Patents by Inventor Yutaka Gou

Yutaka Gou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE COMPOSITION, BONDING MEMBER USING THE ADHESIVE COMPOSITION, SUPPORT MEMBER FOR SEMICONDUCTOR MOUNTING, SEMICONDUCTOR DEVICE, AND PROCESSES FOR PRODUCING THESE
    Publication number: 20110001251
    Abstract: Disclosed is an adhesive composition, comprising, as essential components, a thermosetting resin component A and a high-molecular component B which are evenly compatible and miscible with each other at a temperature of 5 to 40° C. without being separated from each other, and a curing agent component C, wherein after the adhesive composition comes into contact with an adherend and after the thermosetting resin component A is cured, the thermosetting resin component A is separated, in the adhesive composition, into particulate structures wherein the concentration of the thermosetting resin component A is larger than that in the surrounding of the particulate structures, and further the particulate structures are formed in a larger amount near a surface of the composition which contacts the adherend than inside the adhesive composition. The adhesive composition can be used in thin-film bonding.
    Type: Application
    Filed: July 3, 2008
    Publication date: January 6, 2011
    Inventors: Yutaka Gou, Kazuhiro Miyauchi, Takashi Inoue, Atsushi Takahara, Hiroshi Jinnai