Patents by Inventor Yuta AKUTSU

Yuta AKUTSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240182290
    Abstract: An interior component for a conveyance having a design surface includes a base material and a skin material covering the base material. The skin material includes linear locking members at end portions of the skin material, and the linear locking members are attached at positions that are not visible from a design surface side of the base material. Since the linear locking members are provided at the end portions of the skin material, the skin material is linearly pulled, so that slack wrinkles of the skin material can be suppressed when the base material is covered with the skin material. In addition, since the linear locking member is attached at a position that is not visible from the design surface side, the skin material can be fixed without using an adhesive agent.
    Type: Application
    Filed: March 22, 2022
    Publication date: June 6, 2024
    Inventors: Shuichi AKUTSU, Kazuaki MIMA, Ryoichiro TAKEZAWA, Takahiro SHIMIZU, Yuji NAKANO, Takashige II, Yuta OGIWARA
  • Patent number: 11608433
    Abstract: A formulation for a wafer dicing process comprises 1.0 to 1.5 mass % of a partially saponified polyvinyl alcohol having a polymerization degree of 200 to 400 and a saponification degree of 75 to 85 mol %; 0.4 to 0.6 mass % of polyoxyethylene-polyoxypropylene glycol ether having a number average molecular weight of 10,000 to 20,000 with a polymerization ratio of polyoxyethylene to polyoxypropylene of 75:25 to 85:15; and pure water (all mass % based on 100 mass % of formulation). The formulation is used in the form of a processing solution obtained by diluting it 10,000 to 100,000 times by pure water and flowing it on a dicing blade in a wafer dicing process to effectively remove dicing offcuts from the wafer and minute pieces of adhesive released from an adhesive layer of a dicing tape.
    Type: Grant
    Filed: August 16, 2019
    Date of Patent: March 21, 2023
    Assignee: NIKKA SEIKO CO., LTD.
    Inventors: Tsuyoshi Tadano, Masafumi Hirose, Yuta Akutsu
  • Publication number: 20200075413
    Abstract: A formulation for a wafer dicing process comprises 1.0 to 1.5 mass % of a partially saponified polyvinyl alcohol having a polymerization degree of 200 to 400 and a saponification degree of 75 to 85 mol %; 0.4 to 0.6 mass % of polyoxyethylene-polyoxypropylene glycol ether having a number average molecular weight of 10,000 to 20,000 with a polymerization ratio of polyoxyethylene to polyoxypropylene of 75:25 to 85:15; and pure water (all mass % based on 100 mass % of formulation). The formulation is used in the form of a processing solution obtained by diluting it 10,000 to 100,000 times by pure water and flowing it on a dicing blade in a wafer dicing process to effectively remove dicing offcuts from the wafer and minute pieces of adhesive released from an adhesive layer of a dicing tape.
    Type: Application
    Filed: August 16, 2019
    Publication date: March 5, 2020
    Inventors: Tsuyoshi TADANO, Masafumi HIROSE, Yuta AKUTSU