Patents by Inventor Yutaka Higashimura

Yutaka Higashimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9097768
    Abstract: With a rotating electric machine testing method for applying a test voltage to an armature winding of the rotating electric machine to thereby test insulation performance of the armature winding, in the case where a rated voltage of the armature winding of the rotating electric machine is E, and an insulation test voltage of an armature winding of a sine wave voltage drive rotating electric machine at the rated voltage E is E/?{square root over (3)} or E, a test voltage Vtest applied to an armature winding of the inverter drive rotating electric machine is set to Vtest=?·E/?{square root over (3)} or Vtest?=?·E, respectively, provided that ?(=tinv/tsin), if the insulation thicknesses of the sine wave drive rotating electric machine is tsin and of the inverter drive rotating electric machine is tinv, thereby conducting a test on any of the AC voltage-current characteristic, AC tan ?, and AC partial-discharge characteristics.
    Type: Grant
    Filed: September 14, 2012
    Date of Patent: August 4, 2015
    Assignee: HITACHI, LTD.
    Inventors: Koji Obata, Yutaka Higashimura, Keiji Suzuki
  • Patent number: 9018970
    Abstract: In a rotating electrical machine, a conductive foil or conductive rubber is applied to the surface of insulation layer of a conductor series connection area or to the surface of insulation layer of a turn conductor of coils of rotating electrical machine winding, waveforms of grounding voltages of the individual turn conductor portions are measured through the medium of an electrostatic capacitance of the insulation layer of coil conductor series connection area or through the medium of the insulation layer of coil turn conductor, and a partial discharge is measured while measuring a voltage developing in the coil or across a winding turn in the coil from a difference between the waveforms of grounding voltages.
    Type: Grant
    Filed: January 19, 2012
    Date of Patent: April 28, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Koji Obata, Yutaka Higashimura, Keiji Suzuki
  • Publication number: 20130093457
    Abstract: With a rotating electric machine testing method for applying a test voltage to an armature winding of the rotating electric machine to thereby test insulation performance of the armature winding, in the case where a rated voltage of the armature winding of the rotating electric machine is E, and an insulation test voltage of an armature winding of a sine wave voltage drive rotating electric machine at the rated voltage E is E/?{square root over (3)} or E, a test voltage Vtest applied to an armature winding of the inverter drive rotating electric machine is set to Vtest=?·E/?{square root over (3)} or Vtest?=?·E, respectively, provided that ?(=tinv/tsin), if the insulation thicknesses of the sine wave drive rotating electric machine is tsin and of the inverter drive rotating electric machine is tinv, thereby conducting a test on any of the AC voltage-current characteristic, AC tan ?, and AC partial-discharge characteristics.
    Type: Application
    Filed: September 14, 2012
    Publication date: April 18, 2013
    Applicant: HITACHI, LTD.
    Inventors: Koji OBATA, Yutaka HIGASHIMURA, Keiji SUZUKI
  • Publication number: 20120182040
    Abstract: In a rotating electrical machine, a conductive foil or conductive rubber is applied to the surface of insulation layer of a conductor series connection area or to the surface of insulation layer of a turn conductor of coils of rotating electrical machine winding, waveforms of grounding voltages of the individual turn conductor portions are measured through the medium of an electrostatic capacitance of the insulation layer of coil conductor series connection area or through the medium of the insulation layer of coil turn conductor, and a partial discharge is measured while measuring a voltage developing in the coil or across a winding turn in the coil from a difference between the waveforms of grounding voltages.
    Type: Application
    Filed: January 19, 2012
    Publication date: July 19, 2012
    Inventors: Koji OBATA, Yutaka Higashimura, Keiji Suzuki
  • Publication number: 20110212233
    Abstract: This invention provides an acid-resistant malt extract useful to add a clear or transparent color to acidic food and beverage having a pH value of not less than 2 and less than 4.6, without generating suspended or sedimented insoluble matter; and a manufacturing method therefor. The malt extract of the present invention is obtained by adjusting the particle diameter of insoluble particles contained in the malt extract to less than 0.9 ?m by way of, for example, filtering an untreated liquid malt extract or a treated liquid thereof using a filter having a pore diameter of 0.9 ?m or less.
    Type: Application
    Filed: November 17, 2009
    Publication date: September 1, 2011
    Applicant: SAN-EI GEN F.F.I., INC.
    Inventors: Yutaka Higashimura, Kenta Kurihara, Keiko Yamada, Chika Maeda
  • Patent number: 7804218
    Abstract: When a rotating electrical machine winding is inserted into a slot with a protective insulation intervening between them, a semiconductive insulating layer is lap-wound between an interlayer insulating layer of the rotating electrical machine winding and the protective insulation, the semiconductive insulating layer being formed by center-folding a continuous semiconductive sheet in the longitudinal direction. A thermal stress relaxation layer is provided inside the center-folded continuous semiconductive sheet so that thermal stress exerted in thickness direction of the insulating layers is absorbed.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: September 28, 2010
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Higashimura, Yoshimi Kurahara, Hiroshi Miyao, Keiji Suzuki, Mitsuru Onoda, Nobuaki Tanaka
  • Publication number: 20080106157
    Abstract: When a rotating electrical machine winding is inserted into a slot with a protective insulation intervening between them, a semiconductive insulating layer is lap-wound between an interlayer insulating layer of the rotating electrical machine winding and the protective insulation, the semiconductive insulating layer being formed by center-folding a continuous semiconductive sheet in the longitudinal direction. A thermal stress relaxation layer is provided inside the center-folded continuous semiconductive sheet so that thermal stress exerted in thickness direction of the insulating layers is absorbed.
    Type: Application
    Filed: November 7, 2007
    Publication date: May 8, 2008
    Inventors: Yutaka Higashimura, Yoshimi Kurahara, Hiroshi Miyao, Keiji Suzuki, Mitsuru Onoda, Nobuaki Tanaka
  • Patent number: 7141741
    Abstract: A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: November 28, 2006
    Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.
    Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
  • Publication number: 20040056349
    Abstract: A semiconductor device in which electrodes of a plurality of semiconductor elements are bonded onto at least one of a plurality of electrode patterns on an insulator substrate, the other surface of the insulator substrate being bonded to a heat dissipating base. The upper surface of the heat dissipating base is covered with a member for cutting off the semiconductor elements from the outer environment. Terminals electrically connect the electrodes on said insulator substrate and the electrode placed outside the cutoff member. The material of the heat dissipating base has a linear expanding coefficient larger than that of the semiconductor element and smaller than three times that of the semiconductor element, and a thermal conductivity larger than 100 W/mK. The semiconductor elements are arranged on at least one electrode surface and in at least two regions divided by the other electrode surface on the insulator substrate.
    Type: Application
    Filed: September 22, 2003
    Publication date: March 25, 2004
    Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
  • Publication number: 20030215550
    Abstract: The present invention provide an anti-fading agent for a pigment, characterized by comprising as active ingredients at least one oligosaccharide selected from the group consisting of nigerooligosaccharide, maltooligosaccharide and panose, when so required, in addition of an antioxidant. The anti-fading agent of the invention can advantageously inhibit fading in colors (including fading in colors by light irradiation and heat treatment) of natural pigments such as anthocyanin-based pigments, flavonoid-based pigments, carotenoid-based pigments and the like, and is useful for colored beverage and food products, pharmaceutical drugs, cosmetics and the like with which the fading in colors may be a problem.
    Type: Application
    Filed: April 10, 2003
    Publication date: November 20, 2003
    Applicant: SAN-EI GEN F.F.I., INC
    Inventors: Yutaka Higashimura, Kazuhiro Emura, Noriko Kuze, Junko Shirai, Takatoshi Koda
  • Patent number: 6572906
    Abstract: The present invention provide an anti-fading agent for a pigment, characterized by comprising as active ingredients at least one oligosaccharide selected from the group consisting of nigerooligosaccharide, maltooligosaccharide and panose, when so required, in addition of an antioxidant. The anti-fading agent of the invention can advantageously inhibit fading in colors (including fading in colors by light irradiation and heat treatment) of natural pigments such as anthocyanin-based pigments, flavonoid-based pigments, carotenoid-based pigments and the like, and is useful for colored beverage and food products, pharmaceutical drugs, cosmetics and the like with which the fading in colors may be a problem.
    Type: Grant
    Filed: June 16, 2000
    Date of Patent: June 3, 2003
    Assignee: San-Ei Gen F.F.I., Inc.
    Inventors: Yutaka Higashimura, Kazuhiro Emura, Noriko Kuze, Junko Shirai, Takatoshi Koda
  • Publication number: 20030016502
    Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being
    Type: Application
    Filed: March 20, 2002
    Publication date: January 23, 2003
    Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
  • Patent number: 6434008
    Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: August 13, 2002
    Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.
    Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
  • Patent number: 6379729
    Abstract: Disclosed is a water-soluble color-stabilized food containing ascorbic acid or its salt and at least one water-soluble color selected from the group consisting of coal-tar color, anthocyanin color and carthamus yellow, said food further containing sorbic acid and/or its salt and/or a salt of sulfurous acid so that the fading of the water-soluble color can be prevented and the stability thereof can be increased.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: April 30, 2002
    Assignee: San-Ei Gen F.F.I., Inc.
    Inventors: Kuniyoshi Onishi, Yutaka Higashimura, Yoshiko Kumazawa
  • Patent number: 5956231
    Abstract: A semiconductor device in which a plurality of semiconductor elements are bonded onto at least one electrode pattern on an insulator substrate formed a plurality of electrode patterns on the main surface, each of the electrodes of the semiconductor element being electrically connected to the electrode pattern, the other surface of the insulator substrate being bonded to a heat dissipating base, the upper surface of the heat dissipating base being covered with a member for cutting off the semiconductor elements from the outer environment, terminals electrically connecting the electrodes on said insulator substrate and the electrode placed outside the cutoff member being provided, wherein the material of the heat dissipating base has a linear expanding coefficient larger than the linear expansion coefficient of the semiconductor element and smaller than three times of the linear expansion coefficient of the semiconductor element, and a thermal conductivity larger than 100 W/mK, the semiconductor elements being
    Type: Grant
    Filed: October 4, 1995
    Date of Patent: September 21, 1999
    Assignees: Hitachi, Ltd., Hitachi Haramachi Electronics Co., Ltd.
    Inventors: Kazuji Yamada, Akira Tanaka, Ryuichi Saito, Yasutoshi Kurihara, Tadao Kushima, Takashi Haramaki, Yoshihiko Koike, Takashi Hosokawa, Mamoru Sawahata, Masahiro Koizumi, Jin Onuki, Kazuhiro Suzuki, Isao Kobayashi, Hideo Shimizu, Yutaka Higashimura, Shigeki Sekine, Nobuya Koike, Hideya Kokubun
  • Patent number: 5691058
    Abstract: An electrically insulated coil, characterized in that an electrical insulation layer wound around an electrical conductor is formed by laminating layers of glass flakes having a thickness of 0.2-1 .mu.m and a diameter of 40-250 .mu.m on a backing member of a sheet-like electrical insulation material and by impregnating with a semi-cured thermosetting resin. An electrically insulated coil is provided, having an excellent partial discharge resistance as well as having a high dielectric break down strength even when subjected to a large mechanical distortion.
    Type: Grant
    Filed: January 9, 1995
    Date of Patent: November 25, 1997
    Assignee: Hitachi, Ltd.
    Inventors: Hiroshi Miyao, Yutaka Higashimura, Makoto Takamura, Takanori Satoo, Hiroyuki Kamiya, Mitsuru Onoda
  • Patent number: 4492889
    Abstract: A stator of a submerged motor is provided with cylinders formed of carbon fiber reinforced plastics of superhigh precision. To obtain flawless joints between the cylinders of carbon fiber reinforced plastics and the end covers increased wall thickness portions are provided at opposite axial end portions of an inner cylinder near joints of the inner cylinder with the end covers, one increased wall thickness portion being located at one axial end portion on an outer side surface thereof and the other increased wall thickness portion being located at the other axial end portion on an inner side surface thereof. Thus, the inner cylinder has a small wall thickness at an axial central portion to reduce an eddy current loss while its wall thickness is increased at the opposite axial end portions to improve mechanical strength and facilitate joining of the end covers to the inner cylinder.
    Type: Grant
    Filed: November 17, 1983
    Date of Patent: January 8, 1985
    Assignee: Hitachi, Ltd.
    Inventors: Keiji Fukushi, Yutaka Higashimura, Shinei Huzioka, Syuzou Iwaasa, Kenzo Kadotani