Abstract: In order to realize, without inviting cost increase, a control for maintaining a pressure of fluid delivered from a pump at a target value, a pump control unit is provided with a driver control unit controlling a rotational speed of a hydraulic pump through adjustment of a duty ratio of a PWM signal driving excitation coils of an electric motor. Further, the pump control unit is provided also with a signal correction circuit configured to convert a current flowing in the excitation coils to a voltage signal with using a shunt resistor and to divide the voltage signal with using a voltage division ratio setting circuit and to shorten an ON signal of the PWM signal by increasing the divided voltage. The voltage division ratio setting circuit has a characteristics of setting the divided voltage higher, the longer an ON period of the PWM signal.

Abstract: In order to realize, without inviting cost increase, a control for maintaining a pressure of fluid delivered from a pump at a target value, a pump control unit is provided with a driver control unit controlling a rotational speed of a hydraulic pump through adjustment of a duty ratio of a PWM signal driving excitation coils of an electric motor. Further, the pump control unit is provided also with a signal correction circuit configured to convert a current flowing in the excitation coils to a voltage signal with using a shunt resistor and to divide the voltage signal with using a voltage division ratio setting circuit and to shorten an ON signal of the PWM signal by increasing the divided voltage. The voltage division ratio setting circuit has a characteristics of setting the divided voltage higher, the longer an ON period of the PWM signal.

Abstract: A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.

Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.

Abstract: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 ?g/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.

Abstract: A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.

Abstract: A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via is connected with the wiring pattern and the other end portion is overlaid with a covering layer obtained by applying a conductive paste to cover at least the boundary between the filled via and the insulating layer; alternatively, a plating resist is formed at the other end portion to cover at least the boundary between the filled via and the insulating layer, and is removed after an end portion of the filled via enclosed within the plating resist is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via and the insulating layer.

Abstract: A film carrier tape for mounting an electronic part, comprising an insulating film, a wiring pattern formed on a surface of the insulating film and a solder resist layer formed on the wiring pattern except connecting lead portions of the wiring pattern, wherein the solder resist coating thickness at the edge portion of the solder resist layer is continuously decreased toward the tip of the edge portion. The film carrier tape for mounting an electronic part can be produced by applying a solder resist coating solution onto the wiring pattern using a screen in which opening sizes at the edge portion of a coating solution passing zone are reduced stepwise or continuously or by applying a solder resist coating solution onto the wiring pattern while pressing a film carrier against the screen so as to decrease a coating weight of the solder resist coating solution continuously or stepwise toward the tip of the edge portion of the resulting solder resist layer.

Abstract: The printed wiring board comprises, on at least one surface of an insulating film, a base metal layer and a conductive metal layer formed on the base metal layer, and is characterized in that in a section of the wiring board the bottom width of the conductive metal layer is smaller than the top width of the base metal layer. The circuit device comprises the printed wiring board and an electronic part mounted thereon. The process for producing a printed wiring board comprises bringing a base metal layer and a conductive metal layer into contact with an etching solution capable of dissolving the conductive metal to form a wiring pattern and then sequentially bringing the resultant into contact with a first treating solution capable of dissolving the metal for forming the base metal layer, a microetching solution capable of selectively dissolving the conductive metal and a second treating solution having a different chemical composition from the first treating solution in this order.

Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.

Abstract: [Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.

Abstract: A fixing member includes a case member provided with at least a substrate supporting member adjusted to support a substrate and integrally provided with a connector, a cap member adjusted to be fixed to the case member, at least an external force transmitting portion extending at the substrate supporting member between the substrate supporting member and the cap member and adjusted to transmit an external force subjected to the connector to the cap member while the case member has been fixed at the cap member.

Abstract: The invention provides a film carrier tape for mounting electronic devices thereon and a flexible substrate, which prevent generation of static electricity, thereby enhancing reliability and productivity of a semiconductor chip mounting line.

Abstract: A fixing member includes a case member provided with at least a substrate supporting member adjusted to support a substrate and integrally provided with a connector, a cap member adjusted to be fixed to the case member, at least an external force transmitting portion extending at the substrate supporting member between the substrate supporting member and the cap member and adjusted to transmit an external force subjected to the connector to the cap member while the case member has been fixed at the cap member.

Abstract: To provide a COF film carrier tape which enables smooth conveyance of insulating film during a production step and prevents production failures, and to provide a method for producing the COF film carrier tape. In a COF film carrier tape including a continuous insulating film 12, a wiring pattern 21 formed of a conductor layer 11 provided on a surface of the insulating film 12, and a row of sprocket holes 22 along opposite longitudinal edges of the wiring pattern 21 on which electronic devices are to be mounted, a center section of the insulating layer 12 other than opposite longitudinal edges where the sprocket holes 22 are formed is provided with a support film 14 formed on another surface of the insulating film, which surface is opposite to the surface on which the wiring pattern 21 is provided.

Abstract: A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.

Abstract: A film carrier tape for mounting an electronic part, comprising an insulating film, a wiring pattern formed on a surface of the insulating film and a solder resist layer formed on the wiring pattern except connecting lead portions of the wiring pattern, wherein the solder resist coating thickness at the edge portion of the solder resist layer is continuously decreased toward the tip of the edge portion. The film carrier tape for mounting an electronic part can be produced by applying a solder resist coating solution onto the wiring pattern using a screen in which opening sizes at the edge portion of a coating solution passing zone are reduced stepwise or continuously or by applying a solder resist coating solution onto the wiring pattern with pressing a film carrier against the screen so as to decrease a coating weight of the solder resist coating solution continuously or stepwise toward the tip of the edge portion of the resulting solder resist layer.

Abstract: A malfunction detection device for a wheel speed sensor includes a comparison circuit for comparing a wheel speed signal output from a wheel speed sensor with a predetermined voltage. A calculation circuit is provided for selectively increasing or decreasing a counter according to an output signal of the comparison circuit. A malfunction signal output circuit outputs a malfunction signal when the counter of the calculation circuit reaches a predetermined value.

Abstract: An angular rate detector includes an oscillator having a first terminal to which a drive voltage is applied, a second terminal where a signal occurs having a given phase displacement with respect to a signal appearing at the first terminal during a resonance of the oscillator and a third terminal where a signal occurs having a phase which changes in accordance with an angular rate. An oscillator is provided for producing an alternating signal which corresponds to the drive voltage applied to the first terminal in accordance with the signal appearing at the second terminal. A frequency multiplier responsive to a signal which corresponds to the oscillation frequency of the oscillator produces a clock pulse having a frequency higher than the oscillation frequency.

Abstract: An electrical circuit for reliably starting the oscillation of an oscillator comprising a cylindrical piezoelectric body on which an exciting electrode, a feedback electrode which causes an oscillation, and an electrode for detecting an angular rate are mounted. The electrical circuit includes an exclusive OR gate for detecting a phase difference between an exciting voltage and a voltage developed at the feedback electrode, a circuit for integrating an output voltage from the gate and a band pass filter having its resonant frequency shifted in proportion to a voltage from the integrating circuit. The band pass filter is effective to provide an automatic adjustment of a phase difference of a voltage, which is actually fed back to the exciting electrode, with respect to a voltage developed at the feedback electrode.