Patents by Inventor Yutaka Takashima
Yutaka Takashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10809859Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.Type: GrantFiled: September 12, 2018Date of Patent: October 20, 2020Assignee: Alps Alpine Co., Ltd.Inventors: Hideto Sasagawa, Takashi Asakawa, Takefumi Osaka, Yutaka Takashima
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Publication number: 20200079053Abstract: A touch panel is configured such that a plastic cover and a film sensor are laminated so that the resin flowing direction of the plastic cover and the resin flowing direction of the film sensor are not parallel to each other in plan view in the laminating direction. The touch panel is prevented from being degraded in design and becoming nonuniform in sensitivity because of the occurrence of warping, thereby maintaining its appearance and function well under a high-temperature environment.Type: ApplicationFiled: November 13, 2019Publication date: March 12, 2020Inventors: Hideto SASAGAWA, Takashi ASAKAWA, Takefumi OSAKA, Yutaka TAKASHIMA
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Publication number: 20190025961Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.Type: ApplicationFiled: September 12, 2018Publication date: January 24, 2019Inventors: Hideto SASAGAWA, Takashi ASAKAWA, Takefumi OSAKA, Yutaka TAKASHIMA
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Patent number: 8567255Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.Type: GrantFiled: May 17, 2011Date of Patent: October 29, 2013Assignee: Alps Electric Co., Ltd.Inventors: Daigo Aoki, Hideyuki Hashimoto, Tetsuya Kobayashi, Kunio Koizumi, Yoshiaki Shimizu, Yutaka Takashima, Shinya Yokoyama
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Patent number: 8314444Abstract: A piezoresistive pressure sensor is provided, which can prevent the occurrence of ESD breakdown due to the nearness of interconnection layers of a resistive element according to miniaturization thereof. The piezoresistive pressure sensor is so configured that respective semiconductor resistive layers on both sides of an arrangement are formed to be relatively longer than an adjacent semiconductor resistive layer, and thus a corner portion of a semiconductor connection layer that extends from the respective semiconductor resistive layers on both sides of the arrangement and a corner portion of the semiconductor interconnection layer that is nearest to the corner portion of the semiconductor connection layer, between which the ESD breakdown occurs easily, can be separated from each other.Type: GrantFiled: July 5, 2011Date of Patent: November 20, 2012Assignee: Alps Electric Co., Ltd.Inventors: Shinya Yokoyama, Daigo Aoki, Yutaka Takashima
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Publication number: 20110260269Abstract: A piezoresistive pressure sensor is provided, which can prevent the occurrence of ESD breakdown due to the nearness of interconnection layers of a resistive element according to miniaturization thereof. The piezoresistive pressure sensor is so configured that respective semiconductor resistive layers on both sides of an arrangement are formed to be relatively longer than an adjacent semiconductor resistive layer, and thus a corner portion of a semiconductor connection layer that extends from the respective semiconductor resistive layers on both sides of the arrangement and a corner portion of the semiconductor interconnection layer that is nearest to the corner portion of the semiconductor connection layer, between which the ESD breakdown occurs easily, can be separated from each other.Type: ApplicationFiled: July 5, 2011Publication date: October 27, 2011Inventors: Shinya Yokoyama, Daigo Aoki, Yutaka Takashima
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Publication number: 20110214505Abstract: There is provided a semiconductor pressure sensor which improves the sensor sensitivity and is excellent in the withstand pressure characteristic and the temperature characteristic. In the semiconductor pressure sensor in which a diaphragm is formed by a cavity provided on one of top and bottom surfaces of a silicon substrate and a plurality of piezoresistors is disposed in the diaphragm edge, a recess which has a larger area than the planar shape of the diaphragm and whose entire edge is located outward from the diaphragm edge in plan view is provided in a protective film which covers the entire surface of the silicon substrate on the diaphragm side. The protective film located on the diaphragm is preferably formed of SiO2.Type: ApplicationFiled: May 17, 2011Publication date: September 8, 2011Inventors: Daigo Aoki, Hideyuki Hashimoto, Tetsuya Kobayashi, Kunio Koizumi, Yoshiaki Shimizu, Yutaka Takashima, Shinya Yokoyama
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Patent number: 5548827Abstract: A portable radio communication device has an antenna which can be extended for use and retracted for storage, and can transmit a signal at the same level of electric energy when the antenna is stored as when the antenna is extended. When the antenna is retracted and stored, the stored condition is detected by a detecting switch. In response to a detected signal from the detecting switch, a transmission output controller produces an increased transmission output control signal to increase the level of electric energy of the signal to be transmitted which is higher than a normal level of electric energy of signals transmitted from the antenna. When the increased transmission output control signal is generated, a power amplifier amplifies a signal to be transmitted which is supplied from a transmission signal generator, and supplies the amplified signal to the antenna. Therefore, even when the antenna is stored, it can radiate the signal at the same level of electric energy as when the antenna is extended.Type: GrantFiled: February 15, 1994Date of Patent: August 20, 1996Assignee: Fujitsu LimitedInventors: Tetsuya Hanawa, Yuji Kuga, Yutaka Takashima, Yoshihiro Matsumoto, Masayuki Ono
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Patent number: 5478072Abstract: A racket string consists of lengthwise sections having different tensile elastic moduli with at least one section of the string having a tensile elastic modulus higher than other sections. A stringed racket includes at least one string constituting the central stringed area of the racket with higher tensile elastic modulus, and a peripheral stringed area with sections of the string having lower tensile elastic modulus. Another stringed racket includes at least one string constituting the central stringed area of the racket with lower tensile elastic modulus and a peripheral stringed area with sections of the string having higher tensile elastic modulus.Type: GrantFiled: August 9, 1994Date of Patent: December 26, 1995Assignee: Gosen Co., Ltd.Inventors: Katsuo Kanno, Yutaka Takashima
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Patent number: 5145172Abstract: The invention deals with a string for use in rackets used for tennis and badminton and so on. These are wound around the periphery of a monofilament center core in a mixed condition, wrapping monofilaments of a large diameter and a small diameter and the wrapping monofilaments are covered with a coating resin such that a part in a periphery side of the large diameter wrapping monofilament is uncovered. Moreover, the elongation of the wrapping monofilaments of large diameter and small diameter is greater by 5-40% than the elongation of monofilament center core. This string is superior in ball control and has a higher knot strength.Type: GrantFiled: May 5, 1989Date of Patent: September 8, 1992Assignee: Gosen Co., Ltd.Inventor: Yutaka Takashima
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Patent number: 4878799Abstract: A plurality of magazines each of which contains a plurality of film sheets of a type different from those contained in the other magazines are accommodated in movable trays. These movable trays are disposed within an elevator in such a manner as to be movable with respect to the elevator from a retracted position to a film unloading position. Each of the movable trays has a hook. When the elevator is moved to a desired position, an insert member such as a rod enters the hook located at that position so as to move the tray to the film unloading position at which the film sheet is taken out of the magazine.Type: GrantFiled: January 7, 1988Date of Patent: November 7, 1989Assignee: Fuji Photo Film Co., Ltd.Inventors: Izumi Seto, Mikio Tsuyuki, Yutaka Takashima
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Patent number: 4811546Abstract: A film cassette opener for unloading a film from, and/or loading the film in, a film cassette capable of accommodating the film. A pair of elongated members are disposed parallel to each other on the opposite sides of a path which enables the film cassette received by the film cassette opener to be moved to a position at which the film can be loaded and/or unloaded. The pair of elongated members are arranged to guide the film cassette along the path by holding opposite sides of the film cassette between them. Also, the present opener is arranged so as to press and move at least one of the elongated members which hold the film cassette therebetween toward the other. Accordingly, since the film cassette is firmly held, it is possible to positively move the film cassette.Type: GrantFiled: March 10, 1988Date of Patent: March 14, 1989Assignee: Fuji Photo Film Co., Ltd.Inventors: Yutaka Takashima, Mikio Tsuyuki, Izumi Seto
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Patent number: 4700383Abstract: A lock-releasing apparatus for use in a telepone set, having a lock-releasing button (61) for a locking mechanism which locks a handset (41) stationarily to a cradle (42). The lock releasing button also actuates a muting switch (71).Type: GrantFiled: March 14, 1986Date of Patent: October 13, 1987Assignee: Fujitsu LimitedInventors: Hisamitsu Takagi, Tetsuya Hanawa, Akihide Nishiyama, Yutaka Takashima