Patents by Inventor Yutaka Higashimura
Yutaka Higashimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9097768Abstract: With a rotating electric machine testing method for applying a test voltage to an armature winding of the rotating electric machine to thereby test insulation performance of the armature winding, in the case where a rated voltage of the armature winding of the rotating electric machine is E, and an insulation test voltage of an armature winding of a sine wave voltage drive rotating electric machine at the rated voltage E is E/?{square root over (3)} or E, a test voltage Vtest applied to an armature winding of the inverter drive rotating electric machine is set to Vtest=?·E/?{square root over (3)} or Vtest?=?·E, respectively, provided that ?(=tinv/tsin), if the insulation thicknesses of the sine wave drive rotating electric machine is tsin and of the inverter drive rotating electric machine is tinv, thereby conducting a test on any of the AC voltage-current characteristic, AC tan ?, and AC partial-discharge characteristics.Type: GrantFiled: September 14, 2012Date of Patent: August 4, 2015Assignee: HITACHI, LTD.Inventors: Koji Obata, Yutaka Higashimura, Keiji Suzuki
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Patent number: 9018970Abstract: In a rotating electrical machine, a conductive foil or conductive rubber is applied to the surface of insulation layer of a conductor series connection area or to the surface of insulation layer of a turn conductor of coils of rotating electrical machine winding, waveforms of grounding voltages of the individual turn conductor portions are measured through the medium of an electrostatic capacitance of the insulation layer of coil conductor series connection area or through the medium of the insulation layer of coil turn conductor, and a partial discharge is measured while measuring a voltage developing in the coil or across a winding turn in the coil from a difference between the waveforms of grounding voltages.Type: GrantFiled: January 19, 2012Date of Patent: April 28, 2015Assignee: Hitachi, Ltd.Inventors: Koji Obata, Yutaka Higashimura, Keiji Suzuki
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Publication number: 20130093457Abstract: With a rotating electric machine testing method for applying a test voltage to an armature winding of the rotating electric machine to thereby test insulation performance of the armature winding, in the case where a rated voltage of the armature winding of the rotating electric machine is E, and an insulation test voltage of an armature winding of a sine wave voltage drive rotating electric machine at the rated voltage E is E/?{square root over (3)} or E, a test voltage Vtest applied to an armature winding of the inverter drive rotating electric machine is set to Vtest=?·E/?{square root over (3)} or Vtest?=?·E, respectively, provided that ?(=tinv/tsin), if the insulation thicknesses of the sine wave drive rotating electric machine is tsin and of the inverter drive rotating electric machine is tinv, thereby conducting a test on any of the AC voltage-current characteristic, AC tan ?, and AC partial-discharge characteristics.Type: ApplicationFiled: September 14, 2012Publication date: April 18, 2013Applicant: HITACHI, LTD.Inventors: Koji OBATA, Yutaka HIGASHIMURA, Keiji SUZUKI
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Publication number: 20120182040Abstract: In a rotating electrical machine, a conductive foil or conductive rubber is applied to the surface of insulation layer of a conductor series connection area or to the surface of insulation layer of a turn conductor of coils of rotating electrical machine winding, waveforms of grounding voltages of the individual turn conductor portions are measured through the medium of an electrostatic capacitance of the insulation layer of coil conductor series connection area or through the medium of the insulation layer of coil turn conductor, and a partial discharge is measured while measuring a voltage developing in the coil or across a winding turn in the coil from a difference between the waveforms of grounding voltages.Type: ApplicationFiled: January 19, 2012Publication date: July 19, 2012Inventors: Koji OBATA, Yutaka Higashimura, Keiji Suzuki
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Publication number: 20110212233Abstract: This invention provides an acid-resistant malt extract useful to add a clear or transparent color to acidic food and beverage having a pH value of not less than 2 and less than 4.6, without generating suspended or sedimented insoluble matter; and a manufacturing method therefor. The malt extract of the present invention is obtained by adjusting the particle diameter of insoluble particles contained in the malt extract to less than 0.9 ?m by way of, for example, filtering an untreated liquid malt extract or a treated liquid thereof using a filter having a pore diameter of 0.9 ?m or less.Type: ApplicationFiled: November 17, 2009Publication date: September 1, 2011Applicant: SAN-EI GEN F.F.I., INC.Inventors: Yutaka Higashimura, Kenta Kurihara, Keiko Yamada, Chika Maeda
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Patent number: 7804218Abstract: When a rotating electrical machine winding is inserted into a slot with a protective insulation intervening between them, a semiconductive insulating layer is lap-wound between an interlayer insulating layer of the rotating electrical machine winding and the protective insulation, the semiconductive insulating layer being formed by center-folding a continuous semiconductive sheet in the longitudinal direction. A thermal stress relaxation layer is provided inside the center-folded continuous semiconductive sheet so that thermal stress exerted in thickness direction of the insulating layers is absorbed.Type: GrantFiled: November 7, 2007Date of Patent: September 28, 2010Assignee: Hitachi, Ltd.Inventors: Yutaka Higashimura, Yoshimi Kurahara, Hiroshi Miyao, Keiji Suzuki, Mitsuru Onoda, Nobuaki Tanaka
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Publication number: 20080106157Abstract: When a rotating electrical machine winding is inserted into a slot with a protective insulation intervening between them, a semiconductive insulating layer is lap-wound between an interlayer insulating layer of the rotating electrical machine winding and the protective insulation, the semiconductive insulating layer being formed by center-folding a continuous semiconductive sheet in the longitudinal direction. A thermal stress relaxation layer is provided inside the center-folded continuous semiconductive sheet so that thermal stress exerted in thickness direction of the insulating layers is absorbed.Type: ApplicationFiled: November 7, 2007Publication date: May 8, 2008Inventors: Yutaka Higashimura, Yoshimi Kurahara, Hiroshi Miyao, Keiji Suzuki, Mitsuru Onoda, Nobuaki Tanaka
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Patent number: 7141741Abstract: A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.Type: GrantFiled: September 22, 2003Date of Patent: November 28, 2006Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
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Publication number: 20040056349Abstract: A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.Type: ApplicationFiled: September 22, 2003Publication date: March 25, 2004Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
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Publication number: 20030215550Abstract: The present invention provide an anti-fading agent for a pigment, characterized by comprising as active ingredients at least one oligosaccharide selected from the group consisting of nigerooligosaccharide, maltooligosaccharide and panose, when so required, in addition of an antioxidant. The anti-fading agent of the invention can advantageously inhibit fading in colors (including fading in colors by light irradiation and heat treatment) of natural pigments such as anthocyanin-based pigments, flavonoid-based pigments, carotenoid-based pigments and the like, and is useful for colored beverage and food products, pharmaceutical drugs, cosmetics and the like with which the fading in colors may be a problem.Type: ApplicationFiled: April 10, 2003Publication date: November 20, 2003Applicant: SAN-EI GEN F.F.I., INCInventors: Yutaka Higashimura, Kazuhiro Emura, Noriko Kuze, Junko Shirai, Takatoshi Koda
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Patent number: 6572906Abstract: The present invention provide an anti-fading agent for a pigment, characterized by comprising as active ingredients at least one oligosaccharide selected from the group consisting of nigerooligosaccharide, maltooligosaccharide and panose, when so required, in addition of an antioxidant. The anti-fading agent of the invention can advantageously inhibit fading in colors (including fading in colors by light irradiation and heat treatment) of natural pigments such as anthocyanin-based pigments, flavonoid-based pigments, carotenoid-based pigments and the like, and is useful for colored beverage and food products, pharmaceutical drugs, cosmetics and the like with which the fading in colors may be a problem.Type: GrantFiled: June 16, 2000Date of Patent: June 3, 2003Assignee: San-Ei Gen F.F.I., Inc.Inventors: Yutaka Higashimura, Kazuhiro Emura, Noriko Kuze, Junko Shirai, Takatoshi Koda
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Publication number: 20030016502Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements beingType: ApplicationFiled: March 20, 2002Publication date: January 23, 2003Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
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Patent number: 6434008Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements beingType: GrantFiled: August 27, 1998Date of Patent: August 13, 2002Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
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Patent number: 6379729Abstract: Disclosed is a water-soluble color-stabilized food containing ascorbic acid or its salt and at least one water-soluble color selected from the group consisting of coal-tar color, anthocyanin color and carthamus yellow, said food further containing sorbic acid and/or its salt and/or a salt of sulfurous acid so that the fading of the water-soluble color can be prevented and the stability thereof can be increased.Type: GrantFiled: September 15, 1998Date of Patent: April 30, 2002Assignee: San-Ei Gen F.F.I., Inc.Inventors: Kuniyoshi Onishi, Yutaka Higashimura, Yoshiko Kumazawa
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Patent number: 5956231Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements beingType: GrantFiled: October 4, 1995Date of Patent: September 21, 1999Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
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Patent number: 5691058Abstract: An electrically insulated coil, characterized in that an electrical insulation layer wound around an electrical conductor is formed by laminating layers of glass flakes having a thickness of 0.2-1 .mu.m and a diameter of 40-250 .mu.m on a backing member of a sheet-like electrical insulation material and by impregnating with a semi-cured thermosetting resin. An electrically insulated coil is provided, having an excellent partial discharge resistance as well as having a high dielectric break down strength even when subjected to a large mechanical distortion.Type: GrantFiled: January 9, 1995Date of Patent: November 25, 1997Assignee: Hitachi, Ltd.Inventors: Hiroshi Miyao, Yutaka Higashimura, Makoto Takamura, Takanori Satoo, Hiroyuki Kamiya, Mitsuru Onoda
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Patent number: 4492889Abstract: A stator of a submerged motor is provided with cylinders formed of carbon fiber reinforced plastics of superhigh precision. To obtain flawless joints between the cylinders of carbon fiber reinforced plastics and the end covers increased wall thickness portions are provided at opposite axial end portions of an inner cylinder near joints of the inner cylinder with the end covers, one increased wall thickness portion being located at one axial end portion on an outer side surface thereof and the other increased wall thickness portion being located at the other axial end portion on an inner side surface thereof. Thus, the inner cylinder has a small wall thickness at an axial central portion to reduce an eddy current loss while its wall thickness is increased at the opposite axial end portions to improve mechanical strength and facilitate joining of the end covers to the inner cylinder.Type: GrantFiled: November 17, 1983Date of Patent: January 8, 1985Assignee: Hitachi, Ltd.Inventors: Keiji Fukushi, Yutaka Higashimura, Shinei Huzioka, Syuzou Iwaasa, Kenzo Kadotani