Patents by Inventor Yutaka KAWAKUBO

Yutaka KAWAKUBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Barrier film for electronic devices
    Patent number: 11479018
    Abstract: A barrier film for electronic devices exhibiting and maintaining excellent water barrier property. The barrier film for electronic devices features a water permeability (23° C., RH50%) that is set to be not more than 10?4 g/m2/day and a water content that is maintained to be not more than 2000 ppm.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: October 25, 2022
    Assignee: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Chiho Sugiura, Yusuke Obu, Kenji Hayashi, Yutaka Kawakubo
  • SEALING MEMBER FOR ORGANIC ELECTRONIC DEVICES
    Publication number: 20210028400
    Abstract: A sealing member used for absorbing the water in the interior of the organic electronic devices and for holding the interior of the devices in a dry state. The sealing member includes a laminate of a barrier sheet (5) provided with a metal foil (5a) and a moisture absorbing film (3).
    Type: Application
    Filed: April 1, 2019
    Publication date: January 28, 2021
    Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Chiho SUGIURA, Yusuke OBU, Kenji HAYASHI, Yutaka KAWAKUBO
  • BARRIER FILM FOR ELECTRONIC DEVICES
    Publication number: 20210023817
    Abstract: A barrier film for electronic devices exhibiting and maintaining excellent water barrier property. The barrier film for electronic devices features a water permeability (23° C., RH50%) that is set to be not more than 10?4 g/m2/day and a water content that is maintained to be not more than 2000 ppm.
    Type: Application
    Filed: April 1, 2019
    Publication date: January 28, 2021
    Applicant: TOYO SEIKAN GROUP HOLDINGS, LTD.
    Inventors: Chiho SUGIURA, Yusuke OBU, Kenji HAYASHI, Yutaka KAWAKUBO
  • PACKAGED BARRIER FILM FOR ELECTRONIC DEVICES
    Publication number: 20210016986
    Abstract: A package comprising a laminate of a two-layer structure including a barrier film 1 that is used for electronic devices and has a water permeability (23° C., RH 50%) that is set to be not more than 10?4 g/m2/day and a desiccant sheet 3 that is so provided as to cover the one surface of the barrier film 1, characterized in that the barrier film 1 is held being wound up like a roll.
    Type: Application
    Filed: April 1, 2019
    Publication date: January 21, 2021
    Applicant: Toyo Seikan Group Holdings, Ltd.
    Inventors: Chiho SUGIURA, Yusuke OBU, Kenji HAYASHI, Yutaka KAWAKUBO