Patents by Inventor Yutaka MATSUSAKA

Yutaka MATSUSAKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate
    Patent number: 11929294
    Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.
    Type: Grant
    Filed: September 29, 2021
    Date of Patent: March 12, 2024
    Assignee: NICHIA CORPORATION
    Inventors: Masatsugu Ichikawa, Shoichi Yamada, Takeshi Kihara, Yutaka Matsusaka
  • COMPOSITE SUBSTRATE AND METHOD OF PRODUCING THE COMPOSITE SUBSTRATE, AND SEMICONDUCTOR DEVICE COMPRISING THE COMPOSITE SUBSTRATE
    Publication number: 20220102229
    Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 31, 2022
    Applicant: NICHIA CORPORATION
    Inventors: Masatsugu ICHIKAWA, Shoichi YAMADA, Takeshi KIHARA, Yutaka MATSUSAKA