Patents by Inventor Yutaka Mitsumoto

Yutaka Mitsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component mounting apparatus
    Patent number: 7490399
    Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.
    Type: Grant
    Filed: December 20, 2006
    Date of Patent: February 17, 2009
    Assignee: Panasonic Corporation
    Inventors: Yutaka Mitsumoto, Kazuhiro Ikurumi, Kazumasa Okumura, Mikiya Nakata, Masaharu Tsujimura
  • Electronic component mounting method and apparatus
    Publication number: 20070094869
    Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.
    Type: Application
    Filed: December 20, 2006
    Publication date: May 3, 2007
    Inventors: Yutaka Mitsumoto, Kazuhiro Ikurumi, Kazumasa Okumura, Mikiya Nakata, Masaharu Tsujimura
  • Device and method for picking up image of component, and component mounting apparatus
    Patent number: 7199816
    Abstract: An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: April 3, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiro Ikurumi, Yutaka Mitsumoto, Eiichi Hachiya, Hideshi Ueda
  • Electronic component mounting method and apparatus
    Patent number: 7185424
    Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.
    Type: Grant
    Filed: August 8, 2002
    Date of Patent: March 6, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yutaka Mitsumoto, Kazuhiro Ikurumi, Kazumasa Okumura, Mikiya Nakata, Masaharu Tsujimura
  • Device and method for picking up image of component, and component mounting apparatus
    Publication number: 20040150742
    Abstract: An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.
    Type: Application
    Filed: November 25, 2003
    Publication date: August 5, 2004
    Inventors: Kazuhiro Ikurumi, Yutaka Mitsumoto, Eiichi Hachiya, Hideshi Ueda
  • Electronic component mounting method and apparatus
    Publication number: 20030133603
    Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which the recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.
    Type: Application
    Filed: August 8, 2002
    Publication date: July 17, 2003
    Inventors: Yutaka Mitsumoto, Kazuhiro Ikurumi, Kazumasa Okumura, Mikiya Nakata, Masaharu Tsujimura