Abstract: There is provided a teaching method for a transfer device configured to transfer a substrate between a transfer source object and a transfer destination object on which the substrate is disposable. The teaching method includes: generating three-dimensional image data of a shape of the transfer source object, a shape of the transfer destination object, and a state of the substrate based on captured image data of the transfer source object, the transfer destination object, and the substrate captured by a capturing unit, and based on design data of the transfer source object, the transfer destination object, and the substrate; and teaching the transfer device based on the three-dimensional image data so that the substrate is transferred between the transfer source object and the transfer destination object without colliding with the transfer source object and the transfer destination object.

Abstract: A leak measurement system measures a leak of a semiconductor manufacturing apparatus. The leak measurement system includes a vibration sensor that contacts or is connected to the semiconductor manufacturing apparatus, an image generation unit that generates a vibration waveform image based on vibration data detected by the vibration sensor, and an analysis unit that analyzes the leak of the semiconductor manufacturing apparatus based on the vibration waveform image generated by the image generation unit.