Patents by Inventor Yusutsugu Yoshimura

Yusutsugu Yoshimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of bonding metal plates, apparatus therefor and hot strip mill
    Patent number: 6213381
    Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a moving mechanism is provided for relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing glade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: April 10, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama
  • Method of bonding metal plates, apparatus therefor and hot strip mill
    Patent number: 5884832
    Abstract: A bonding apparatus for bonding metal plates, includes an overlapping mechanism for overlapping end portions of the metal plates, at least two supports for supporting the overlapped portion of the metal plates at one side of the metal plates, and a shearing blade disposed opposite the supports so as to sandwich the overlapped portion of the metal plates therebetween, wherein a mechanism is provided for moving relatively moving at least one of the shearing blade and the supports so as to press the shearing blade into the overlapped portion of the metal plates disposed between the supports and the shearing blade. A method for bonding is characterized by bonding metal plates by using the above apparatus.
    Type: Grant
    Filed: October 25, 1996
    Date of Patent: March 23, 1999
    Assignee: Hitachi, Ltd.
    Inventors: Takao Funamoto, Gen Nagakubo, Takashi Mashiko, Fuminori Ishikawa, Tadashi Nishino, Yusutsugu Yoshimura, Toshiyuki Kajiwara, Kenichi Yasuda, Mitsuo Nihei, Yoshio Takakura, Hironori Shimogama