Abstract: According to one embodiment, a cell sorter includes a flow channel which supplies a sample liquid containing particles, a plurality of branch channels connected to the flow channel, an image sensor which has a pixel region covering the flow channel and the branch channels, a determination unit which determines the characteristics of the particles in the sample liquid from a measurement signal of the pixel region, and a separation unit guides the particles in the sample liquid to any of the branch channels based on the determination result of the determination unit.

Abstract: According to one embodiment, a method of manufacturing a microchannel includes coating a silicone resin onto a mold corresponding to a microchannel and a first opening communicating with the microchannel, curing the silicone resin by light using a mask having a light shielding portion corresponding to the first opening, removing an uncured silicone resin, and releasing the cured silicone resin from the mold.

Abstract: According to one embodiment, a pattern forming method includes forming a resist pattern on a substrate, forming a first silicone resin layer so as to bury the resist pattern on the substrate, pressing a film on the surface of the first silicone resin layer to adhere the film thereto, curing the first silicone resin layer after the adhesion of the film, peeling the film from the first silicone resin layer before or after the curing of the first silicone resin layer, and removing the resist pattern after the peeling of the film.

Abstract: According to one embodiment, a microanalysis chip includes a substrate, a flow channel in which a sample liquid is allowed to flow, the flow channel being provided on a main surface side of the substrate, a reservoir in which the sample liquid is allowed to be stored, the reservoir being provided on a main surface of the substrate, including a bank having a go-around shape and further including a liquid introduction inlet for connection to an end of the flow channel, the liquid introduction inlet being provided on the main surface of the substrate in the bank, and a filter which is provided between the liquid introduction inlet and the end of the flow channel and includes a first micropore for allowing passage of a fine particle in the sample liquid.

Abstract: According to one embodiment, a measuring device for a sample liquid includes a container which stores the sample liquid, the container including a transparent or translucent optical component with an inclined surface to be brought into contact with the sample liquid, an optical sensor provided on a bottom of the container, which detects light from the sample liquid, and a measurement module which measures a concentration of a specific substance contained in the sample liquid, or a liquid height or liquid volume of the sample liquid based on a detected signal of the optical sensor.

Abstract: According to one embodiment, a cell sorter includes a flow channel which supplies a sample liquid containing particles, a plurality of branch channels connected to the flow channel, an image sensor which has a pixel region covering the flow channel and the branch channels, a determination unit which determines the characteristics of the particles in the sample liquid from a measurement signal of the pixel region, and a separation unit guides the particles in the sample liquid to any of the branch channels based on the determination result of the determination unit.

Abstract: According to one embodiment, an optical sensor includes a first substrate, a first insulating film and a light-shielding film. The first substrate has a light detecting region detecting fluorescence generated from a fluorescent material by light with which irradiation is performed from a lateral side. The first insulating film is provided on the first substrate. The light-shielding film is provided, at least, on a side surface of the first substrate to which the light enters, on a side surface of the first insulating film and above a region excluding a region corresponding to the light detecting region of the first insulating film.

Abstract: According to one embodiment, a pattern forming method includes forming a resist pattern on a substrate, forming a first silicone resin layer so as to bury the resist pattern on the substrate, pressing a film on the surface of the first silicone resin layer to adhere the film thereto, curing the first silicone resin layer after the adhesion of the film, peeling the film from the first silicone resin layer before or after the curing of the first silicone resin layer, and removing the resist pattern after the peeling of the film.

Abstract: According to one embodiment, a measuring device for a sample liquid includes a container which stores the sample liquid, the container including a transparent or translucent optical component with an inclined surface to be brought into contact with the sample liquid, an optical sensor provided on a bottom of the container, which detects light from the sample liquid, and a measurement module which measures a concentration of a specific substance contained in the sample liquid, or a liquid height or liquid volume of the sample liquid based on a detected signal of the optical sensor.

Abstract: A wiring board of an embodiment includes a through via, a first insulating film disposed around the through via, a second insulating film disposed around the first insulating film, a third insulating film disposed around the second insulating film and a resin disposed around the third insulating film. The resin includes fillers. The second insulating film has a relative permittivity lower than a relative permittivity of the first insulating film. The third insulating film has a relative permittivity higher than a relative permittivity of the second insulating film.

Abstract: According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.

Abstract: According to one embodiment, an analysis package including an analysis chip provided on a main surface of a semiconductor substrate, the chip including a flow channel, both ends of which are open at peripheral parts of the substrate, and a microaperture which is provided in a middle of the flow channel and which allows a particle to pass therethrough, a package board on which the chip is mounted, liquid receivers provided on the package board, the liquid receivers being connected to openings, and electrodes, at least parts of which are provided on parts of bottom surfaces of the liquid receivers, the electrodes being provided at positions corresponding to an upstream side and a downstream side of the microaperture.

Abstract: According to one embodiment, an analysis package including a board including an electrical terminal, an analysis chip provided at the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid for particle detection to the detector, and a liquid receiver for introducing the sample liquid into the flow channel, a mold provided to cover the board on which the analysis chip is provided, the mold comprising an opening above the liquid receiver, a first shield layer provided on a back surface of the board, and a second shield layer provided to be attachable and detachable on an opposite side to the analysis chip of the mold, the second shield layer being electrically connected to a part of the electrical terminal.

Abstract: An antenna device of the present embodiment includes: a first conductive layer connected to a ground potential, a semiconductor device provided above the first conductive layer, a second conductive layer provided above the semiconductor device, a first via connecting the second conductive layer and the first conductive layer, a third conductive layer provided above the second conductive layer, a second via passing through the first opening, and an antenna provided above the third conductive layer. A dielectric is provided between the second conductive layer and the semiconductor device, between the third conductive layer and the second conductive layer, and between the antenna and the third conductive layer. The second conductive layer includes a first opening. The second via connects the third conductive layer and the first conductive layer.

Abstract: A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.

Abstract: A connection member according to an embodiment includes a dielectric material, a penetrating via penetrating through the dielectric material, a first metal plane provided in the dielectric material, the first metal plane being perpendicular to an extension direction of the penetrating via, the first metal plane crossing the penetrating via, and a second metal plane provided n or on the dielectric material in parallel with the extension direction of the penetrating via, the second metal plane connected to the first metal plane.

Abstract: A semiconductor device according to an embodiment includes a semiconductor chip, a cap disposed to face the semiconductor chip, and having a through-hole electrode arranged in a through hole, and a bump electrode provided between the semiconductor chip and the cap, wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through-hole electrode, and wherein at least a portion of the bump electrode is included in the through-hole electrode, and electrically connected thereto, so that the adhesive performance between the cap and the bump electrode can be increased.

Abstract: A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a bump interconnection electrode on a surface of a semiconductor chip. Further, a chip-scale package is obtained by a dicing process along a periphery of the chip.

Abstract: According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.

Abstract: According to one embodiment, an analysis package including a board including an electrical terminal, an analysis chip provided at the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid for particle detection to the detector, and a liquid receiver for introducing the sample liquid into the flow channel, a mold provided to cover the board on which the analysis chip is provided, the mold comprising an opening above the liquid receiver, a first shield layer provided on a back surface of the board, and a second shield layer provided to be attachable and detachable on an opposite side to the analysis chip of the mold, the second shield layer being electrically connected to a part of the electrical terminal.