Patents by Inventor Yutaka Morii

Yutaka Morii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TIN ALLOY ELECTROPLATING BATH AND PLATING METHOD USING SAME
    Publication number: 20210317591
    Abstract: A tin alloy electroplating bath, wherein the tin alloy electroplating bath includes (A) a soluble tin salt, (B) a soluble nickel salt and/or a soluble cobalt salt, (C) an oxycarboxylic acid or a salt thereof, (D) a nitrogen-containing heterocyclic unsaturated compound, and (E) a surfactant, and the pH of the tin alloy electroplating bath is 3 to 7.
    Type: Application
    Filed: July 12, 2019
    Publication date: October 14, 2021
    Inventors: Yutaka MORII, Go NAGATA, Satoshi YUASA
  • Acidic gold alloy plating solution
    Patent number: 9303326
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: April 5, 2016
    Inventors: Yutaka Morii, Masanori Orihashi
  • Acidic gold alloy plating solution
    Patent number: 9297087
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: March 29, 2016
    Inventors: Yutaka Morii, Masanori Orihashi
  • Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
    Patent number: 9200168
    Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: December 1, 2015
    Inventor: Yutaka Morii
  • Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
    Patent number: 8591638
    Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.
    Type: Grant
    Filed: September 22, 2009
    Date of Patent: November 26, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventor: Yutaka Morii
  • METAL SURFACE TREATMENT AQUEOUS SOLUTION AND METHOD FOR INHIBITING WHISKERS ON A METAL SURFACE
    Publication number: 20130284066
    Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.
    Type: Application
    Filed: July 1, 2013
    Publication date: October 31, 2013
    Inventor: Yutaka MORII
  • Acidic gold alloy plating solution
    Patent number: 8357285
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Grant
    Filed: June 5, 2008
    Date of Patent: January 22, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka Morii, Masanori Orihashi
  • ACIDIC GOLD ALLOY PLATING SOLUTION
    Publication number: 20120055802
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 8, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka MORII, Masanori Orihashi
  • ACIDIC GOLD ALLOY PLATING SOLUTION
    Publication number: 20120048740
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: November 9, 2011
    Publication date: March 1, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka MORII, Masanori Orihashi
  • Metal surface treatment aqueous solution and method for inhibiting whiskers on a metal surface
    Publication number: 20100116870
    Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.
    Type: Application
    Filed: September 22, 2009
    Publication date: May 13, 2010
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Yutaka Morii
  • Acidic gold alloy plating solution
    Publication number: 20090014335
    Abstract: A gold alloy plating solution and plating method thereof that provides a gold plating solution with high deposition selectivity by using a gold plating solution that contains gold cyanide, cobalt ions, hexamethylene tetramine, and specific glossing agents.
    Type: Application
    Filed: June 5, 2008
    Publication date: January 15, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Yutaka Morii, Masanori Orihashi