Abstract: To provide a traveling support system and a traveling support method which can switch a rough traveling support adapted to a rough merging behavior of the merging vehicle, and a traveling support of avoiding a collision between the object vehicle and the merging vehicle, according to conditions. A traveling support system comprising: a merging supporter that supports a traveling of the object vehicle so that a traveling at a time of merging becomes smooth; a collision avoidance supporter that calculates a collision risk and supports a traveling of the object vehicle so that the collision risk decreases; and a traveling support selector that determines whether the traveling support of the merging supporter or the traveling support of the collision avoidance supporter is performed.

Abstract: To provide a lane change prediction system and a lane change prediction method which can predict whether the merging vehicle interrupts on the front side or the back side of the object vehicle. A lane change prediction system, when the peripheral vehicle which exists around the object vehicle is a merging vehicle, predicts whether the merging vehicle interrupts on a front side or a back side of the object vehicle, based on a detection value of the relative position with respect to the object vehicle, a detection value of the relative speed, and a positive or negative of the detection value of the relative speed.

Abstract: There is provided a disc brake device in which a plurality of annular seals that are disposed coaxially with rotation members, in which the annular seals are sandwiched in an axial direction between a caliper and a housing, and in which a position restriction portion includes: at least one caliper-side restriction portion provided on the caliper, which is disposed non-coaxially with the rotation member and is configured to serve as a reference of a position of the rotation member; and at least one housing-side restriction portion provided on the housing, which is disposed non-coaxially with an output member and is configured to serve as a reference of a position of the output member, and is configured to restrict a position of the housing with respect to the caliper by bringing the caliper-side restriction portion and the housing-side restriction portion into contact with each other.

Abstract: An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

Abstract: A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

Abstract: A radio frequency module in which the loop shape of a wire can be stable by disposing a protruding electrode at a bonding ending-point portion when a bonding wire forms a shield between components is provided. A radio frequency module includes a multilayer wiring board, components to mounted on an upper surface of the multilayer wiring board, a shield member formed of a plurality of bonding wires to cover the component, and a protruding electrode provided at a bonding ending-point portion of each of the bonding wires. Since the protruding electrode is provided at the bonding ending-point portion of each of the bonding wires, undesired bending can be prevented on a second bond side of the bonding wire. The shield member to cover side surfaces and a top surface of the component can be easily formed.

Abstract: The present disclosure enables a component to operate stably by making it unlikely that the component will be affected by unwanted electromagnetic waves generated by another component. A module includes: a substrate; a first component and a second component that are mounted on one main surface of the substrate; a sealing resin layer that seals the first component and the second component; and a shield layer that covers part of the sealing resin layer. A recess is formed in the sealing resin layer toward the one main surface from a surface including an upper surface of the sealing resin layer between the first component and the second component in a plan view from a direction perpendicular to the one main surface. The shield layer is not provided in the recess of the sealing resin layer.

Abstract: A high-frequency module (1a) includes a multilayer wiring substrate (2), a plurality of components (3a, 3b) mounted on an upper surface (20a) of the multilayer wiring substrate (2), a sealing resin layer (4) laminated on the upper surface (20a) of the multilayer wiring substrate (2) and sealing the plurality of components (3a, 3b), and a shield (5). The shield (5) is composed of shield walls (5a, 5b) arranged in grooves (12) and (13), respectively, formed between the first component (3a) and the second component (3b) in the sealing resin layer (4) and a connecting conductor (11) coupling both the shield walls (5a, 5b). A first region (40a) and a second region (40b) in the sealing resin layer (4) split by the shield (5) are contiguous at the location of the connecting conductor (11) as seen from a direction perpendicular to the upper surface (20a) of the multilayer wiring substrate (2).

Abstract: A high frequency module 1a includes a wiring board 2, multiple components 3a to 3d mounted on an upper surface 2a of the wiring board 2, a shield component 4 mounted between the component 3b and the component 3c, a sealing resin layer 5 that covers the components 3a to 3d and the shield component 4, and a shield film 6 that covers the surface of the sealing resin layer. A recess 10 is formed in an upper surface 5a of the sealing resin layer 5 so as to expose the shield component 4. The recess 10 is formed within a region surrounded by edges of the sealing resin layer 5 so as not to reach the side surfaces of the sealing resin layer 5. The shield film 6 further covers wall surfaces 10a of the recess 10 and part of the shield component 4 exposed through the recess 10.

Abstract: A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

Abstract: A radio frequency module in which the loop shape of a wire can be stable by disposing a protruding electrode at a bonding ending-point portion when a bonding wire forms a shield between components is provided. A radio frequency module includes a multilayer wiring board, components to mounted on an upper surface of the multilayer wiring board, a shield member formed of a plurality of bonding wires to cover the component, and a protruding electrode provided at a bonding ending-point portion of each of the bonding wires. Since the protruding electrode is provided at the bonding ending-point portion of each of the bonding wires, undesired bending can be prevented on a second bond side of the bonding wire. The shield member to cover side surfaces and a top surface of the component can be easily formed.

Abstract: A high-frequency module 1a includes a multilayer wiring substrate 2, a plurality of components 3a, 3b mounted on an upper surface 20a of the multilayer wiring substrate 2, a sealing resin layer 4 laminated on the upper surface 20a of the multilayer wiring substrate 2 and sealing the plurality of components 3a, 3b, and a shield 5. The shield 5 is composed of shield walls 5a, 5b arranged in grooves 12 and 13, respectively, formed between the first component 3a and the second component 3b in the sealing resin layer 4 and a connecting conductor 11 coupling both the shield walls 5a, 5b. A first region 40a and a second region 40b in the sealing resin layer 4 split by the shield 5 are contiguous at the location of the connecting conductor 11 as seen from a direction perpendicular to the upper surface 20a of the multilayer wiring substrate 2.

Abstract: An antenna-attached substrate according to the present disclosure includes a substrate layer, a lower antenna element that is disposed in the substrate layer, an antenna-holding layer that is stacked on an upper surface of the substrate layer, and an upper antenna element that is disposed in the antenna-holding layer and that faces an upper surface of the lower antenna element. The antenna-holding layer is composed of a dielectric material having a relative dielectric constant lower than that of the substrate layer. A lower surface, a side surface, and an upper surface of the upper antenna element are covered by the antenna-holding layer.

Abstract: A high frequency module 1a includes a wiring board 2, multiple components 3a to 3d mounted on an upper surface 2a of the wiring board 2, a shield component 4 mounted between the component 3b and the component 3c, a sealing resin layer 5 that covers the components 3a to 3d and the shield component 4, and a shield film 6 that covers the surface of the sealing resin layer. A recess 10 is formed in an upper surface 5a of the sealing resin layer 5 so as to expose the shield component 4. The recess 10 is formed within a region surrounded by edges of the sealing resin layer 5 so as not to reach the side surfaces of the sealing resin layer 5. The shield film 6 further covers wall surfaces 10a of the recess 10 and part of the shield component 4 exposed through the recess 10.

Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.

Abstract: The present disclosure enables a component to operate stably by making it unlikely that the component will be affected by unwanted electromagnetic waves generated by another component. A module includes: a substrate; a first component and a second component that are mounted on one main surface of the substrate; a sealing resin layer that seals the first component and the second component; and a shield layer that covers part of the sealing resin layer. A recess is formed in the sealing resin layer toward the one main surface from a surface including an upper surface of the sealing resin layer between the first component and the second component in a plan view from a direction perpendicular to the one main surface. The shield layer is not provided in the recess of the sealing resin layer.

Abstract: The present disclosure improves the adhesive strength of a shield film in a high-frequency module that includes a shield film that shields components from unwanted electromagnetic waves from the outside. A high-frequency module is provided with: a sealing body that includes a multilayer wiring substrate, components that are mounted on an upper surface of the multilayer wiring substrate, and a sealing resin layer that is stacked on the upper surface of the multilayer wiring substrate and covers the components; and a shield film that covers a surface of the sealing resin layer. A side surface of the sealing body has curved surface portions formed so as to have a curved surface shape, and the curved surface portions are roughened with a plurality of grooves.