Abstract: A compound includes metal powder, an epoxy resin, and a wax. The content of the metal powder is from 96 mass % to less than 100 mass %. The wax includes at least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters.

Abstract: A semiconductor manufacturing device includes: a wafer holder for holding a dicing tape to which a die is attached; and a push-up unit having a block unit for pushing up the dicing tape. The block unit includes: an outside block having a first-direction length longer than a second-direction length in a planar view and having a plurality of openings; and an inside block placed inside the openings. The inside blocks are plural and are placed side by side along the first direction.

Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

Abstract: A compound includes metal powder, an epoxy resin, and a wax. The content of the metal powder is from 96 mass % to less than 100 mass %. The wax includes at least one selected from the group consisting of metal salts of lauric acid, metal salts of stearic acid, and saponified montanic acid esters.

Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

Abstract: A non-transitory computer readable medium stores a program causing a computer to execute: saving, among a plurality of character IDs associated with a player ID, a character ID selected by a player operation in a party saving area associated with the player ID; executing a prescribed game by using the character ID stored in the party saving area; creating, on the basis of the fact that the prescribed game has been terminated, game result information including the character ID used when executing the prescribed game; sharing at least one of text information and the game result information between at least two players on the basis of the player operation; displaying the shared text information and game result information; and saving, on the basis of a prescribed operation on the displayed game result information, the character ID included in the game result information in the party saving area associated with the player ID of a player who has performed the operation.

Abstract: A lightweight joining includes a first member that has a first surface and a second surface 1b arranged on the back side of the first surface 1a, and a second member made of a resin material, the first member having a first hole that extends through the first member between the first surface and the second surface, the second member covering a region including the first hole on the first surface of the first member, a region including the first hole on the second surface of the first member, and an inner wall of the first member formed by the first hole, the second member being thus joined to the first member, and the second member having a second hole a diameter of which is smaller than that of the first hole such that the second hole fits into the first hole.

Abstract: An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a carboxylic acid compound that satisfies at least one selected from the group consisting of the following A, B and C below: A: having at least one carboxy group and at least one hydroxy group; B: having at least two carboxy groups; and C: having a structure in which two carboxy groups are condensed by dehydration.

Abstract: An epoxy resin composition, comprising an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a carboxylic acid compound that satisfies at least one selected from the group consisting of the following A, B and C below: A: having at least one carboxy group and at least one hydroxy group; B: having at least two carboxy groups; and C: having a structure in which two carboxy groups are condensed by dehydration.

Abstract: The present invention relates to an epoxy resin composition for electronic parts encapsulation, including the following components (A) to (E), (A) an epoxy resin having an ICI viscosity of from 0.008 to 0.1 Pa·s and an epoxy equivalent of from 100 to 200 g/eq; (B) a phenol resin having an ICI viscosity of from 0.008 to 0.1 Pa·s and a hydroxyl-group equivalent of from 100 to 200 g/eq; (C) a curing accelerator; (D) an inorganic filler; and (E) a silicone compound, in which the component (D) is contained in an amount of from 82 to 88 wt % of the whole of the epoxy resin composition, the component (E) is contained in an amount of from 5 to 15 wt % of the whole of organic components in the epoxy resin composition, and the epoxy resin composition has a gelation time of 15 to 25 seconds.

Abstract: The present invention relates to an epoxy resin composition for electronic component encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent: an allylated phenol resin containing a structural unit (1) shown below and a structural unit (2) shown below, in which a molar ratio [structural unit (1)/[structural unit (1)+structural unit (2)]×100] of the structural unit (1) to a total amount of the structural unit (1) and the structural unit (2) is from 40 to 100%; (C) a curing accelerator; and (D) an inorganic filler, in which the allylated phenol resin as the component (B) has a glass transition temperature of ?5° C. to 70° C.