Abstract: A signal coupling device includes a first element to output a signal, and a second element to receive the signal. A first silicone gel covers the first element. A second silicone gel covers the second element. A stacked body comprising at least one of an insulated coil or a capacitor is provided. The first element, the second element, and the stacked body are encapsulated in resin material, which contacts the first and second silicone gels.

Abstract: A signal coupling device includes a first element to output a signal, and a second element to receive the signal. A first silicone gel covers the first element. A second silicone gel covers the second element. A stacked body comprising at least one of an insulated coil or a capacitor is provided. The first element, the second element, and the stacked body are encapsulated in resin material, which contacts the first and second silicone gels.

Abstract: A signal coupling device includes a light-emitting element configured to emit light, a first element to drive the light-emitting element to output an optical signal, and a second element to receive the optical signal from the light-emitting element and to convert the optical signal into an electrical signal. A first silicone gel covers the first semiconductor element. A second silicone gel covers the second semiconductor element. A third silicone gel covers the light-emitting element. The light-emitting element, the first semiconductor element, and the second semiconductor element are encapsulated in resin material, which contacts the first, second, and third silicone gels. The first silicone gel, the second silicone gel, the third silicone gel, and the first resin material, and the resin material are transparent to light emitted by the light-emitting element. The first, second, and third silicone gels are spaced apart from each other.

Abstract: An optical coupling device includes a first receiving chip having a first region on one end and a second region on another end side. A first emitting chip is disposed on the first region. A second receiving chip has a third region on one end and a fourth region on another end. A second emitting chip is disposed on the fourth region. The first and third regions are adjacent, and the second and fourth regions are adjacent. A first connection portion is disposed on the second region and is electrically connected to the second light emitting chip through a bonding wire. A second connection portion is disposed in the third region and is electrically connected to the first light emitting chip through a bonding wire.

Abstract: An optical coupling device includes a power lead with a first portion and a power line portion. A light-emitting element is disposed on the first portion. A ground lead includes a ground line portion and a second portion with a drive circuit disposed thereon. A first input frame in the device includes a first input terminal portion and a first input signal line portion. A second input frame in the device includes a second input terminal portion and a second input signal line portion. The first and second input frames are adjacent to each other and a minimum distance from the first input signal line portion to the first installation portion is greater than a minimum distance from the first input signal line portion to the power line portion.

Abstract: An optical coupling device includes a first receiving chip having a first region on one end and a second region on another end side. A first emitting chip is disposed on the first region. A second receiving chip has a third region on one end and a fourth region on another end. A second emitting chip is disposed on the fourth region. The first and third regions are adjacent, and the second and fourth regions are adjacent. A first connection portion is disposed on the second region and is electrically connected to the second light emitting chip through a bonding wire. A second connection portion is disposed in the third region and is electrically connected to the first light emitting chip through a bonding wire.

Abstract: An optical coupler includes an optical transmitting unit and an optical receiving unit in a facing arrangement. The optical transmitting unit includes a power lead having a first die-pad portion, a light emitting element on the first die-pad portion, a ground lead having a second die-pad portion, and an integrated circuit on the second die-pad portion. The integrated circuit has a power pad portion, a light emitting element pad portion, and input pad portions thereon. An inter-center distance between an inner lead of the first input lead and an inner lead of the second input lead is equal to or less than an inter-center distance between an outer lead of the first input lead and an outer lead of the second input lead.

Abstract: An optical coupling device includes a power lead with a first portion and a power line portion. A light-emitting element is disposed on the first portion. A ground lead includes a ground line portion and a second portion with a drive circuit disposed thereon. A first input frame in the device includes a first input terminal portion and a first input signal line portion. A second input frame in the device includes a second input terminal portion and a second input signal line portion. The first and second input frames are adjacent to each other and a minimum distance from the first input signal line portion to the first installation portion is greater than a minimum distance from the first input signal line portion to the power line portion.

Abstract: A signal coupling device includes a light-emitting element configured to emit light, a first element to drive the light-emitting element to output an optical signal, and a second element to receive the optical signal from the light-emitting element and to convert the optical signal into an electrical signal. A first silicone gel covers the first semiconductor element. A second silicone gel covers the second semiconductor element. A third silicone gel covers the light-emitting element. The light-emitting element, the first semiconductor element, and the second semiconductor element are encapsulated in resin material, which contacts the first, second, and third silicone gels. The first silicone gel, the second silicone gel, the third silicone gel, and the first resin material, and the resin material are transparent to light emitted by the light-emitting element. The first, second, and third silicone gels are spaced apart from each other.

Abstract: An optical coupler includes an optical transmitting unit and an optical receiving unit in a facing arrangement. The optical transmitting unit includes a power lead having a first die-pad portion, a light emitting element on the first die-pad portion, a ground lead having a second die-pad portion, and an integrated circuit on the second die-pad portion. The integrated circuit has a power pad portion, a light emitting element pad portion, and input pad portions thereon. An inter-center distance between an inner lead of the first input lead and an inner lead of the second input lead is equal to or less than an inter-center distance between an outer lead of the first input lead and an outer lead of the second input lead.

Abstract: An optical coupling device includes a first lead part, a light emitting element mounted on the first lead part, a first wire connected to the first lead part and the light emitting element, a second lead part, a light receiving element fixed to the second lead part, a second wire connected to the second lead part and the light receiving element, and an insulating film configured to allow passage of light emitted from the light emitting element. The insulating film does not make contact with the first lead part, the light emitting element, the first wire, the second lead part, the light receiving element, or the second wire.

Abstract: According to one embodiment, a semiconductor device includes a light-emitting element, a light-receiving element, a primary side lead electrically connected to the light-emitting element, a secondary side lead electrically connected to the light-receiving element and a molded body. The molded body includes an internal resin, an external resin and a light shielding layer. The internal resin covers a portion fixed with the light-emitting element of the primary side lead and a portion fixed with the light-receiving element of the secondary side lead. The external resin covers the internal resin, and shields external light to which the light-receiving element is sensitive. The light shielding layer is provided at a position closer to the second surface than any of the light-emitting element, the light-receiving element, the primary side lead, and the secondary side lead, and shielding the external light.

Abstract: An optical coupling device includes a first lead part, a light emitting element mounted on the first lead part, a first wire connected to the first lead part and the light emitting element, a second lead part, a light receiving element fixed to the second lead part, a second wire connected to the second lead part and the light receiving element, and an insulating film configured to allow passage of light emitted from the light emitting element. The insulating film does not make contact with the first lead part, the light emitting element, the first wire, the second lead part, the light receiving element, or the second wire.