Abstract: A display device according to the present disclosure includes a display member, a light transmission member, a light diffusion member, and a plurality of protrusions. The display member has a display surface. The light transmission member is disposed on the display surface side of the display member, has a first surface on a side opposite to the display member and a second surface on the display member side, and has light transparency. The light diffusion member is disposed on a side opposite to the display surface of the display member, and has light diffusion. The plurality of protrusions is provided between the light transmission member and the display member.

Abstract: A display device includes: a display panel that includes, in a front surface, a display area in which an image is displayed, and projects, from the display area, light that has entered from a back surface as display light showing the image; a thermal conductive sheet that is disposed contacting the display panel, and has an opening positionally corresponding with the display area; and a light transmissive material that sandwiches the thermal conductive sheet together with the display panel.

Abstract: A display system includes a display and a light-transmitting member. The light-transmitting member has light-transmitting properties and is disposed to face a display screen of the display to dissipate heat generated by the display to outside of the display. The light-transmitting member has a higher thermal conductivity than quartz.

Abstract: A heat dissipation device includes a base, a fin array, and an air flow channel. The fin array includes: a plurality of fins protruding in a first direction from the base and arranged side by side in a second direction that intersects with the first direction; and a reinforcing structure coupling two adjacent fins out of the plurality of fins. The air flow channel is surrounded, in the fin array, with the plurality of fins and the reinforcing structure and opens toward an end in the first direction.

Abstract: A pair of discretionary points on a principal surface of a block are coupled to each other with a metal wire having a length larger than a distance between the pair of discretionary points, liquid resin is applied to the principal surface so as to cover the metal wire and then cured, so that a resin-cured material is formed, and the upper-surface portion of the resin-cured material is removed together with an intermediate portion of the metal wire, and then the block is removed from the resin-cured material.

Abstract: A pair of discretionary points on a principal surface of a block are coupled to each other with a metal wire having a length larger than a distance between the pair of discretionary points, liquid resin is applied to the principal surface so as to cover the metal wire and then cured, so that a resin-cured material is formed, and the upper-surface portion of the resin-cured material is removed together with an intermediate portion of the metal wire, and then the block is removed from the resin-cured material.

Abstract: An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

Abstract: A chassis surface temperature estimate apparatus capable of quickly and easily estimating a chassis surface temperature without obtaining a parameter for each component through actual measurement for thermal design is provided. A thermal analysis execution section (6) executes a thermal analysis in units of heat-generation groups each including at least one heat-generating component, and obtains the chassis surface temperatures caused by respective heat-generation groups. A storage section (8) stores the chassis surface temperatures obtained for respective heat-generation group. A synthesis section (7) firstly reads the chassis surface temperature data from the storage section (8), and converts the chassis surface temperatures caused by respective heat-generation groups to radiation amounts. Secondly, the synthesis section (7) calculates a sum of radiation amounts by adding the radiation amounts obtained through the conversion.

Abstract: An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

Abstract: An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

Abstract: An equivalent material constant calculation system that calculates an equivalent material constant of a structure constituted by a plurality of materials includes a shape data input portion that inputs shape data, a material data input portion that inputs material constant data, a dividing portion that divides the structure into a plurality of small regions, and a small region interior calculation portion that calculates equivalent material constants in the small regions, in which the small region interior calculation portion, based on the shape data and material constant data, with a function that includes a value in a variable that expresses a position in at least one direction in the small region, expresses an equivalent material constant for a region that is a portion of a small region, and using the function, calculates an equivalent material constant for the small region with respect to the at least one direction.

Abstract: A semiconductor device mounting structure is provided that includes an electrically insulating layer including a plurality of layers of electrically insulating substrates, a first semiconductor device, a second semiconductor device, a heat dispersion portion provided at a main surface of the electrically insulating layer, a first heat-conducting path connecting the heat dispersion portion and the first semiconductor device, and a second heat-conducting path connecting the heat dispersion portion and the second semiconductor device, wherein the first semiconductor device is arranged between at least a portion of the heat dispersion portion and the second semiconductor device. This provides a semiconductor device mounting structure that, in addition to being capable of high-density mounting of a plurality of semiconductor devices, is capable of dispersing with good efficiency heat generated by the plurality of semiconductor devices.