Patents by Inventor Yutaka NAMATAME

Yutaka NAMATAME has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RESIN COMPOSITION, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR SYNTHESIZING POLYIMIDE PRECURSOR
    Publication number: 20240018306
    Abstract: A resin composition that contains (A) at least one of a polyimide precursor, which is at least one resin selected from the group consisting of a polyamide acid, a polyamide acid ester, a polyamide acid salt, and a polyamide acid amide, or a polyimide resin, and (B) a solvent, and that is used for preparing an insulating film for at least one of a first organic insulating film or a second organic insulating film in a method for producing a semiconductor device including processes (1) to (5).
    Type: Application
    Filed: September 28, 2021
    Publication date: January 18, 2024
    Inventors: Satoshi YONEDA, Yutaka NAMATAME, Tomoaki SHIBATA, Kaori KOBAYASHI, Hitoshi ONOZEKI, Naoya SUZUKI, Toshihisa NONAKA
  • Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component
    Patent number: 11226560
    Abstract: A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: January 18, 2022
    Assignee: HD MICROSYSTEMS, LTD.
    Inventors: Nobuyuki Saito, Yukari Koibuchi, Yutaka Namatame
  • PHOTOSENSITIVE RESIN COMPOSITION, CURED PATTERN PRODUCTION METHOD, CURED PRODUCT, INTERLAYER INSULATING FILM, COVER COAT LAYER, SURFACE PROTECTIVE LAYER, AND ELECTRONIC COMPONENT
    Publication number: 20200041900
    Abstract: A photosensitive resin composition comprising the following component (a), component (b1), and component (b2). (a) a polyimide precursor having a structural unit represented by the following formula (1); (b1) one or more compounds selected from the group consisting of a compound represented by the following formula (11) and a compound represented by the following formula (12); (b2) one or more compounds selected from the group consisting of a compound represented by the following formula (21) and a compound represented by the following formula (22).
    Type: Application
    Filed: February 22, 2018
    Publication date: February 6, 2020
    Inventors: Nobuyuki SAITO, Yukari KOIBUCHI, Yutaka NAMATAME