Patents by Inventor Yutaka Niwano

Yutaka Niwano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing tool and polishing method for member having curved surface shape
    Patent number: 10434622
    Abstract: A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: October 8, 2019
    Assignee: FUJIMI INCORPORATED
    Inventors: Yutaka Niwano, Hitoshi Morinaga, Keigo Ohashi, Kazusei Tamai
  • POLISHING TOOL AND POLISHING METHOD FOR MEMBER HAVING CURVED SURFACE SHAPE
    Publication number: 20170252890
    Abstract: A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.
    Type: Application
    Filed: July 30, 2015
    Publication date: September 7, 2017
    Applicant: FUJIMI INCORPORATED
    Inventors: Yutaka NIWANO, Hitoshi MORINAGA, Keigo OHASHI, Kazusei TAMAI
  • POLISHING METHOD AND METHOD FOR PRODUCING ALLOY MATERIAL
    Publication number: 20150251293
    Abstract: The polishing method polishes an alloy material using a polishing pad and a polishing composition supplied to the polishing pad. The polishing composition contains an abrasive of silica or alumina, and a surface temperature of the polishing pad at the end of polishing is 20° C. or below. The method for producing an alloy material comprises a polishing step of polishing an alloy material using a polishing pad and a polishing composition supplied to the polishing pad. The polishing composition contains an abrasive of silica or alumina, and a surface temperature of the polishing pad at the end of polishing is 20° C. or below.
    Type: Application
    Filed: October 1, 2013
    Publication date: September 10, 2015
    Applicant: FUJIMI INCORPORATED
    Inventors: Hitoshi Morinaga, Kazusei Tamai, Yutaka Niwano, Maiko Asai
  • Polishing Composition and Polishing Method
    Publication number: 20100242374
    Abstract: In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The polishing composition preferably contains a water soluble polymer such as hydroxyethylcellulose, an alkali such as ammonia, and abrasive grains such as colloidal silica. The polishing composition is mainly used in polishing of the surfaces of semiconductor wafers such as silicon wafers, especially used in finish polishing of the surfaces of such wafers.
    Type: Application
    Filed: June 16, 2010
    Publication date: September 30, 2010
    Applicant: FUJIMI INCORPORATED
    Inventors: Naoto NOGUCHI, Kazutoshi KOTAMA, Yutaka NIWANO
  • Polishing Composition and Polishing Method
    Publication number: 20080053001
    Abstract: In a polishing composition, the concentration of one of either sodium ions or acetate ions is 10 ppb or less, or the concentrations of sodium ions and acetate ions are 10 ppb or less. The polishing composition preferably contains a water soluble polymer such as hydroxyethylcellulose, an alkali such as ammonia, and abrasive grains such as colloidal silica. The polishing composition is mainly used in polishing of the surfaces of semiconductor wafers such as silicon wafers, especially used in finish polishing of the surfaces of such wafers.
    Type: Application
    Filed: August 24, 2007
    Publication date: March 6, 2008
    Applicant: FUJIMI INCORPORATED
    Inventors: Naoto Noguchi, Kazutoshi Kotama, Yutaka Niwano