Patents by Inventor Yuta Koseki

Yuta Koseki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230095879
    Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.
    Type: Application
    Filed: November 3, 2022
    Publication date: March 30, 2023
    Inventors: Yuta Koseki, Daisuke Fujimoto, Kumpei Yamada, Naoya Suzuki, Hitoshi Onozeki, Hiroshi Takahashi
  • Publication number: 20180340056
    Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.
    Type: Application
    Filed: August 26, 2016
    Publication date: November 29, 2018
    Inventors: Yuta Koseki, Daisuke Fujimoto, Kumpei Yamada, Naoya Suzuki, Hitoshi Onozeki, Hiroshi Takahashi