Patents by Inventor Yutaka Hisaeda

Yutaka Hisaeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10090275
    Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: October 2, 2018
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama
  • Patent number: 10008471
    Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 26, 2018
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata, Toshihiko Ueyama
  • Patent number: 9721694
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: August 1, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Patent number: 9486879
    Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.
    Type: Grant
    Filed: May 13, 2011
    Date of Patent: November 8, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama
  • Publication number: 20160172328
    Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 16, 2016
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
  • Publication number: 20160099087
    Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.
    Type: Application
    Filed: December 11, 2015
    Publication date: April 7, 2016
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
  • Patent number: 9240256
    Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.
    Type: Grant
    Filed: April 23, 2010
    Date of Patent: January 19, 2016
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
  • Publication number: 20150243400
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Application
    Filed: April 3, 2015
    Publication date: August 27, 2015
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Shuji KANEDA, Kimikazu MOTOMURA, Tatsuya KARIYASU, Yutaka HISAEDA, Kosuke IHA
  • Patent number: 9034214
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: December 25, 2009
    Date of Patent: May 19, 2015
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Patent number: 8858700
    Abstract: In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.
    Type: Grant
    Filed: October 23, 2009
    Date of Patent: October 14, 2014
    Assignee: DOWA Electronics Materials Co., Ltd.
    Inventors: Keiichi Endoh, Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama
  • Patent number: 8641929
    Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: February 4, 2014
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
  • Publication number: 20130323529
    Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.
    Type: Application
    Filed: May 13, 2011
    Publication date: December 5, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Satoru Kurita, Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama
  • Patent number: 8486310
    Abstract: A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided. The fine silver particles are produced by carrying out a fluid preparation step of preparing a reduction fluid, a silver reaction step, and a filtration/washing step. The reaction step is carried out by adding an aqueous silver nitrate fluid to a reduction fluid whose temperature has been increased to a range between 40 and 800 ° C. The aqueous silver nitrate fluid is added at a stretch. The composition containing fine silver particles is produced by dispersing the composition containing the fine silver particles in a polar fluid.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: July 16, 2013
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yutaka Hisaeda, Toshihiko Ueyama
  • Publication number: 20130081759
    Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.
    Type: Application
    Filed: June 10, 2011
    Publication date: April 4, 2013
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
  • Publication number: 20120298009
    Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.
    Type: Application
    Filed: April 23, 2010
    Publication date: November 29, 2012
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
  • Patent number: 8293144
    Abstract: A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided. The fine silver particles are produced by carrying out a fluid preparation step of preparing a reduction fluid, a silver reaction step, and a filtration/washing step. The reaction step is carried out by adding an aqueous silver nitrate fluid to a reduction fluid whose temperature has been increased to a range between 40 and 800° C. The aqueous silver nitrate fluid is added at a stretch. The composition containing fine silver particles is produced by dispersing the composition containing the fine silver particles in a polar fluid.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: October 23, 2012
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yutaka Hisaeda, Toshihiko Ueyama
  • Patent number: 8293142
    Abstract: A composition containing fine silver particles which have a uniform particle size, can form a fine drawing pattern, and have a small environmental impact, a method for producing that composition, a method for producing fine silver particles, and a paste having fine silver particles are provided. The fine silver particles are produced by carrying out a fluid preparation step of preparing a reduction fluid, a silver reaction step, and a filtration/washing step. The reaction step is carried out by adding an aqueous silver nitrate fluid to a reduction fluid whose temperature has been increased to a range between 40 and 80° C. The aqueous silver nitrate fluid is added at a stretch. The composition containing fine silver particles is produced by dispersing the composition containing the fine silver particles in a polar fluid.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: October 23, 2012
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Yutaka Hisaeda, Toshihiko Ueyama
  • Patent number: 8287771
    Abstract: Provided is a method for producing a silver particle powder excellent in the dispersibility in a liquid organic medium having a low polarity, which comprises reducing a silver compound in an alcohol having a boiling point of from 80° C. to 200° C. or in a polyol having a boiling point of from 150 to 300° C., at a temperature of from 80° C. to 200° C. under reflux while maintaining the stream having a Reynolds number of not more than 3.70×104. The stream having a Reynolds number of not more than 3.70×104 can be maintained by stirring with a stirring power of not more than 5.68×108 W. According to the method, a silver particle powder having good low-temperature sinterability and good dispersibility and suitable for use for microwiring formation can be obtained at a high yield.
    Type: Grant
    Filed: February 15, 2007
    Date of Patent: October 16, 2012
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Kimitaka Sato, Yutaka Hisaeda
  • Publication number: 20120103515
    Abstract: In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.
    Type: Application
    Filed: October 23, 2009
    Publication date: May 3, 2012
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama
  • Publication number: 20120045573
    Abstract: Provided is a silver conductive film, a thin film of silver comprising a sintered layer of silver particles having a mean particle size DTEM of at most 100 nm. Its specific resistance is at most 5 ??·cm, the ratio of the voids in the sintered layer is at most 3/?m2, and the film has a texture structure with a surface roughness Ra of from 10 to 100 nm. The silver conductive film having such a texture structure may be produced according to a production process comprising a step of applying a silver particle dispersion of silver particles having a mean particle size DTEM of at most 100 nm dispersed in a non-polar or poorly-polar liquid organic medium having a boiling point of from 60 to 300° C., onto a substrate to form a coating film thereon, and thereafter baking the coating film.
    Type: Application
    Filed: October 14, 2011
    Publication date: February 23, 2012
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Kimitaka SATO, Yutaka HISAEDA, Taku OKANO, Kozo Ogi