Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.

Abstract: A distributed station includes receiver circuitry which, in operation, receives information regarding wireless device switching from a terminal via a first wireless device, and controller circuitry which, in operation, determines, based on the information, switching from the first wireless device to a second wireless device and bandwidth part (BWP) aggregation in the second wireless device.

Abstract: A master station device includes a processor that outputs a subcarrier modulation signal, and a transmitter that maps an in-phase (I) component and a quadrature-phase (Q) component of the subcarrier modulation signal to an optical signal to be transmitted to a fronthaul.

Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.

Abstract: Provided is a method for manufacturing a thermoelectric conversion module that eliminates the need for supports and solder materials, allows collective and efficient production of a plurality of thin thermoelectric conversion modules, and includes the following steps (A) to (D): (A) disposing a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material on a support so as to be spaced apart from each other; (B) filling an insulator between the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material to obtain an integrated body including the chip of the P-type thermoelectric conversion material, the chip of the N-type thermoelectric conversion material, and the insulator; (C) peeling the integrated body obtained in step (B) from the support; and (D) connecting the chip of the P-type thermoelectric conversion material and the chip of the N-type thermoelectric conversion material via an electrode in the

Abstract: Proposed are an X-ray inspection apparatus and a method of inspection with X-rays in which foreign objects in even a sample in which bending, sagging, or curving may occur can be inspected accurately. The X-ray inspection apparatus includes an X-ray source (2) which irradiates a sample with an X-ray, an X-ray detection unit (3) that is installed on a side opposite to the X-ray source with respect to the sample and detects the X-ray that passed through the sample, and a sample support mechanism (14) that supports the sample, wherein the sample is flexible and has a shape of a film, and the sample support mechanism has a support body (4) through which the X-ray is capable of passing and which is in close contact with and supports at least a portion of the sample, that is disposed between the X-ray source and the X-ray detection unit.

Abstract: Proposed are an X-ray inspection apparatus and a method of inspection with X-rays in which even in a sample having coated portion and uncoated portion of the cathode material, the inspection of foreign objects in the both portions can be simultaneously performed under the same conditions. The X-ray inspection apparatus includes an X-ray source (2) that irradiates the sample (S) with X-rays (X1), an X-ray detection unit (3) which is installed at a side opposite to the X-ray source with respect to the sample and detects the X-rays that passed through the sample, and a filter (4) installed between the X-ray source and the X-ray detection unit, wherein the sample has a region with a large amount of X-ray absorption and a region with a small amount of X-ray absorption.

Abstract: Provided is a thin thermoelectric conversion module provided with no support base material and including: an integrated body including an insulator configured to fill a gap defined by a chip of a P-type thermoelectric conversion material and a chip of an N-type thermoelectric conversion material, the chips being alternately arranged and spaced apart from each other; a common first electrode provided on one surface of the integrated body and joining one surface of the chip of the P-type thermoelectric conversion material and one surface of the chip of the N-type thermoelectric conversion material; and a common second electrode provided on another surface of the integrated body, facing the first electrode, and joining another surface of the chip of the N-type thermoelectric conversion material and another surface of the chip of the P-type thermoelectric conversion material, in which the first electrode and the second electrode provide electrically serial connection between the chip of the P-type thermoelectric

Abstract: A thermoelectric conversion module including, a first substrate having a first electrode, a second substrate having a second electrode, a chip of a thermoelectric conversion material made from a thermoelectric semiconductor composition, a first bonding material layer made from a first bonding material and bonding one surface of the chip of the thermoelectric conversion material and the first electrode, and a second bonding material layer made from a second bonding material and bonding another surface of the chip of the thermoelectric conversion material and the second electrode. A melting point of the second bonding material is lower than a melting point of the first bonding material, or the melting point of the second bonding material is lower than a curing temperature of the first bonding material.

Abstract: Provided is a thermoelectric conversion module in which heat dissipation is further improved with a simple structure. The thermoelectric conversion module is a thermoelectric conversion module including a first electrode, a P-type thermoelectric element layer and an N-type thermoelectric element layer, and a second electrode disposed opposite the first electrode. The thermoelectric conversion module includes a plurality of PN-junction pairs in which the P-type thermoelectric element layer and the N-type thermoelectric element layer are PN-joined through the first electrode or the second electrode, the plurality of PN-junction pairs being electrically connected in series alternately by the first electrode and the second electrode. An area of the second electrode is larger than an area of the first electrode.

Abstract: A transmission device includes a controller configured to apply transmission schemes to respective divisions of a signal to be transmitted to a fronthaul and a transmitter configured to transmit the signal to the fronthaul. The respective divisions include a first division and a second division, and the controller is configured to apply a transmission scheme having higher error tolerance to the first division and a transmission scheme having lower error tolerance to the second division.

Abstract: A thermoelectric conversion module having a further improved thermoelectric performance is provided. The thermoelectric conversion module includes: a base material; and a thermoelectric element layer including a thermoelectric semiconductor composition, wherein the thermoelectric semiconductor composition includes a thermoelectric semiconductor material, a heat resistant resin A, and an ionic liquid and/or inorganic ionic compound, and wherein the base material has a thermal resistance of 0.35 K/W or less.

Abstract: A chip of thermoelectric conversion material may have a concave portion and may be capable of realizing high joining properties to an electrode. Such a chip of thermoelectric conversion material may have a concave on at least one surface of the chip of thermoelectric conversion material. The shape of such chips of may be rectangular parallelepiped, cubic, and/or columnar shape.

Abstract: Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.

Abstract: A master station device includes a processor that outputs a subcarrier modulation signal, and a transmitter that maps an in-phase (I) component and a quadrature-phase (Q) component of the subcarrier modulation signal to an optical signal to be transmitted to a fronthaul.

Abstract: A base station determines, based on transmission quality information of a fronthaul and channel quality information of a terminal, a resource and a transmission scheme of the fronthaul assigned to the terminal, and controls, based on determined information, the transmission scheme of a signal to be transmitted to the fronthaul using the determined resource.

Abstract: A control device includes reception circuitry which, in operation, receives control information regarding resources to be allocated to a plurality of distributed units, and control circuitry which, in operation, determines, based on the control information, a distributed unit to which a received signal of uplink is to be transferred among the plurality of distributed units.

Abstract: A master station device connected to a secondary station device through a fronthaul includes a first base station signal processor having a first functional split configuration relating to a plurality of base station functional units for a first service type, and a second base station signal processor having a second functional split configuration relating to the plurality of base station functional units for a second service type.

Abstract: A base station includes communication circuitry which, in operation, transmits or receives a reference signal in a plurality of bands using a part of a plurality of antennas, and control circuitry which, in operation, determines which of the plurality of bands to allocate to a terminal, based on a result of measurement using the reference signal.

Abstract: A distributed station includes receiver circuitry which, in operation, receives information regarding wireless device switching from a terminal via a first wireless device, and controller circuitry which, in operation, determines, based on the information, switching from the first wireless device to a second wireless device and bandwidth part (BWP) aggregation in the second wireless device.