Abstract: An information processing method includes: calculating a probability density distribution of a work time that is at least part of a setup time, based on production performance data read from storage, the setup time being time taken for a setup work that is performed between lots; determining whether the work time is anormal, based on the probability density distribution; and outputting a result of the determining.

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes ammonia and an acid or acid salt capable of forming a counterion to an ammonium ion.

Abstract: To provide a method for protecting a Low-E glass plate, the method being capable of preventing or inhibiting alteration of Low-E layers. Provided is a Low-E glass plate protection method. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes an adsorbent capable of adsorbing ammonia.

Abstract: A skill evaluation device includes: a first extractor that obtains first information indicating one or more types of first products, machines used in the production, and skill indicators of workers involved in the production; a model generator that generates an estimation model for estimating a standard probability distribution of a skill indicator; an aggregator that calculates a skill indicator by aggregating production records of the specified worker; an indicator estimator that estimates a probability distribution of the skill indicator for the specified worker by providing, as input data to the estimation model, second information indicating: one or more types of second products the specified worker has been involved in production; and one or more machines used by the specified worker; and an evaluator that calculates a deviation degree between the probability distribution estimated by the indicator estimator and the skill indicator calculated by the aggregator.

Abstract: A pressure-sensitive adhesive sheet includes a resin film as a substrate and a pressure-sensitive adhesive layer provided on a first face of the substrate. In the pressure-sensitive adhesive sheet, a second face of the substrate is a release face, and the second face has a slip resistance value of 3.5 N or more. The pressure-sensitive adhesive sheet has a high-speed peel strength of 4.5 N/20 mm or higher, which is measured under conditions of a tensile speed of 30 m/min after 30 minutes of application to a stainless steel plate, and it has a difference between the maximum and minimum values of a self-backside adhesive strength of 1.5 N/20 mm or lower, which is measured under a condition of a tensile speed of 30 m/min.

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. In the protection method, a protective sheet having a substrate and a PSA layer provided to at least one face of the substrate is applied for protection via the PSA layer to a Low-E glass plate having a Low-E layer that comprises a zinc component. The method is characterized by using the protective sheet wherein the PSA layer is formed from a water-dispersed PSA composition and includes less than 850 ?g ammonia per gram of PSA layer weight.

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting Low-E layer alteration. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a zinc component. Here, the protective sheet has a PSA layer. The Low-E layer comprises a zinc component. The PSA layer includes ammonia and an acid or acid salt capable of forming a counterion to an ammonium ion.

Abstract: Provided is a Low-E glass plate protection method capable of preventing or inhibiting alteration and erosion of Low-E layers. The protection method includes a step of applying a protective sheet to a surface of a Low-E glass plate having a Low-E layer comprising a tin component. Here, the Low-E layer comprises a tin component. The protective sheet has a PSA layer. The PSA layer comprises a phosphorus compound having a P—OR group. Here, R is a hydrogen atom or an organic group.

Abstract: Provided is a PSA sheet that can be used on a metal adherend because it has anti-metal-corrosive properties and can also maintain good removability while preventing or inhibiting adherend surface contamination even when prolongedly adhered to the adherend. A PSA sheet having a PSA layer is provided. The PSA layer comprises at least 95% base polymer by weight and has a chloride ion amount of less than 300 ?g per gram of pressure-sensitive adhesive layer, determined by hot water extraction.

Abstract: Provided is a Low-E glass plate protective sheet having excellent long-term reliability. A Low-E glass plate protective sheet is provided. The protective sheet has a PSA layer. The PSA layer has a chloride ion amount of 105 ?g or less per gram of PSA, determined by hot water extraction.

Abstract: Provided is a Low-E glass plate protective sheet that can have protective properties for a Low-E glass plate as an object to be protected and can maintain good removability while preventing or inhibiting surface contamination of the object to be protected even when prolongedly adhered thereto. The Low-E glass plate protective sheet is provided. The protective sheet has a PSA layer. The PSA layer comprises at least 95% base polymer by weight.

Abstract: Provided is a method for preparing a PSA composition for protecting Low-E glass plates from degradation and corrosion. A PSA composition preparation method is provided for Low-E glass plate protection. The method comprises a step of obtaining an aqueous liquid, and a step of obtaining a polymer-containing liquid comprising the aqueous liquid and a polymer. Here, the aqueous liquid satisfies at least (a) having an electrical conductivity below 300 ?S/cm or (b) having a chloride ion concentration below 35 ?g/mL.

Abstract: The heat-shielding heat insulating substrate is a heat-shielding heat insulating substrate including a transparent substrate layer and an infrared reflection layer, the heat-shielding heat insulating substrate including: a protective topcoat layer arranged on a side of the infrared reflection layer opposite to the transparent substrate layer; and a protective film arranged on a surface of the protective topcoat layer opposite to the infrared reflection layer, wherein a 180° peel strength of the protective film to the protective topcoat layer under an environment having a temperature of 23±1° C. and a humidity of 50±5% RH is from 0.01 N/50 mm to 0.40 N/50 mm, and wherein a 180° peel strength of the protective film to the protective topcoat layer after storage of the heat-shielding heat insulating substrate under an environment having a temperature of 80±1° C. for 10 days is from 0.01 N/50 mm to 1.0 N/50 mm.

Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Abstract: Disclosed is a cured multilayer sheet production method, comprising adjacently laminating a first uncured layer formed by a first curable resin and a second uncured layer formed by a second curable resin to form a laminated body, wherein the first curable resin contains a first monomer or partial polymer thereof, and an immiscible substance, the second curable resin contains a second monomer and polymer, the first monomer concentration in the first curable resin is higher than the polymerizable monomer concentration in the second curable resin, wherein in the laminating step, the immiscible substance is eccentrically distributed on or near an interface on the side opposite to the second uncured layer, and thereafter curing the layers, so that a cured multilayer sheet, wherein a substance different from a polymer cured layer is eccentrically located on the surface of the polymer cured layer, is produced at high productivity.

Abstract: An object of the present invention is to obtain a pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet which is capable of free design of a pressure-sensitive adhesive and is peelable after use without adding special components to the pressure-sensitive adhesive, and to obtain a base material for use in such a pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet. The base material for pressure-sensitive adhesive tape or pressure-sensitive adhesive sheet according to the present invention, the base material being a composite film containing a urethane polymer having an acryloyl group at its molecular chain end and a (meth)acrylic polymer, in which the composite film has a water absorption ratio of 5% or more. A (meth)acrylic monomer for forming the (meth)acrylic polymer preferably contains at least one compound selected from the group consisting of (meth)acrylic acid and (meth)acryloylmorpholine.

Abstract: The present invention provides a resin material which can be used for a pressure-sensitive adhesive sheet for protecting a semiconductor wafer and the like, does not cause curve (warpage) in the semiconductor wafer when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer in a peeling operation. The resin material shall be a viscoelastic body containing a copolymer of a urethane polymer and an acrylic polymer, which is formed through a monomer having a functional group that can form a urethane bond with a urethane polymer and having an activated carbon double bond that can copolymerize with a (meth)acryloyl group, in one molecule.

Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet has one face having tackiness, does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Abstract: The present invention provides a pressure-sensitive adhesive sheet for protecting a semiconductor wafer, which does not cause curve (warpage) in the semiconductor wafer, when the semiconductor wafer is ground, is excellent in followability to a pattern, has adequate stress dispersibility in a grinding operation, suppresses the crack in a wafer and chipping in a wafer edge, and does not leave a residue of a tackiness agent on the surface of the wafer. The protective sheet does not have an interface existing between a substrate and the tackiness agent and is made of one layer, and the pressure-sensitive adhesive sheet has different tack strengths on both faces from each other.

Abstract: The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.