Patents by Inventor Yutaka Mitsune

Yutaka Mitsune has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper conductor composition
    Patent number: 4906404
    Abstract: A copper conductor composition having an improved solderability as well as a good adhesion, which comprises a copper powder, an inorganic binder and a boride or silicide of a metal such as W, Mo, Ti, Ta, Nb or Cr. The solderability is kept on a good level even if the composition is subjected to a firing operation repeatedly.
    Type: Grant
    Filed: November 7, 1988
    Date of Patent: March 6, 1990
    Assignees: Dai-Ichi Kogyo Seiyaku Co., Ltd., Dowa Mining Co., Ltd., Matsushita Electric Industrial Co.
    Inventors: Masatoshi Suehiro, Masashi Echigo, Masami Sakuraba, Yutaka Mitsune, Seiichi Nakatani, Tsutomu Nishimura
  • Copper thick film conductor composition
    Patent number: 4865772
    Abstract: A copper-containing thick film conductor composition comprising 55 to 95% by weight of an inorganic powder and 45 to 5% by weight of an organic medium, said inorganic powder comprising 100 parts by weight of a copper powder, 0.05 to 3 parts by weight of a zinc oxide powder, 1 to 7 parts by weight of a lead borate glass powder, 0.2 to 5 parts by weight of a borosilicate glass powder and 0 to 10 parts by weight of a copper snboxide powder having an average particle size of not more than 1.0 .mu.m. The composition of the present invention is excellent in solderability and adhesive strength to the substrate.
    Type: Grant
    Filed: November 15, 1988
    Date of Patent: September 12, 1989
    Inventors: Masatoshi Suehiro, Masashi Echigo, Yutaka Mitsune, Masami Sakuraba, Seiichi Nakatani, Tsutomu Nishimura