Abstract: A motor controller includes an H-bridge circuit, a switching-element driving circuit, a motor-current detection circuit, a sample hold circuit executing a sample hold of an output of the motor-current detection circuit at every half period and outputting the output of the motor-current detection circuit as a first signal and a second signal, according to a PWM output timing of the switching-element driving circuit, and a motor-current calculation circuit selecting a signal that is larger between the first signal and the second signal as a selection signal, calculating a value of the selection signal as an absolute value of a motor current, determining a current direction based on a relation between the selection signal and a PWM output signal at a sample timing that the selection signal is obtained.

Abstract: A motor controller includes an H-bridge circuit, a switching-element driving circuit, a motor-current detection circuit, a sample hold circuit executing a sample hold of an output of the motor-current detection circuit at every half period and outputting the output of the motor-current detection circuit as a first signal and a second signal, according to a PWM output timing of the switching-element driving circuit, and a motor-current calculation circuit selecting a signal that is larger between the first signal and the second signal as a selection signal, calculating a value of the selection signal as an absolute value of a motor current, determining a current direction based on a relation between the selection signal and a PWM output signal at a sample timing that the selection signal is obtained.

Abstract: An electronic control unit includes a substrate, a semiconductor module, a heat storage body, an insulator, and a heat sink. The substrate includes a wiring and a land. The semiconductor module includes a semiconductor chip working as a switching element, a terminal electrically coupled with the semiconductor chip and the wiring, a molded resin sealing the semiconductor chip and the terminal, and a heat radiation plate having a surface exposed from the molded resin and transferring heat generated at the semiconductor chip. The heat storage body has a heat capacity required to store the heat generated at the semiconductor chip. The heat storage body is coupled with the heat radiation plate. The insulator is in contact with the heat storage body or the semiconductor module. The heat sink is in contact with the insulator.