Abstract: A die push-up apparatus using a vertically movable die pick-up member 22 for die-peeling, the die pick-up member 22 which pushes dies upward being disposed inside a suction holding stage 10 further toward a die feeding direction side than a die push-up member 21 for die-pickup. With the die push-up member 22 lowered, the forward end portion (with respect to the die feeding direction) of a die 1A that is to be picked up is moved to above the die push-up member 22, the die push-up member 22 is next raised so that the forward end portion of the die 1A passing thereon is peeled from the wafer sheet 2; and further with the die push-up member 22 raised, the die 1A is fed to the pickup center 5 and is picked up by a collet 4 and the rising die push-up member 21.

Abstract: A method and a program (recorded on a recording medium) for securing a curved circuit board in a flat fashion on (a film application stage and) a bonding stage of a die bonder provided with suction cavities formed in a substrate suction surface of the bonding stage that suctions the curved circuit board, including the steps of evacuating air from the vacuum suction cavities using a vacuum device, and moving a die collet provided at a tip end of a bonding arm to press the circuit board down and thus sealing at least one of the vacuum suction cavities by the circuit board so as to allow the remaining vacuum suction cavities to be sealed successively by the flattened circuit board, thereby sealing the upper surfaces of all the vacuum suction cavities by the flattened circuit board, so that the circuit board is suction-held and secured on the bonding stage.

Abstract: A die pickup apparatus including a wafer sheet push-up unit provided inside a suction stage that suction-holds a wafer sheet having thereon dies. The wafer sheet push-up unit is made of push-up members, and the inner most push-up member is connected to a linking up-and-down moving shaft, so that when the linking up-and-down moving shaft is raised, the outer most push-up member in contact with the linking up-and-down moving shaft is raised, raising telescopically the inner push-up members. The outermost push-up member has a stopper that is adjustable in its up-and-down positions and comes into contact with the suction stage to stop the rising motion of the outermost push-up member, and the next inner side push-up member has its own stopper that is adjustable in its up-and-down positions and comes into contact with the outermost push-up member to stop the rising motion of the intermediate push-up member.

Abstract: The object of the present invention is to make it possible to pick up dies securely using a die push-up member without damaging the dies. A die push-up member 22 used for die-peeling which pushes the dies upward is disposed inside the suction holding stage 10 further toward the die feeding direction side than the die push-up member 21 used for die-pickup so that this die push-up member 22 can be move upward and downward. With the die push-up member 22 lowered, the die end portion (with respect to the die feeding direction) of the die 1A that is picked up is moved to above the die push-up member 22. Then, the die push-up member 22 is raised so that the die end portion (with respect to the die feeding direction) of the die 1A is peeled from the wafer sheet 2. Then, when the die push-up member 22 remaining in a raised state, the die 1A is fed to the pickup center 5, and is picked up by the collet 4 and die push-up member 21.