Patents by Inventor Yutaka Shinbo

Yutaka Shinbo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic circuit system unit with wiring substrate
    Patent number: 5463249
    Abstract: In an electronic circuit system unit having a semiconductor integrated circuit unit on a wafer scale, a semiconductor wafer (a semiconductor integrated circuit unit on a wafer scale) and a print wiring substrate are laid to overlap each other and semiconductor pellets are mounted on the print wiring substrate in the overlapping area of the print wiring substrate and the semiconductor wafer. In said electronic circuit system unit, an area being a part of the periphery of the semiconductor wafer is protruded from the periphery of the print wiring substrate being placed to overlap the semiconductor wafer, and the semiconductor wafer and the print wiring substrate are electrically connected to each other in an area being a part of the protruded part through wires.
    Type: Grant
    Filed: November 24, 1992
    Date of Patent: October 31, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Yutaka Shinbo, Takeshi Kajimoto, Mitsuteru Kobayashi, Katsuyuki Sato