Patents by Inventor Yutaka Kudou
Yutaka Kudou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10341179Abstract: A management computer manages first XaaS including a first node configuration and second XaaS including a second node configuration that is dependent on resources provided by the first XaaS. When a required resource amount which is required for the first XaaS in order to change the second node configuration is larger than a resource amount which can be provided by the first XaaS, the management computer determines a changed first node configuration which is capable of providing a resource amount equal to or larger than the required resource amount and, after changing the first XaaS to the determined changed first node configuration, changes the second node configuration of the second XaaS.Type: GrantFiled: March 18, 2015Date of Patent: July 2, 2019Assignee: Hitachi, Ltd.Inventors: Kenta Yamasaki, Takashi Tameshige, Takeshi Termamura, Yutaka Kudou
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Patent number: 10333859Abstract: In a system, such as a cloud, which allows resource allocation to be flexibly changed in a multi-tenant environment, it is necessary to interchange resources between the tenants. Efficient resource coordination for resource allocation cannot be attained by merely adjusting resource allocation amounts or resource usage amounts. In order to address this problem, the present invention selects an optimum allocation method from among a plurality of resource allocation methods including CPU capping, taking into account each period for which resources must be allocated and the manner in which each tenant uses resources, and then coordinates allocation of resources across the entire system using the selected allocation method. This makes it possible to improve the efficiency of resource coordination even in a multi-tenant environment.Type: GrantFiled: August 27, 2014Date of Patent: June 25, 2019Assignee: Hitachi, Ltd.Inventors: Kenta Yamasaki, Tomohiro Morimura, Yutaka Kudou, Masaaki Iwasaki
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Publication number: 20180219733Abstract: A management computer manages first XaaS including a first node configuration and second XaaS including a second node configuration that is dependent on resources provided by the first XaaS. When a required resource amount which is required for the first XaaS in order to change the second node configuration is larger than a resource amount which can be provided by the first XaaS, the management computer determines a changed first node configuration which is capable of providing a resource amount equal to or larger than the required resource amount and, after changing the first XaaS to the determined changed first node configuration, changes the second node configuration of the second XaaS.Type: ApplicationFiled: March 18, 2015Publication date: August 2, 2018Applicant: HITACHI, LTD.Inventors: Kenta YAMASAKI, Takashi TAMESHIGE, Takeshi TERMAMURA, Yutaka KUDOU
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Patent number: 10019182Abstract: A management system, which manages at least a computer system including a copy destination VOL, receives first performance related information including information related to a resource related to an operation with which a copy source VOL is associated as an I/O destination, and stores the received first performance related information. When an operation migrates from a first site to a second site (for example, when the first site is affected by a disaster), the management system reallocates a resource of the second site based on both the first performance related information and second performance related information including information related to a resource related to an operation originally executed at the second site among a resource group of the second site.Type: GrantFiled: December 22, 2014Date of Patent: July 10, 2018Assignee: Hitachi, Ltd.Inventors: Jun Nakajima, Hironori Emaru, Yutaka Kudou
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Patent number: 9852007Abstract: A system management method for a management computer coupled to a computer system, the computer system including a plurality of computers, an operations system being built thereon the computer system, the operations system including a plurality of task nodes each having allocated thereto computer resources, the system management method including: a step of analyzing a configuration of the computer system for specifying a important node, which is an important task node in the operations system; a step of changing an allocation amount of the computer resources allocated to the important node for measuring a load of the operations system; a step of calculating a first weighting representing a strength of associations among the plurality of task nodes based on a measurement result of the load; and a step of specifying a range impacted by a change in the load of the important node based on the calculated first weighting.Type: GrantFiled: February 12, 2014Date of Patent: December 26, 2017Assignee: HITACHI, LTD.Inventors: Takashi Tameshige, Yutaka Kudou, Tomohiro Morimura, Takeshi Teramura, Daisuke Iizuka, Nobuaki Ozaki
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Publication number: 20170206027Abstract: A management system, which manages at least a computer system including a copy destination VOL, receives first performance related information including information related to a resource related to an operation with which a copy source VOL is associated as an I/O destination, and stores the received first performance related information. When an operation migrates from a first site to a second site (for example, when the first site is affected by a disaster), the management system reallocates a resource of the second site based on both the first performance related information and second performance related information including information related to a resource related to an operation originally executed at the second site among a resource group of the second site.Type: ApplicationFiled: December 22, 2014Publication date: July 20, 2017Applicant: HITACHI, LTD.Inventors: Jun NAKAJIMA, Hironori EMARU, Yutaka KUDOU
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Publication number: 20170019345Abstract: In a system, such as a cloud, which allows resource allocation to be flexibly changed in a multi-tenant environment, it is necessary to interchange resources between the tenants. Efficient resource coordination for resource allocation cannot be attained by merely adjusting resource allocation amounts or resource usage amounts. In order to address this problem, the present invention selects an optimum allocation method from among a plurality of resource allocation methods including CPU capping, taking into account each period for which resources must be allocated and the manner in which each tenant uses resources, and then coordinates allocation of resources across the entire system using the selected allocation method. This makes it possible to improve the efficiency of resource coordination even in a multi-tenant environment.Type: ApplicationFiled: August 27, 2014Publication date: January 19, 2017Inventors: Kenta YAMASAKI, Tomohiro MORIMURA, Yutaka KUDOU, Masaaki IWASAKI
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Publication number: 20160378583Abstract: A management computer has a processor configured to: select a service performance name pairing with a received first apparatus performance name; select a performance value of the received first apparatus performance name and a performance value of the selected service performance name; select a threshold of the first apparatus performance name and a threshold of the selected service performance name; determine whether the performance value of the first apparatus performance name exceeds the threshold of the first apparatus performance name within a predetermined period; determine whether the performance value of the service performance name exceeds the threshold of the service performance name within the predetermined period; and when a determination result of the performance value of the first apparatus performance name and a determination result of the performance value of the service performance name are the same result simultaneously, increase evaluation of the threshold of the first apparatus name.Type: ApplicationFiled: July 28, 2014Publication date: December 29, 2016Inventors: Kaori NAKANO, Mineyoshi MASUDA, Yasuyuki MIMATSU, Yutaka KUDOU
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Publication number: 20160188373Abstract: A system management method for a management computer coupled to a computer system, the computer system including a plurality of computers, an operations system being built thereon the computer system, the operations system including a plurality of task nodes each having allocated thereto computer resources, the system management method including: a step of analyzing a configuration of the computer system for specifying a important node, which is an important task node in the operations system; a step of changing an allocation amount of the computer resources allocated to the important node for measuring a load of the operations system; a step of calculating a first weighting representing a strength of associations among the plurality of task nodes based on a measurement result of the load; and a step of specifying a range impacted by a change in the load of the important node based on the calculated first weighting.Type: ApplicationFiled: February 12, 2014Publication date: June 30, 2016Applicant: HITACHI, LTD.Inventors: Takashi TAMESHIGE, Yutaka KUDOU, Tomohiro MORIMURA, Takeshi TERAMURA, Daisuke IIZUKA, Nobuaki OZAKI
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Publication number: 20160181118Abstract: A plasma processing method capable of controlling an etching rate of a SiN film and obtaining high selectivity to a SiO2 film and Si at the same time performs etch-back of a SiN film as a processing object of a film structure including a SiO2 film and the SiN film or a Si film and the SiN film on a surface of a substrate placed in a processing chamber by using inductively couple plasma formed in the processing chamber by supplying process gas including CHF3 or CF4 and O2 gas into the processing chamber inside a vacuum vessel and supplying RF power of 7-50 MHz to an induction coil surrounding an outer circumference of the processing chamber.Type: ApplicationFiled: September 11, 2015Publication date: June 23, 2016Inventors: Yutaka KUDOU, Tetsuo ONO
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Publication number: 20160006640Abstract: A management computer for managing allocation of an application and an application probe in a computer system including a plurality of computers, the management computer comprising a probe management part configured to determine a computer for allocating a new application and a new application probe, the probe management part being configured to: retrieve a computer satisfying a configuration condition and a monitoring interval condition; compute a value of a monitoring spike, in a case where the new application and the new application probe are allocated to the retrieved computer, determine the retrieved computer as a candidate computer to which the application and the application probe are to be allocated, in a case where it is determined that the computed value of the monitoring spike is smaller than a predetermined threshold.Type: ApplicationFiled: November 12, 2013Publication date: January 7, 2016Inventors: Mineyoshi MASUDA, Yutaka KUDOU
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Publication number: 20160004582Abstract: A management system manages a plurality of management target devices. A storage device stores one or more rules, plan information, and plan history information. A control device specifies a first cause event that is a candidate of a cause of the event that has occurred in any one of the management target devices based on the one or more rules, specifies a plurality of first plans that can be executed in the case in which the first cause event is a cause based on the plan information, calculates an index value indicating a possibility of succeeding in a failure recovery in the case in which the plan is executed for each of the plurality of first plans based on the plan history information, and displays data indicating any one or more plans of the plurality of first plans according to a display mode decided based on the index value.Type: ApplicationFiled: April 5, 2013Publication date: January 7, 2016Applicant: HITACHI, LTD.Inventors: Masataka NAGURA, Jun NAKAJIMA, Takayuki NAGAI, Yutaka KUDOU
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Publication number: 20130019894Abstract: In a plasma ashing processing on a sample including a Low-k film, a processing method that can prevent or reduce a film damage on the Low-k film while performing a high speed ashing processing is provided. A plasma processing method for performing a plasma processing on the sample including a Low-k film 15 includes: a step of performing plasma etching on the sample; and a step of performing plasma ashing on the sample including the Low-k film 15 with a resist mask 13, a carbon hard mask 14, and by-products 16 that have been subjected to plasma etching in the plasma etching process by a carbon (C+) radical 18 and a hydrogen (H+) radical 20 generated from methane (CH4) gas 19, using mixed gas including the methane (CH4) gas 19, which is hydrocarbon gas, and argon (Ar) gas, which is noble gas.Type: ApplicationFiled: June 28, 2012Publication date: January 24, 2013Inventors: Yutaka KUDOU, Shin HIYAMA
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Patent number: 8288287Abstract: The invention provides an etching method for realizing trench etching without causing any damages to the side walls of the trench while maintaining a high-etching rate. The plasma etching method relates to forming a groove or a hole by forming a silicon trench to a silicon substrate or a silicon substrate having a silicon oxide dielectric layer via a mixed gas plasma containing a mixed gas of SF6 and O2 or a mixed gas of SF6, O2 and SiF4 and having added thereto a gas containing hydrogen within the range of 5 to 16% (percent concentration) of the total gas flow rate of the mixed gas.Type: GrantFiled: March 24, 2008Date of Patent: October 16, 2012Assignee: Hitachi High-Technologies CorporationInventors: Kazuo Takata, Yutaka Kudou, Satoshi Tani
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Patent number: 8277563Abstract: The invention provides a plasma processing method which includes (i) feeding a transferring gas which decreases a pressure difference between a processing chamber and a transfer chamber in order to prevent particles from adhering a processing sample, to be processed, passed to the processing chamber, before transferring the sample into the processing chamber; (ii) transferring the sample into the processing chamber while continuing to feed the transferring gas to the processing chamber; (iii) generating a plasma from the transferring gas in the processing chamber while continuing to feed the transferring gas to the processing chamber after the step of transferring the sample; and (iv) changing a gas supplied to the processing chamber from the transferring gas used in the step of generating the plasma to a processing gas for subjecting the processing sample, different from a cleaning sample, to plasma processing.Type: GrantFiled: February 1, 2011Date of Patent: October 2, 2012Assignee: Hitachi High-Technologies CorporationInventors: Masunori Ishihara, Masamichi Sakaguchi, Yasuhiro Nishimori, Yutaka Kudou, Satoshi Une
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Publication number: 20120093617Abstract: A vacuum processing apparatus including a processing chamber for processing a sample to be processed, a cooling chamber for cooling the high-temperature sample processed in the processing chamber, and a vacuum transfer chamber for establishing a connection between the processing chamber and the cooling chamber, a vacuum transfer robot equipped inside the vacuum transfer chamber, wherein the cooling chamber includes a gas-exhausting unit for reducing pressure inside the cooling chamber, a gas-supplying unit for supplying a gas into the cooling chamber, a pressure-controlling unit for controlling the pressure inside the cooling chamber, a supporting unit for supporting the high-temperature sample, and a mounting stage for proximity-holding the sample supported by the supporting unit, the mounting stage having a temperature-adjusting unit for adjusting the temperature of surface of the mounting stage into a temperature which is capable of cooling the high-temperature sample, the supporting unit having an ascendiType: ApplicationFiled: January 21, 2011Publication date: April 19, 2012Inventors: Yutaka Kudou, Hiroaki Takikawa, Takahiro Shimomura, Masakazu Isozaki, Takashi Uemura
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Publication number: 20120067522Abstract: A vacuum processing apparatus having an atmospheric-pressure transport chamber for conveying samples, lock chambers that accommodate the samples conveyed in and have an ambient capable of being switched between an atmospheric ambient and a vacuum ambient, a vacuum transport chamber coupled to the lock chambers, and at least one vacuum chamber for processing the samples. The apparatus further includes cooling portions operable to cool the high-temperature samples processed by the vacuum chamber. Each cooling portion has: a sample stage over which the high-temperature samples are placed and which has a coolant channel; gas-blowing tubes disposed closer to the inlet/exit port and acting to blow gas toward the sample stage; and an exhaust port disposed on the opposite side of the sample stage with regard to the inlet/exit port and acting to discharge the gas blown from the gas-blowing tubes.Type: ApplicationFiled: February 7, 2011Publication date: March 22, 2012Inventors: Takahiro Shimomura, Yutaka Kudou, Masakazu Isozaki, Takashi Uemura
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Publication number: 20120067521Abstract: A vacuum processing system including a cassette holder for setting up cassettes in which samples are stored, an air-transfer chamber for transferring the samples, lock chambers for storing the samples transferred from the air-transfer chamber, the lock chambers being capable of switching between air atmosphere and vacuum atmosphere in their inside, a vacuum transfer chamber connected to the lock chambers, vacuum containers for processing the samples transferred via the vacuum transfer chamber, a cooling chamber for cooling the samples down to a first temperature, the samples being processed in at least one of the vacuum containers, and a cooling unit for cooling the samples down to a second temperature, the samples being cooled in the cooling chamber. The cooling unit is deployed in the air transfer chamber, and has a cooling part for cooling the samples, being cooled in the cooling chamber, down to the second temperature.Type: ApplicationFiled: December 15, 2010Publication date: March 22, 2012Inventors: Takahiro SHIMOMURA, Yutaka Kudou, Takashi Uemura, Masakazu Isozaki
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Publication number: 20110120495Abstract: The invention provides a plasma processing method capable of reducing particle caused by flinging up of particles by airflow due to the pressure fluctuation in the processing chamber during the time the sample is carried into the processing chamber, subjected to plasma processing and carried out of the processing chamber.Type: ApplicationFiled: February 1, 2011Publication date: May 26, 2011Inventors: Masunori ISHIHARA, Masamichi Sakaguchi, Yasuhiro Nishimori, Yutaka Kudou, Satoshi Une
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Patent number: 7909933Abstract: The invention provides a plasma processing method capable of reducing particle caused by flinging up of particles by airflow due to the pressure fluctuation in the processing chamber during the time the sample is carried into the processing chamber, subjected to plasma processing and carried out of the processing chamber.Type: GrantFiled: May 8, 2009Date of Patent: March 22, 2011Assignee: Hitachi High-Technologies CorporationInventors: Masunori Ishihara, Masamichi Sakaguchi, Yasuhiro Nishimori, Yutaka Kudou, Satoshi Une