Patents by Inventor Yutaka Miura

Yutaka Miura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5704981
    Abstract: A partition member with a buffer plate disposed on the top surface thereof is disposed in a region belonging to a surface-to-be-processed of a substrate-to-be-processed held in a processing apparatus. An injector having cross-sectional areas decreasing toward the forward end thereof is disposed in the partition member. The injector has a number of injection holes formed length-wise therein at a constant pitch and in the same bore, whereby a processing gas can be injected very uniformly in the longitudinal direction and diffuse in the partition member. Then the processing gas is passed through vent holes formed in the buffer plate uniformly into the processing chamber. The processing gas can be fed uniformly onto the surface-to-be-processed of the substrate-to-be-processed, and a deposited thin film can have high intra-surface thickness uniformity.
    Type: Grant
    Filed: April 2, 1996
    Date of Patent: January 6, 1998
    Assignee: Tokyo Electron Ltd.
    Inventors: Shunji Kawakami, Yoji Mizutani, Yutaka Miura, Takahiro Shimoda
  • Patent number: 5593540
    Abstract: The present invention provides a plasma etching system, comprising a process chamber enclosing a plasma, means for evacuating said process chamber, a chuck electrode for supporting a substrate, a shower electrode positioned to face said chuck electrode and provided with a large number of small holes, a power source for applying a plasma voltage between the chuck electrode and said shower electrode, gas supply means communicating with said small holes of the shower electrode for supplying a plasma-forming gas into the process chamber through the small holes, and means for controlling said gas supply means such that said plasma-forming gas flows through said small holes at a mass flow rate of at least 620 kg/m.sup.2 /hr.
    Type: Grant
    Filed: April 27, 1995
    Date of Patent: January 14, 1997
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics Co., Ltd., Tokyo Electron Limited, Tokyo Electron Yamanashi Limited
    Inventors: Kazushi Tomita, Yoshikazu Ito, Motohiro Hirano, Akira Nozawa, Hiromitsu Matsuo, Shunichi Iimuro, Shigeki Tozawa, Yutaka Miura
  • Patent number: 5423936
    Abstract: The present invention provides a plasma etching system, comprising a process chamber enclosing a plasma, means for evacuating said process chamber, a chuck electrode for supporting a substrate, a shower electrode positioned to face said chuck electrode and provided with a large number of small holes, a power source for applying a plasma voltage between the chuck electrode and said shower electrode, gas supply means communicating with said small holes of the shower electrode for supplying a plasma-forming gas into the process chamber through the small holes, and means for controlling said gas supply means such that said plasma-forming gas flows through said small holes at a mass flow rate of at least 620 kg/m.sup.2 /hr.
    Type: Grant
    Filed: October 19, 1993
    Date of Patent: June 13, 1995
    Assignees: Hitachi, Ltd., Hitachi Tokyo Electronics, Co., Ltd., Tokyo Electron Limited, Tokyo Electron Yamanashi Limited
    Inventors: Kazushi Tomita, Yoshikazu Ito, Motohiro Hirano, Akira Nozawa, Hiromitsu Matsuo, Shunichi Iimuro, Shigeki Tozawa, Yutaka Miura
  • Patent number: 5019574
    Abstract: 4-aminopyridine derivatives represented by the general formula: ##STR1## [wherein R.sub.1 is a hydrogen atom, a hydroxyl group, a linear or branched lower alkyl group or a cycloalkyl group which may be substituted by a hydroxyl group, a lower alkoxy group, a lower alkyl or a cycloalkyl group which contains a carbonyl group, a morpholino group or a group --NH--B (where B is a lower alkyl group, a cycloalkyl group or a phenyl group); R.sub.2 and R.sub.3 which may be the same or different each represents a hydrogen atom, a lower alkyl group or a loweralkylcarbonyl group, or when taken together, form an azacycloalkyl group, a morpholino group or an N-methylpiperazinyl group together with the nitrogen atom; R.sub.4 and R.sub.5 each represents a hydrogen atom, or when taken together with the ring A, form a quinoline ring or a 5,6,7,8-tetrahydroquinoline ring, provided that when each of R.sub.1, R.sub.4 and R.sub.5 is a hydrogen atom, R.sub.2 and R.sub.
    Type: Grant
    Filed: September 28, 1989
    Date of Patent: May 28, 1991
    Assignee: Chugai Seiyaku Kabushiki Kaisha
    Inventors: Yutaka Miura, Mitsutaka Yoshida, Yasuo Fujimura, Sakae Takaku, Yukifumi Noda
  • Patent number: 4879536
    Abstract: An electromagnetic relay includes a cylindrical bobbin around which a coil is wound, and a step is formed at a middle portion of the cylindrical bobbin. A large-diameter portion is formed at one side of the step, and a smaller-diameter portion is formed at the other side of the step. The outer and inner diameters of the smaller-diameter portion are smaller than those of the large-diameter portion. An armature and a leg of a yoke are inserted in the large-diameter portion, and the armature is inserted in the smaller-diameter portion. The inner diameter of the large-diameter portion corresponds to a total sum of a thickness of the armature, a thickness of the yoke, and a moving stroke of the armature, and that of the smaller-diameter portion corresponds to a total sum of the thickness and the moving stroke of the armature. The coil is wound around the outer surface of the bobbin.
    Type: Grant
    Filed: September 28, 1988
    Date of Patent: November 7, 1989
    Assignee: Anritsu Corporation
    Inventors: Jisei Taguchi, Yutaka Miura, Kenji Iwanaga, Manabu Tada