Patents by Inventor Yuta Nishino

Yuta Nishino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11441668
    Abstract: Provided are a motor device and a method for manufacturing the same that can accurately and consistently provide a support shaft to a case and enhance the strength for fixing the support shaft to the case. A small-diameter part having a smaller diameter than a large-diameter part is formed through drawing. The large-diameter part and a step part are embedded in a gear case. The small-diameter part is exposed outside the gear case. The dimensional accuracy (dimensional tolerance ±?) of the external diameter of the small-diameter part is enhanced. The small-diameter part can be set, without rattling, in a lower mold for molding the gear case. Consequently, the support shaft can be accurately and consistently provided to the gear case. Because the large-diameter part and the step part are embedded in the gear case, the resistance of the support shaft against pulling from the gear case can be enhanced.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: September 13, 2022
    Assignee: MITSUBA Corporation
    Inventors: Hiroyuki Uchimura, Kyohei Ishikawa, Yuta Nishino, Hiroki Aikyo
  • Publication number: 20220112937
    Abstract: Provided are a motor device and a method for manufacturing the same that can accurately and consistently provide a support shaft to a case and enhance the strength for fixing the support shaft to the case. A small-diameter part having a smaller diameter than a large-diameter part is formed through drawing. The large-diameter part and a step part are embedded in a gear case. The small-diameter part is exposed outside the gear case. The dimensional accuracy (dimensional tolerance ±?) of the external diameter of the small-diameter part is enhanced. The small-diameter part can be set, without rattling, in a lower mold for molding the gear case. Consequently, the support shaft can be accurately and consistently provided to the gear case. Because the large-diameter part and the step part are embedded in the gear case, the resistance of the support shaft against pulling from the gear case can be enhanced.
    Type: Application
    Filed: October 8, 2019
    Publication date: April 14, 2022
    Applicant: MITSUBA Corporation
    Inventors: Hiroyuki UCHIMURA, Kyohei ISHIKAWA, Yuta NISHINO, Hiroki AIKYO
  • Patent number: 10395847
    Abstract: An element includes a first substrate and a layer including a first conductive layer with a first conductive portion and a second conductive layer. The element includes a cell including the first conductive portion, a second substrate and a sealing portion. A groove is formed between the first and second conductive layers, the element includes an insulating layer provided between the sealing portion and the first substrate, and an outer circumferential edge of the insulating layer is provided to surround the entire sealing portion. The insulating layer covers and hides a portion of the first conductive layer, which protrudes outside the sealing portion, inside from the outer circumferential edge of the insulating layer and outside the sealing portion, enters the groove and covers a part of the second conductive layer, and the rest of the second conductive layer is exposed.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: August 27, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Yuta Nishino, Keisuke Naka
  • Publication number: 20180330892
    Abstract: An element includes a first substrate and a layer including a first conductive layer with a first conductive portion and a second conductive layer. The element includes a cell including the first conductive portion, a second substrate and a sealing portion. A groove is formed between the first and second conductive layers, the element includes an insulating layer provided between the sealing portion and the first substrate, and an outer circumferential edge of the insulating layer is provided to surround the entire sealing portion. The insulating layer covers and hides a portion of the first conductive layer, which protrudes outside the sealing portion, inside from the outer circumferential edge of the insulating layer and outside the sealing portion, enters the groove and covers a part of the second conductive layer, and the rest of the second conductive layer is exposed.
    Type: Application
    Filed: November 18, 2016
    Publication date: November 15, 2018
    Applicant: Fujikura Ltd.
    Inventors: Yuta Nishino, Keisuke Naka