Patents by Inventor Yutaka Shiomi
Yutaka Shiomi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090023889Abstract: An object of the invention is to provide a process for producing an ether (co)polymer in which molecular weight control is easy and post treatment of the reaction liquid after polymerization (solvent recovery, etc.) is easy; a chain transfer agent to be used in the production process; and an ether (co) polymer obtained according to the production process. The process for producing an ether (co) polymer of the invention is characterized in that an ether monomer is polymerized in a solvent, in the presence of a catalyst comprising a condensate of an organotin compound and an alkyl phosphate, and a chain transfer agent comprising, as the major ingredient thereof, an aliphatic polyalcohol of the following general formula (I), thereby producing an ether (co)polymer. Cx(OH)yHz. In the formula, X indicates an integer of from 2 to 8; Y indicates an integer of from 2 to (2X+2); Z indicates an integer of 2X+2?Y; and the hydroxyl groups are bonded at any positions.Type: ApplicationFiled: June 1, 2006Publication date: January 22, 2009Applicant: DAISCO CO., LTD.Inventors: Kozo Misumi, Yutaka Shiomi, Shigeru Shoji, Yasushi Hamura
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Patent number: 7311799Abstract: The invention provides a hydrofluoric acid wastewater treatment method that achieves efficient recovery of hydrofluoric acid from hydrofluoric acid wastewater and also achieves sufficient reduction in the hydrofluoric acid concentration of the dehydrofluorinated water after treatment.Type: GrantFiled: November 26, 2003Date of Patent: December 25, 2007Assignees: Sasakura Engineering Co., Ltd., Sharp Kabushiki KaishaInventors: Junji Mizutani, Mitsuo Maeda, Tamito Mukaida, Yasushi Nishimura, Yutaka Shiomi, Koji Harada, Yoshio Tanimoto, Toshiaki Muratani
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Publication number: 20040104107Abstract: The invention provides a hydrofluoric acid wastewater treatment method that achieves efficient recovery of hydrofluoric acid from hydrofluoric acid wastewater and also achieves sufficient reduction in the hydrofluoric acid concentration of the dehydrofluorinated water after treatment.Type: ApplicationFiled: November 26, 2003Publication date: June 3, 2004Applicants: SASAKURA ENGINEERING CO., LTD., SHARP KABUSHIKI KAISHAInventors: Junji Mizutani, Mitsuo Maeda, Tamito Mukaida, Yasushi Nishimura, Yutaka Shiomi, Koji Harada, Yoshio Tanimoto, Toshiaki Muratani
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Patent number: 5869694Abstract: A improved process for preparing 4-hydroxy-2-pyrrolidone of the formula ##STR1## which is characterized in reacting a 4-halogeno-3-hydroxybutyrate and an alkali metal or alkaline earth metal azide, to produce a 4-azido-3-hydroxybutyrate and hydrogenating an azide group of the ester compound and then cyclizing a hydrogenated compound. 4-Hydroxy-2-pyrrolidone is useful for an intermediate of medicines and agricultural chemicals.Type: GrantFiled: November 19, 1997Date of Patent: February 9, 1999Assignee: Daiso Co., Ltd.Inventors: Yoshiro Furukawa, Yutaka Shiomi, Kenichi Nagao
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Patent number: 5780145Abstract: A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product.Type: GrantFiled: June 30, 1997Date of Patent: July 14, 1998Assignee: Sumitomo Chemical Company, LimitedInventors: Yasuhiro Hirano, Masatsugu Akiba, Yutaka Shiomi, Noriaki Saito
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Patent number: 5750789Abstract: An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.Type: GrantFiled: September 29, 1995Date of Patent: May 12, 1998Assignee: Sumitomo Chemical Company LimitedInventors: Yasuhiro Hirano, Yasuhiro Endo, Kazuo Takebe, Mitsuhiro Shibata, Shuichi Kanagawa, Yutaka Shiomi, Masatsugu Akiba, Shinichiro Kitayama
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Patent number: 5719225Abstract: A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product.Type: GrantFiled: June 7, 1995Date of Patent: February 17, 1998Assignee: Sumitomo Chemical Company, Ltd.Inventors: Yasuhiro Hirano, Masatsugu Akiba, Yutaka Shiomi, Noriaki Saito
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Patent number: 5646204Abstract: An epoxy resin composition comprising (A) an epoxy resin represented by the general formula (1) ##STR1## wherein each R.sub.1, independent of the other, represents hydrogen, a hologen atom, an alkyl group having 1 to 6 carbon atoms, substituted- or nonsubstituted-phenyl groups, and X represents ##STR2## and n represents an integer of 0 to 4, and (B) a curing agent, which composition provides a cured product exhibiting low hygroscopicity and high adhesiveness.Type: GrantFiled: September 8, 1995Date of Patent: July 8, 1997Assignee: Sumitomo Chemical Company, LimitedInventors: Masatsugu Akiba, Yutaka Shiomi, Kazuo Takebe, Noriaki Saito, Takashi Morimoto
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Patent number: 5644003Abstract: An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.Type: GrantFiled: July 18, 1995Date of Patent: July 1, 1997Assignee: Sumitomo Chemical Company, Ltd.Inventors: Noriyuki Arai, Yutaka Shiomi, Hiroshi Nakamura, Noriaki Saito
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Patent number: 5583635Abstract: The present invention provides a method of measuring particles and an apparatus for the same, which count only particles in liquid by distinguishing between the particles and bubbles in liquid. In order to fulfill the above requirements, in the present invention, liquid to be measured flows through a flow cell at a fixed flow rate, and a laser beam is irradiated thereto. Scattering light is generated when particles and bubbles pass through a laser beam irradiation region, and the scattering light is converted into a pulse signal by a photoelectric converter. In the pulse signals, a pulse signal having a pulse width of 100 .mu.S is regarded as corresponding to light scattered by a bubble, which is omitted from the number of pulse signals. Thus, only a pulse signal corresponding to light scattered by a particle in liquid can be measured.Type: GrantFiled: May 4, 1994Date of Patent: December 10, 1996Assignee: Sumitomo Chemical Company, LimitedInventors: Yasuhiro Miura, Yutaka Shiomi, Masao Morikawa, Akira Morisaki
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Patent number: 5560968Abstract: A process for encapsulating a semiconductor device involves the step(s) of encapsulating the device with an epoxy resin composites represented by the formula (2) ##STR1## in which R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.Type: GrantFiled: June 5, 1995Date of Patent: October 1, 1996Assignee: Sumitomo Chemical Company, LimitedInventors: Noriaki Saito, Takashi Morimoto, Kazuo Takebe, Yutaka Shiomi, Shigeki Naitoh, Shuichi Kanagawa
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Patent number: 5551297Abstract: A pipe clogging detecting device which incessantly monitors states of a pipe through which fluid is flowing, and when clogging occurs, immediately alarms the occurrence of clogging to operators. The device includes a plurality of containers, a pipe interconnecting the containers, a vibration sensor provided on the pipe, and a detecting device for detecting the occurrence of clogging in the pipe, based on output signals from the vibration sensor.Type: GrantFiled: December 3, 1993Date of Patent: September 3, 1996Assignee: Sumitomo Chemical Company, LimitedInventors: Yasuhiro Miura, Yutaka Shiomi, Mituaki Sunada
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Patent number: 5507975Abstract: A ferroelectric liquid crystal device having a pair of substrates each provided with voltage applying means, an orientation control layer formed on at least one of the substrates, and a layer of ferroelectric liquid crystal composition disposed between the pair of substrates, the ferroelectric liquid crystal composition comprising at least one compound (a) having an optically active group of the formula (I): ##STR1## at least one compound (b) which is reverse to the compound (a) in the direction of a helical pitch induced in a nematic phase and at least one liquid crystal compound (c) exhibiting a smectic C phase, the liquid crystal composition exhibiting at least a smectic C phase, smectic A phase and nematic phase.Type: GrantFiled: June 27, 1994Date of Patent: April 16, 1996Assignee: Sharp Kabushiki KaishaInventors: Mitsuhiro Koden, Tomoaki Kuratate, Fumiaki Funada, Kazuhiko Sakaguchi, Yutaka Shiomi, Tohru Kitamura
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Patent number: 5498687Abstract: An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.Type: GrantFiled: March 28, 1995Date of Patent: March 12, 1996Assignee: Sumitomo Chemical Company, LimitedInventors: Yasuhiro Hirano, Yasuhiro Endo, Kazuo Takebe, Mitsuhiro Shibata, Shuichi Kanagawa, Yutaka Shiomi, Masatsugu Akiba, Shinichiro Kitayama
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Patent number: 5478871Abstract: The present invention provides polyhydric phenols which are starting materials for glycidyl ether compounds which can provide cured products having low moisture absorption, high heat resistance and improved crack resistance and can be used for encapsulating semiconductor devices. The polyhydric phenols are represented by the following formula: ##STR1## wherein R.sup.1 independently represents a halogen atom, an alkyl or cycloalkyl group of 1-9 carbon atoms, an alkoxy group of 4 or less carbon atoms or an aryl group and R.sup.1 may be identical or different when l is 2 or more, R.sup.2 independently represents a halogen atom, an alkoxy group of 4 or less carbon atoms or an alkyl group of 6 or less carbon atoms and R.sup.2 may be identical or different when m is 2 or more, R.sup.Type: GrantFiled: August 8, 1994Date of Patent: December 26, 1995Assignee: Sumitomo Chemical Company, LimitedInventors: Kazuo Takebe, Takashi Morimoto, Yutaka Shiomi, Yasuhide Sugiyama, Shigeki Naitoh, Noriaki Saito, Shuichi Kanagawa, Kunimasa Kamio
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Patent number: 5462997Abstract: An epoxy resin composition contains (a) an epoxy resin represented by the general formula (2) ##STR1## wherein R.sub.1 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl and n represents an average number of repeating units of 0.1 to 1.6; and a curing agent.Type: GrantFiled: October 27, 1994Date of Patent: October 31, 1995Assignee: Sumitomo Chemical Co., Ltd.Inventors: Noriaki Saito, Takashi Morimoto, Kazuo Takebe, Yutaka Shiomi, Shigeki Naitoh, Shuichi Kanagawa
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Patent number: 5444165Abstract: An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.Type: GrantFiled: February 25, 1994Date of Patent: August 22, 1995Assignee: Sumitomo Chemical Company, LimitedInventors: Yasuhiro Hirano, Yasuhiro Endo, Kazuo Takebe, Mitsuhiro Shibata, Shuichi Kanagawa, Yutaka Shiomi, Masatsugu Akiba, Shinichiro Kitayama
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Patent number: 5395912Abstract: There is provided an epoxy resin composition represented by the general formula: ##STR1## wherein R.sub.1 represents an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, R.sub.2 to R.sub.4 independently represent hydrogen, an alkyl or cycloalkyl group having 1 to 9 carbon atoms, or halogen, and X represents hydrogen, an alkyl group having 1 to 9 carbon atoms, or an aryl group, and n represents an average number of repeating units of 0.1 to 1.6. Cured products prepared from the epoxy resin have a lower hygroscopicity and a balance between thermal resistance and curing performance.Type: GrantFiled: November 22, 1993Date of Patent: March 7, 1995Assignee: Sumitomo Chemical Company, LimitedInventors: Noriaki Saito, Takashi Morimoto, Kazuo Takebe, Yutaka Shiomi, Shigeki Naitoh, Shuichi Kanagawa
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Patent number: 5374373Abstract: A ferroelectric liquid crystal device having a pair of substrates each provided with voltage application means, an orientation control layer formed on at least one of the substrates, and a layer of ferroelectric liquid crystal composition formed between the pair of substrates, the device being characterized in that the ferroelectric liquid crystal composition comprises at least one compound (a) having an optically active group of the formula (I): ##STR1## and at least one compound (b) which is reverse to the compound (a) in the direction of a helical pitch induced in a nematic phase, the liquid crystal composition exhibiting at least a smectic C phase, smectic A phase and nematic phase at least 20 .mu.m in helical pitch.Type: GrantFiled: May 5, 1993Date of Patent: December 20, 1994Assignees: Sharp Kabushiki Kaisha, Daiso Co., Ltd.Inventors: Mitsuhiro Koden, Tomoaki Kuratate, Fumiaki Funada, Kazuhiko Sakaguchi, Yoshikazu Takehira, Yutaka Shiomi, Tohru Kitamura
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Patent number: 5326881Abstract: An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.Type: GrantFiled: October 28, 1993Date of Patent: July 5, 1994Assignee: Sumitomo Chemical Company Ltd.Inventors: Yasuhiro Hirano, Yasuhiro Endo, Kazuo Takebe, Mitsuhiro Shibata, Shuichi Kanagawa, Yutaka Shiomi, Masatsugu Akiba, Shinichiro Kitayama