Patents by Inventor Yutaka Takezawa
Yutaka Takezawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240034927Abstract: The present invention provides a resin composition which emits near-infrared fluorescence, has high light-emitting efficiency, and can be relatively easily produced, and a molded object obtained from the resin composition. More specifically, the present invention provides a resin composition containing a near-infrared fluorescent material (A), a thermoplastic resin (B) other than a polyamide resin, and a resin (C) different from the thermoplastic resin (B), in which the resin (C) forms a continuous phase, and a dispersed phase containing the near-infrared fluorescent material (A) and the thermoplastic resin (B) is formed in the continuous phase.Type: ApplicationFiled: September 9, 2021Publication date: February 1, 2024Applicant: DIC CorporationInventors: Yutaka Takezawa, Naoto Sakurai, Kyouichi Toyomura
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Patent number: 11582868Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.Type: GrantFiled: October 2, 2020Date of Patent: February 14, 2023Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
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Publication number: 20230045234Abstract: The invention provides a thermoplastic resin composition, a molded article, and production methods therefor. The thermoplastic resin composition can sufficiently exhibit a cellulose addition effect and impart excellent mechanical strength to the molded article, particularly a foam molded article. More specifically, the invention provides a resin composition and a foam molded article thereof. The resin composition contains: a cellulose fiber (A); an amorphous resin (B) having a glass transition temperature of 160° C. or lower; a crystalline resin (C) having a melting point (melting peak temperature) of 80° C. to 150° C. and a melting start temperature lower than the melting point by 30° C. or more; and a thermoplastic resin (D) having a melting point or a glass transition temperature higher than the melting point of the crystalline resin (C) by 5° C. or more.Type: ApplicationFiled: December 17, 2020Publication date: February 9, 2023Applicant: DIC CorporationInventors: Toshiki Kimura, Yutaka Takezawa, Hironobu Takizawa
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Publication number: 20220195133Abstract: To provide a resin composition that allows the effect of cellulose fibers added to be exerted sufficiently and allows a molded body having good mechanical strength to be produced, a method for producing the resin composition, a cellulose fiber composition, and a molded article using the resin composition. The resin composition of the present invention contains: an olefin-based polymer (A); cellulose fibers (B); an amide compound (C) having at least one hydrocarbon group; and an acrylic-based polymer (D) that contains a first structural unit based on an alkyl (meth)acrylate and a second structural unit based on an acrylic monomer having an amido group and has a weight average molecular weight of 5,000 to 100,000.Type: ApplicationFiled: April 23, 2020Publication date: June 23, 2022Applicants: DIC Corporation, SEIKO PMC CORPORATIONInventors: Hironobu TAKIZAWA, Yoko TAKEUCHI, Yutaka TAKEZAWA, Ryuzaburo NAKAGIRI, Yuya TERAO
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Patent number: 11310909Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.Type: GrantFiled: July 17, 2020Date of Patent: April 19, 2022Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
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Patent number: 11301104Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.Type: GrantFiled: April 26, 2021Date of Patent: April 12, 2022Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi Sakaue, Yutaka Takezawa
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Patent number: 11093095Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.Type: GrantFiled: November 20, 2019Date of Patent: August 17, 2021Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi Sakaue, Yutaka Takezawa
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Publication number: 20210240306Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.Type: ApplicationFiled: April 26, 2021Publication date: August 5, 2021Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi SAKAUE, Yutaka TAKEZAWA
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Patent number: 10998609Abstract: This loop antenna is provided with: an insulating substrate; an antenna portion that is a conductor provided on the substrate and includes a first feeding portion, a second feeding portion, and an antenna mesh portion having a mesh structure and forming a loop shape by connecting the two feeding portions to each other; and a dummy pattern part portion that is a conductor having a mesh structure and provided in a region surrounded by the antenna portion, and is isolated from the antenna portion. The dummy pattern portion has at least one cut portion that cuts a path included in the mesh structure.Type: GrantFiled: January 23, 2018Date of Patent: May 4, 2021Assignee: Japan Aviation Electronics Industry, LimitedInventors: Kenta Tsuchiya, Osamu Hirata, Daisuke Hiraoka, Mitsunori Sato, Yutaka Takezawa, Yutaro Kogawa
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Publication number: 20210022242Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.Type: ApplicationFiled: October 2, 2020Publication date: January 21, 2021Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro KOGAWA, Mitsunori SATO, Yutaka TAKEZAWA, Akitoshi SAKAUE, Mitsutoshi NAITO
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Patent number: 10834815Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape in which line segments are connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.Type: GrantFiled: November 29, 2016Date of Patent: November 10, 2020Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
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Publication number: 20200352027Abstract: A printed wiring line formed on a substrate connects two different points on the substrate which are connectable by another printed wiring line with a shape of a straight-line segment and has a shape corresponding to at least one of: 1) a shape with no linear part parallel to the straight-line segment; 2) a shape with line segments connected in series, each line segment having a shape with no linear part parallel to the straight-line segment; 3) a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment, length of the part parallel to the straight-line segment being not more than length of the straight-line segment; and 4) a shape in which line segments are connected in series, each line segment having a shape having a part parallel to the straight-line segment and a part not parallel to the straight-line segment.Type: ApplicationFiled: July 17, 2020Publication date: November 5, 2020Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro KOGAWA, Mitsunori SATO, Yutaka TAKEZAWA, Akitoshi SAKAUE, Mitsutoshi NAITO
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Patent number: 10725603Abstract: A method for manufacturing a touch panel having a sensing area that includes a conductive part made up of thin-line mesh includes a step of designing the thin-line mesh, the thin-line mesh including a plurality of intersections, wherein the intersection forms therearound an acute angular area and an obtuse angular area, the acute angular area being defined between a pair of adjacently converging thin lines that forms an acute angle therebetween, the obtuse angular area being defined between a pair of adjacently converging thin lines that forms an obtuse angle therebetween, a step of filling electrically conductive ink into a printing plate by a squeezing process using a doctor blade, the printing plate having a groove pattern that conforms with the thin-line mesh, and a step of forming the conductive part by printing, in which the electrically conductive ink is transferred to a surface of a base member.Type: GrantFiled: October 29, 2018Date of Patent: July 28, 2020Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi Sakaue, Kenji Matsumoto, Yutaka Takezawa, Yuta Hasegawa
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Publication number: 20200210023Abstract: A wiring structure that includes first wiring parts which are formed of conductive wires and second wiring parts which are formed of thicker conductive wires than the conductive wires of the first wiring parts and are connected to the first wiring parts is formed by offset printing which includes the following processes. First printing process: First conductive ink for forming the first wiring parts is transferred from a first blanket to a base. Second printing process: Second conductive ink for forming the second wiring parts is transferred from a second blanket, which is different from the first blanket, to the base.Type: ApplicationFiled: November 20, 2019Publication date: July 2, 2020Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi SAKAUE, Yutaka TAKEZAWA
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Publication number: 20200203830Abstract: This loop antenna is provided with: an insulating substrate; an antenna portion that is a conductor provided on the substrate and includes a first feeding portion, a second feeding portion, and an antenna mesh portion having a mesh structure and forming a loop shape by connecting the two feeding portions to each other; and a dummy pattern part portion that is a conductor having a mesh structure and provided in a region surrounded by the antenna portion, and is isolated from the antenna portion. The dummy pattern portion has at least one cut portion that cuts a path included in the mesh structure.Type: ApplicationFiled: January 23, 2018Publication date: June 25, 2020Applicant: Japan Aviation Electronics Industry, LimitedInventors: Kenta TSUCHIYA, Osamu HIRATA, Daisuke HIRAOKA, Mitsunori SATO, Yutaka TAKEZAWA, Yutaro KOGAWA
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Patent number: 10675902Abstract: A method of forming an insulator film by flexographic printing is provided with which an insulator film is formed on a printing object by using ink as an insulator film material and a flexographic printing plate with halftone dots convexly formed on a convex portion thereof that defines a printing pattern. A halftone dot condition change region with a condition of the halftone dots varied such that an ink retention volume therein is smaller than that in other region on the convex portion is provided on a part of the convex portion corresponding to an edge of the printing pattern.Type: GrantFiled: August 25, 2016Date of Patent: June 9, 2020Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi Sakaue, Naoki Iwao, Mitsunori Sato, Yutaka Takezawa, Yutaro Kogawa, Mitsutoshi Naito
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Patent number: 10499513Abstract: By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline.Type: GrantFiled: May 29, 2018Date of Patent: December 3, 2019Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
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Patent number: 10492307Abstract: By flexographic printing or inkjet printing, insulating ink is applied on a wiring pattern in accordance with a predetermined printing pattern. The insulating ink is hardened, whereby an insulating layer is formed. A contact region of the wiring pattern that is used for electrical connection with a conductor other than the wiring pattern is not covered with the insulating layer. The printing pattern is delimited by the outline of a non-printing region including the contact region. The wiring pattern includes, in the non-printing region, a trunk wiring line leading, to the contact region, from a position on the wiring pattern at which the wiring pattern overlaps with the outline and a branch wiring line extending from a point on at least one side of the trunk wiring line and terminating without making contact with the outline.Type: GrantFiled: January 3, 2018Date of Patent: November 26, 2019Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Yutaro Kogawa, Mitsunori Sato, Yutaka Takezawa, Akitoshi Sakaue, Mitsutoshi Naito
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Publication number: 20190138137Abstract: A method for manufacturing a touch panel having a sensing area that includes a conductive part made up of thin-line mesh includes a step of designing the thin-line mesh, the thin-line mesh including a plurality of intersections, wherein the intersection forms therearound an acute angular area and an obtuse angular area, the acute angular area being defined between a pair of adjacently converging thin lines that forms an acute angle therebetween, the obtuse angular area being defined between a pair of adjacently converging thin lines that forms an obtuse angle therebetween, a step of filling electrically conductive ink into a printing plate by a squeezing process using a doctor blade, the printing plate having a groove pattern that conforms with the thin-line mesh, and a step of forming the conductive part by printing, in which the electrically conductive ink is transferred to a surface of a base member.Type: ApplicationFiled: October 29, 2018Publication date: May 9, 2019Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi SAKAUE, Kenji MATSUMOTO, Yutaka TAKEZAWA, Yuta HASEGAWA
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Publication number: 20190073050Abstract: In a touch sensor device comprising at least a printed wiring board with a wiring pattern made of cured conductive ink containing conductive particles formed on a transparent substrate, and a front cover having a plate surface parallel to the printed wiring board and configured with a transparent dielectric, one face of the front cover being a contact input surface, the whole of the wiring pattern formed in an area seen through the contact input surface on the substrate is formed on one face of the substrate on a side opposite to a side where the front cover is located.Type: ApplicationFiled: July 31, 2018Publication date: March 7, 2019Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITEDInventors: Akitoshi SAKAUE, Mitsunori SATO, Yutaka TAKEZAWA, Kenji MATSUMOTO, Mitsutoshi NAITO