Abstract: A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Abstract: A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Abstract: A thermosetting electroconductive paste composition includes an electroconductive powder (A) containing at least one of a silver-coated metal powder (A-1) and a powder of either copper or an alloy thereof (A-2), a thermosetting ingredient (B) containing at least one of an epoxy resin (B-1) and a blocked polyisocyanate compound (B-2), a hardener (C), and an alkyl- or alkenylsuccinic acid compound (D) which is a succinic acid or derivative thereof having an alkyl or alkenyl group having a carbon number of from 8 to 24 introduced into an ?-position. An amount of the alkyl- or alkenylsuccinic acid compound is 0.01 to 1.8 parts by mass per 100 parts by mass of a sum of the electroconductive powder (A) and the thermosetting ingredient (B).

Abstract: A thermosetting electroconductive paste composition includes an electroconductive powder (A) containing at least one of a silver-coated metal powder (A-1) and a powder of either copper or an alloy thereof (A-2), a thermosetting ingredient (B) containing at least one of an epoxy resin (B-1) and a blocked polyisocyanate compound (B-2), a hardener (C), and an alkyl- or alkenylsuccinic acid compound (D) which is a succinic acid or derivative thereof having an alkyl or alkenyl group having a carbon number of from 8 to 24 introduced into an ?-position. An amount of the alkyl- or alkenylsuccinic acid compound is 0.01 to 1.8 parts by mass per 100 parts by mass of a sum of the electroconductive powder (A) and the thermosetting ingredient (B).