Patents by Inventor Yutaka Kameda

Yutaka Kameda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor electronic parts
    Patent number: 6653720
    Abstract: Semiconductor electronic parts 1 comprises electrode pads 7 formed on the surface of a base 2 and adapted to be connected to respective electrode terminals 4 and a bare chip 3 adhesive bonded to the surface of the base 2, wherein adhesive flow-in preventing means 12 is provided between the bare chip 3 and each of the electrode pad 7 for preventing the adhesive 10 for adhesive bonding the bare chip 3 to the base 2 from flowing in the electrode pads 7. Therefore, in an underfill process of adhesive bonding the base 2 to the bare chip 3 placed on the upper part thereof and sealing a gap between both of them with the adhesive 10 during manufacturing semiconductor electronic parts, the adhesive 10 is prevented from flowing out of the outside edge of the bare chip 3 and from depositing on the electrode pads 7 formed on the base 2.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: November 25, 2003
    Assignee: Rohm Co., Ltd.
    Inventor: Yutaka Kameda
  • Electric refrigerator
    Patent number: 6604377
    Abstract: A chill blow-off port is provided on a front surface side within a refrigerating compartment, and a chill return port is provided on a back wall of the refrigerating compartment, so that a chill generated by a heat exchanger flows from the front surface side within the refrigerating compartment toward the rear in the depth. Thereby, temperature unevenness within the refrigerating compartment is effectively eliminated and a cooling rate of a preserved food is enhanced.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: August 12, 2003
    Assignee: Fujitsu General Limited
    Inventors: Katsumi Watanabe, Yutaka Kameda, Masataka Eto, Susumu Oagu, Shinjiro Asakura, Kentaro Shiozaki, Kenji Haruyama, Youichi Higashionna
  • Semiconductor electronic parts
    Publication number: 20020195703
    Abstract: Semiconductor electronic parts 1 comprises electrode pads 7 formed on the surface of a base 2 and adapted to be connected to respective electrode terminals 4 and a bare chip 3 adhesive bonded to the surface of the base 2, wherein adhesive flow-in preventing means 12 is provided between the bare chip 3 and each of the electrode pad 7 for preventing the adhesive 10 for adhesive bonding the bare chip 3 to the base 2 from flowing in the electrode pads 7. Therefore, in an underfill process of adhesive bonding the base 2 to the bare chip 3 placed on the upper part thereof and sealing a gap between both of them with the adhesive 10 during manufacturing semiconductor electronic parts, the adhesive 10 is prevented from flowing out of the outside edge of the bare chip 3 and from depositing on the electrode pads 7 formed on the base 2.
    Type: Application
    Filed: June 18, 2002
    Publication date: December 26, 2002
    Applicant: ROHM CO., LTD.
    Inventor: Yutaka Kameda
  • Electric refrigerator
    Publication number: 20020023454
    Abstract: A chill blow-off port is provided on a front surface side within a refrigerating compartment, and a chill return port is provided on a back wall of the refrigerating compartment, so that a chill generated by a heat exchanger flows from the front surface side within the refrigerating compartment toward the rear in the depth. Thereby, temperature unevenness within the refrigerating compartment is effectively eliminated and a cooling rate of a preserved food is enhanced.
    Type: Application
    Filed: July 19, 2001
    Publication date: February 28, 2002
    Inventors: Katsumi Watanabe, Yutaka Kameda, Masataka Eto, Susumu Oagu, Shinjiro Asakura, Kentaro Shiozaki, Kenji Haruyama, Youichi Higashionna