Abstract: An IC socket includes a socket body, a cover having a cam surface and capable of moving vertically, and resilient contact pins provided in the socket body, each having an engaging portion which is capable of engaging the cam surface and a contact portion which is capable of contacting each of lead terminals of an IC package. Each contact pin is provided with a resiliently forced pin having an engagement working portion which can engage the cam surface and can also engage the engaging portion. When the cover is depressed, the engagement working portion is moved outwardly, against its resilience, because of engagement with the cam surface. Conversely, when the cover is not pressed, the engagement working portion resiliently engages the engaging portion and forcedly presses the contact portion inwardly. Thus, the IC socket can securely remove oxidation films with which the surfaces of lead terminals of the IC package are covered, with a resultant good electrical connection.