Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: An image reading device includes a mount table in which a mount surface is formed, a guide portion in which a guide surface is formed, the guide surface facing a side end face of a first portion of a booklet medium that is mounted on the mount table such that the mount surface faces the booklet medium, and an image capturer configured to capture an image of a second portion of the booklet medium, the second portion being different from the first portion, wherein a front cover slit is formed at an end of the guide portion on a side close to the mount surface.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: An optical sensor module comprises a substrate, a photodetector which detects light and is fixed to the substrate and a lens holding member, to which a lens is fixed, which is fixed to the substrate at a position surrounding the photodetector, and the lens is fixed in the state in which an outer circumference of the lens is covered by a material itself of the lens holding member, and a part of an outer edge of the lens is exposed at a side of an outer surface of the lens holding member or at a side of an inner surface of the lens holding member.

Abstract: This optical sensor module includes: a substrate having an electrode pattern formed on a surface thereof; a photodetector for detecting light, the photodetector being electrically connected to the electrode pattern and being fixed to the substrate; and a lens holding member to which a lens is fixed, the lens holding member being adhered to the substrate by an adhesive agent at such a position as to surround the photodetector, wherein a bottom surface of the lens holding member adhered to the substrate has projections located in a distributed manner, and distal ends of the projections are in contact with the substrate.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.

Abstract: A sensor module comprising: A sensor chip (5) is provided on an upper surface of the substrate (1). A lens (7) is provided above the sensor chip (5) such that a light receiving unit of the sensor chip (5) is positioned in a projection area. A lens cap (8) includes a cap body (8a) surrounding the sensor chip (5) to hold the lens (7), and a cap edge part (8b) protruding outward from a lower end part of the cap body (8a). An ultraviolet-curing type bonding agent (9) bonds the upper surface of the substrate (1) and a lower surface of the lens cap (8). A cutout (10) is provided on an outer side surface of the cap edge part (8b). The bonding agent (9) enters in the cutout (10).

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing, section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-convert d are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: A optical module according to the present invention includes an optical semiconductor device, a package housing the optical semiconductor device, a first pattern provided on an upper surface of the package, a second pattern provided on a side surface continuous with the upper surface of the package, a flexible substrate provided on the first pattern and extending from the upper surface to a side surface side of the package and solder joining the first pattern and the flexible substrate together, wherein the solder is spread between a portion of the flexible substrate, the portion extending from the upper surface to the side surface side of the package, and the second pattern.

Abstract: A semiconductor module includes a sub-mount having a front surface, a back surface, side surfaces connecting the front surface and the back surface, a semiconductor element soldered onto the front surface of the sub-mount, and a block soldered onto the back surface of the sub-mount. The semiconductor element protrudes outward beyond a first side surface of the sub-mount, a concave portion is formed on each of a second side surface and a third side surface of the sub-mount perpendicular to the first side surface, the concave portion extending from the front surface of the sub-mount toward the back surface of the sub-mount, and the concave portion is disposed to allow a projection of a collet to be held in the concave portion with the front surface of the sub-mount held by suction by the collet.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing, section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-convert d are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: The invention provides a bactericidal/algicidal method including adding an oxidant-based bactericidal/algicidal agent and a stabilizer therefor to a target water system, characterized in that the amount of combined chlorine or the stabilizer in the water system is controlled by generating free residual chlorine in the water system, and a bactericidal/algicidal method including adding an oxidant-based bactericidal/algicidal agent and a stabilizer therefor to a target water system, characterized in that the amount of the oxidant-based bactericidal/algicidal agent added is controlled so that the concentration of total residual chlorine in the water system falls within a predetermined range, and the amount of combined chlorine or the stabilizer is controlled so that the concentration of free residual chlorine in the water system falls within a predetermined range.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: In a high speed image capturing state, a camera signal processing circuit is not needed to perform a signal process at a high screen rate, but at a regular screen rate. In the high speed image capturing mode, raw data of 240 fps received from an image sensor 101 are recorded on a recording device 111 through a conversion processing section 201 and a recording device controlling circuit 210. Raw data that have been decimated and size-converted are supplied to a camera signal processing circuit 203 through a pre-processing circuit 202 and an image being captured is displayed on a display section 112 with a signal for which a camera process has been performed.

Abstract: A semiconductor device includes: a semiconductor element; a conductor pattern provided on an insulating substrate and having a main surface to which the semiconductor element is joined; and a terminal electrode joined to the main surface of the conductor pattern by a hard solder material and electrically connected to the semiconductor element. A joining region joined to the hard solder material in the conductor pattern includes: a first region in which the terminal electrode exists in a plan view; and a second region located outside the first region and not overlapping with the terminal electrode. The conductor pattern on the insulating substrate and the terminal electrode can be firmly joined by the hard solder material.

Abstract: An object of the invention is to provide: a manufacturing method for a highly reliable power semiconductor device which prevents breakage of an conductor pattern and an insulating layer, and has bonding strength higher than that by the conventional bonding between the electrode terminal and the conductor pattern; and that power semiconductor device. Breakage of the conductor pattern and the insulating layer is prevented due to inclusion of: a step of laying an electrode terminal on a protrusion provided on a conductor pattern placed on a circuit-face side of a ceramic board so that a center portion of a surface to be bonded of the electrode terminal makes contact with a head portion of the protrusion; a step of pressurizing and ultrasonically vibrating a surface opposite to the surface to be bonded, of the electrode terminal, using an ultrasonic horn, to thereby bond the electrode terminal to the conductor pattern.