Abstract: A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

Abstract: The invention provides a cured film and a positive type photosensitive resin composition unlikely to cause a decrease in light emission luminance or shrinkage of pixels and high in long term reliability. [Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less.

Abstract: The invention provides a cured film and a positive type photosensitive resin composition unlikely to cause a decrease in light emission luminance or shrinkage of pixels and high in long term reliability. [Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less.

Abstract: The objective is to provide a direct drawing-type waterless lithographic printing original plate which is highly sensitive and is not susceptible to formation of blisters, namely a direct drawing-type waterless lithographic printing original plate which has a wide latitude. Provided is a direct drawing-type waterless lithographic printing original plate which has at least a heat-sensitive layer and a silicone rubber layer on a substrate in this order. The direct drawing-type waterless lithographic printing original plate is characterized in that the heat-sensitive layer contains non-photosensitive particles and the average particle diameter of the non-photosensitive particles is not less than ½ of the average film thickness of a portion of the heat-sensitive layer where the non-photosensitive particles are not present.

Abstract: A directly imageable waterless lithographic printing plate precursor includes at least a heat sensitive layer and a silicone rubber layer formed on a substrate in this order, wherein the heat sensitive layer contains at least a novolac resin, a polyurethane and a light-to-heat conversion material, and also has a phase separation structure including at least a phase containing a novolac resin and a phase containing a polyurethane. The directly imageable waterless lithographic printing plate precursor has high sensitivity and is less likely to cause blister, that is, having wide latitude.

Abstract: The objective is to provide a direct drawing-type waterless lithographic printing original plate which is highly sensitive and is not susceptible to formation of blisters, namely a direct drawing-type waterless lithographic printing original plate which has a wide latitude. Provided is a direct drawing-type waterless lithographic printing original plate which has at least a heat-sensitive layer and a silicone rubber layer on a substrate in this order. The direct drawing-type waterless lithographic printing original plate is characterized in that the heat-sensitive layer contains non-photosensitive particles and the average particle diameter of the non-photosensitive particles is not less than ½ of the average film thickness of a portion of the heat-sensitive layer where the non-photosensitive particles are not present.

Abstract: Provided is a directly imageable waterless planographic printing plate precursor that comprises at least a heat sensitive layer and a silicone rubber layer formed on a substrate in this order and has a high sensitivity not only immediately after the precursor production but also after the passage of time. In the directly imageable waterless planographic printing plate precursor, the heat sensitive layer contains liquid bubbles filled with a liquid with a boiling point in the range of 210 to 270° C. Also provided is a production method for making a directly imageable waterless planographic printing plate precursor.

Abstract: A directly imageable waterless planographic printing plate precursor includes at least a heat sensitive layer and a silicone rubber layer formed on a substrate in this order and has a high sensitivity not only immediately after the precursor production but also after the passage of time. In the directly imageable waterless planographic printing plate precursor, the heat sensitive layer contains liquid bubbles filled with a liquid with a boiling point in the range of 210 to 270° C. A production method comprises applying a solution of a heat sensitive layer composition containing a solvent with a solubility parameter of 17.0 (MPa)1/2 or less and a boiling point in the range of 210 to 270° C. and a solvent with a solubility parameter of more than 17.