyl acrylate liquid polymer containing both terminal and random hydroxyl functionality, as well as sulfide and optionally also disulfide linkages near the terminal portions of the polymer molecule; (B) at least one prepolymer of a polyester glycol or a polyalkylene ether glycol with an excess amount of an aromatic diisocyanate; and (C) at least one alkanediol containing from 3 to 10 carbon atoms. Use of the alkanediol improves 180.degree. peel strength and maintains U.V. stability of the adhesive.

Abstract: A process is provided for producing a coating composition containing microcapsules having a hydrophilic core material for use in the manufacture of pressure-sensitive carbonless transfer papers comprising the following steps of preparing a hydrophobic emulsion component by dispersing an emulsifier in a radiation curable hydrophobic liquid, preparing a hydrophilic emulsion component by dispersing a first wall-forming material in a hydrophilic liquid containing at least one chromogenic material being soluble in the hydrophilic liquid, the first wall-forming material being reactive with a second wall-forming material to form a polymeric capsule wall, the polymeric capsule wall being substantially insoluble in the hydrophilic and the hydrophobic liquids and mixing the hydrophobic emulsion component with the hydrophilic emulsion component to form an emulsion containing droplets of the hydrophilic emulsion component dispersed in the hydrophobic emulsion component.

Abstract: A pressure-sensitive carbonless transfer sheet comprising a substrate having a plurality of surfaces, at least one of the surfaces being coated with a tack-free resinous film comprising a radiation cured resin having dispersed therein microcapsules containing a hydrophilic liquid containing at least one chromogenic material, the chromogenic material being soluble in the hydrophilic liquid.

Abstract: A process is provided for producing a radiation curable coating composition containing microcapsules comprising the steps of preparing a dispersion of substantially discrete microcapsules in a continuous phase, the continuous phase comprising a liquid volatile solvent, preparing a liquid radiation curable suspending medium, the liquid radiation curable suspending medium comprising one or more ethylenically unsaturated organic compounds having at least one terminal ethylenic group per molecule, mixing the dispersion of substantially discrete microcapsules in the continuous phase and the liquid radiation curable suspending medium with turbulent agitation to form an intimate mixture of the dispersion of microcapsules and the liquid radiation curable suspending medium, and applying heat and vacuum to the mixture, while maintaining the agitation, until the liquid volatile solvent is substantially removed from the mixture to form a dispersion of substantially discrete microcapsules in the liquid radiation curable s

Abstract: A process is provided for the production of a coating composition containing microcapsules having a hydrophilic core for use in the manufacture of pressure-sensitive carbonless transfer papers comprising the following steps. A hydrophilic emulsion component is prepared by dispersing at least one chromogenic material being soluble in the hydrophilic liquid. A hydrophobic emulsion component is prepared by dispersing an emulsifier in a radiation curable hydrophobic liquid. A first wall-forming material and a second wall-forming material are added to the hydrophobic emulsion component, with mixing. The first and second wall-forming materials are soluble in the hydrophobic emulsion component, and the first wall-forming material is reactive with the second wall-forming material to form a polymeric capsule wall. The resultant polymeric capsule wall is substantially insoluble in the hydrophilic and the hydrophobic emulsion components.