Patents by Inventor Yuta KAMO
Yuta KAMO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240087816Abstract: A high-voltage feedthrough capacitor includes: a capacitor including an element body in which a through hole extending is formed, and a first electrode and a second electrode disposed facing each other on the element body; a feedthrough conductor inserted through the through hole and electrically connected to the first electrode; a grounding fitting electrically connected to the second electrode; and a first case and a second case. The element body includes: a first end face and a second end face; a first protruding part in which the through hole opens, the first protruding part being provided on the first end face; and a second protruding part in which the through hole opens, the second protruding part being provided on the second end face. The first case is attached to the first protruding part. The second case is attached to the second protruding part.Type: ApplicationFiled: September 12, 2023Publication date: March 14, 2024Applicant: TDK CORPORATIONInventors: Hisashi TANAKA, Yuta KAMO
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Publication number: 20240071693Abstract: A high voltage capacitor includes a pair of capacitors; a common conductor, and a pair of individual conductors. Each of the pair of capacitors includes an element body having a columnar shape with a first direction as an axial direction, and including a first side surface and a second side surface facing away each other in a second direction orthogonal to the first direction, a first electrode disposed on the first side surface and electrically connected to a corresponding individual conductor of the pair of individual conductors; and a second electrode disposed on the second side surface and electrically connected to the common conductor. The pair of capacitors is disposed in such a way that the first electrodes face each other in the second direction. The common conductor surrounds the pair of capacitors and the pair of individual conductors when viewed from the first direction.Type: ApplicationFiled: July 19, 2023Publication date: February 29, 2024Applicant: TDK CORPORATIONInventors: Yuta KAMO, Hisashi TANAKA
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Publication number: 20240071692Abstract: A high voltage feed-through capacitor includes an element body, a first electrode, a second electrode and a through-conductor. The element body includes a first main surface and a second main surface facing away from each other. A through-hole is formed in the element body and opens in the first main surface and the second main surface. The first electrode is disposed on the first main surface. The second electrode is disposed on the second main surface. The through-conductor is inserted through the through-hole and electrically connected to the first electrode. An opening area of the through-hole in the second main surface is larger than an opening area of the through-hole in the first main surface.Type: ApplicationFiled: July 17, 2023Publication date: February 29, 2024Applicant: TDK CORPORATIONInventors: Yuta KAMO, Hisashi TANAKA
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Patent number: 11862405Abstract: An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.Type: GrantFiled: December 15, 2022Date of Patent: January 2, 2024Assignee: TDK CORPORATIONInventors: Yuta Kamo, Kenichi Kamehashi, Hisashi Tanaka, Isao Fujiwara
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Publication number: 20230260714Abstract: An element body is formed with a through hole to be open at a first main surface and a second main surface opposing each other. A through-conductor includes a first portion located inside the through hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A first resin is contained in the case and coats the element body. A second resin is contained in the cover and is located in a space between an inner surface of the element body and the first portion. The second resin has an electrical resistivity less than an electrical resistivity of the first resin.Type: ApplicationFiled: December 15, 2022Publication date: August 17, 2023Applicant: TDK CORPORATIONInventors: Yuta KAMO, Kenichi KAMEHASHI, Hisashi TANAKA, Isao FUJIWARA
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Publication number: 20230260715Abstract: An element body is formed with a through hole to be open at the first main surface and the second main surface opposing each other. A through-conductor includes a first portion located inside the through-hole and a second portion protruding from the second main surface. A case surrounds the element body and is electrically insulating. A cover surrounds the second portion and is electrically insulating. A tube covers the first portion and is electrically insulating. A resin is contained in the cover and is located in a space between an inner surface of the element body and the tube. The tube has an electrical resistivity equal to or greater than an electrical resistivity of the resin.Type: ApplicationFiled: December 15, 2022Publication date: August 17, 2023Applicant: TDK CORPORATIONInventors: Yuta KAMO, Kenichi KAMEHASHI, Hisashi TANAKA
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Publication number: 20230023226Abstract: The high voltage feed-through capacitor comprises a feed-through capacitor unit, a resin coating the feed-through capacitor unit, and a bond structure between the feed-through capacitor unit and the resin. The feed-through capacitor unit includes an element body including first and second principal surfaces opposing each other, a first electrode on the first principal surface, a second electrode on the second principal surface, a through conductor electrically connected to the first electrode, and a terminal conductor electrically connected to the second electrode. The bond structure chemically bonds a first surface of the feed-through capacitor unit and a second surface of the resin.Type: ApplicationFiled: July 8, 2022Publication date: January 26, 2023Applicant: TDK CORPORATIONInventors: Yuta KAMO, Hisashi TANAKA